EP3C55F780C6

The EP3C55F780C6 is an Intel Cyclone III family FPGA offered in a 780‑FBGA (29×29) surface‑mount package. It provides a mid-range combination of programmable logic, embedded memory, and high I/O count suited for cost‑ and power‑sensitive designs.

Built on the Cyclone III device family architecture, the device emphasizes low power operation and system integration—addressing portable, high‑volume, and I/O‑constrained applications that benefit from programmable logic and on‑chip resources.

Key Features

• Logic Capacity  55,856 logic elements for implementing complex combinational and sequential logic functions on a single device.
• Embedded Memory  Approximately 2.4 Mbits of on‑chip RAM to support buffering, lookup tables, and on‑chip data storage.
• High I/O Count  377 user I/O pins to interface with sensors, peripherals, and high‑pin-count board designs.
• Low‑Voltage Core  Core supply range of 1.15 V to 1.25 V to match Cyclone III family power domains.
• Commercial Temperature Grade  Operating temperature range of 0 °C to 85 °C suited for standard commercial applications.
• Package  780‑FBGA (29×29) surface‑mount package (listed as 780‑BGA) for compact board integration.
• Family‑Level Power and Integration  Cyclone III family design emphasizes low power through TSMC low‑power process technology and power‑aware design flow.
• Clock Management  Cyclone III family includes multiple phase‑locked loops (PLLs) for flexible clock generation and distribution (family feature).
• RoHS Compliant  Device meets RoHS environmental requirements.

Typical Applications

• Portable and Handheld Devices  Low‑power Cyclone III technology supports extended battery life and thermally constrained designs.
• I/O‑Intensive Interfaces  High I/O count enables complex sensor, display, or peripheral interfacing in mid‑range systems.
• Embedded Control and Signal Processing  On‑chip memory and plentiful logic elements allow implementation of custom control, protocol glue logic, and local signal processing.
• High‑Volume, Cost‑Sensitive Products  Mid‑range logic density and Cyclone III family optimizations target applications where cost and power are primary considerations.

Unique Advantages

• Balanced Logic and Memory: Combines 55,856 logic elements with approximately 2.4 Mbits of embedded memory to consolidate digital functions on a single device and reduce external components.
• High I/O Integration: 377 user I/Os enable direct connection to a wide range of peripherals and interfaces, simplifying board routing and design partitioning.
• Low‑Power Technology: Cyclone III family low‑power process and power‑aware design support lower static power for battery‑operated and thermally constrained systems.
• Compact, Surface‑Mount Package: 780‑FBGA (29×29) package fits high‑density boards while maintaining robust solderable footprint for automated assembly.
• Commercial Temperature Range: Rated 0 °C to 85 °C for use in standard commercial electronics environments.
• Compliance and Ecosystem: RoHS compliance plus Cyclone III family documentation and pre‑verified IP support design integration and lifecycle management.

Why Choose EP3C55F780C6?

The EP3C55F780C6 positions itself as a mid‑range Cyclone III FPGA that balances programmable logic density, embedded memory, and extensive I/O in a compact 780‑FBGA package. Its low‑voltage core and family‑level low‑power characteristics make it suitable for designs where power, integration, and cost efficiency are important.

This device is well suited to engineers developing commercial‑grade products requiring a mix of logic, on‑chip memory, and abundant I/O, and benefits from the Cyclone III family resources and verified IP available in the device handbook and design flow.

Request a quote or submit an inquiry to receive pricing and availability for EP3C55F780C6 and begin integrating this Cyclone III FPGA into your next design.