EP3C55F780C8

The EP3C55F780C8 is an Intel Cyclone® III field programmable gate array (FPGA) in a 780-ball BGA package designed for commercial-grade, surface-mount applications. As a member of the Cyclone III device family, it targets high-volume, low-power, cost-sensitive designs while delivering significant on-chip logic, memory, and I/O resources.

With 55,856 logic elements, approximately 2.4 Mbits of embedded memory, and 377 user I/Os, this device supports complex system integration, clock management, and I/O-centric applications within a compact 29×29 mm 780-FBGA footprint.

Key Features

• Logic Capacity — 55,856 logic elements for implementing medium-to-high complexity digital logic and system functions.
• Embedded Memory — Approximately 2.4 Mbits (2,396,160 bits) of on-chip RAM to support buffers, FIFOs, and local data storage.
• I/O and Package — 377 user I/Os in a 780-ball FBGA (29×29 mm) package, providing broad connectivity in a compact surface-mount form factor.
• Power Supply — Core supply specified between 1.15 V and 1.25 V to match low-voltage system domains.
• Operating Range — Commercial temperature grade with an operating range from 0 °C to 85 °C.
• System Integration — Cyclone III family features such as multiple PLLs and a high memory-to-logic ratio support clock management and integrated system functions.
• Low-Power Family Attributes — Based on the Cyclone III family design emphasis on low power, offering suitability for power-sensitive, high-volume applications.
• Standards and Compatibility — Family-level support for a wide range of I/O standards and on-chip features (as documented in the Cyclone III device handbook) to aid interface flexibility.
• Regulatory — RoHS compliant.

Typical Applications

• Portable and Handheld Devices — Low-power family characteristics and compact packaging help extend battery life and reduce system size in portable designs.
• High-Density I/O Systems — High I/O count supports sensor aggregation, interface bridging, and complex peripheral connectivity.
• Embedded Processing and Control — On-chip memory and logic capacity support embedded control functions and soft-processor implementations.
• Clock and Interface Management — Multiple PLLs and programmable logic are suited for clock synthesis, domain crossing, and I/O timing control.

Unique Advantages

• High Logic Density: 55,856 logic elements enable implementation of substantial custom logic and processing functions on a single device.
• Substantial On-Chip Memory: Approximately 2.4 Mbits of embedded RAM reduces dependence on external memory for buffering and local data storage.
• Extensive I/O in a Compact Package: 377 user I/Os in a 780-FBGA (29×29 mm) package allow dense connectivity while conserving PCB area.
• Low-Voltage Core: 1.15–1.25 V supply supports integration into modern low-voltage system power architectures.
• Commercial Temperature Grade: Rated 0 °C to 85 °C for a wide range of standard commercial applications.
• RoHS Compliant: Conforms to environmental regulations for lead-free assembly.

Why Choose EP3C55F780C8?

The EP3C55F780C8 combines substantial logic and memory resources with a high I/O count in a compact 780-FBGA package, making it suitable for designers targeting cost-sensitive, low-power, and high-volume systems. As part of the Cyclone III family, it benefits from device-level features that emphasize low power, integrated clock management, and a broad ecosystem of family-level IP and design resources.

This device is well suited for teams building embedded control, interface, and I/O-intensive applications that require scalable performance within the Cyclone III family and the integration advantages of on-chip memory and programmable logic.

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