EP3C55F780I7N

The EP3C55F780I7N is an Intel Cyclone III family FPGA offering a balance of high functionality and low power for cost- and power-sensitive designs. Built on the Cyclone III architecture, this device delivers a substantial logic capacity alongside embedded memory and a high I/O count, making it suitable for industrial applications that require compact, reconfigurable logic.

Targeted at high-volume, low-power, and cost-sensitive markets, the FPGA combines on-chip resources and system features from the Cyclone III family to simplify integration of custom logic, memory, and interface functions in a single device.

Key Features

• Logic Capacity — 55,856 logic elements for implementing complex digital functions and custom accelerators.
• Embedded Memory — Approximately 2.396 Mbits of on-chip RAM to support buffering, state storage, and embedded data structures.
• I/O — 377 user I/O pins to connect a wide range of external peripherals and interfaces.
• Power Supply — Low-voltage core operation from 1.15 V to 1.25 V to support low-power system designs.
• Clock Management — Cyclone III family includes up to four PLLs per device for flexible clock synthesis and management.
• I/O Standards and Signal Integrity — Cyclone III family supports multiple I/O standards and adjustable slew rates to help meet signal-integrity needs across interfaces.
• Package & Mounting — 780-ball BGA (780-FBGA, 29×29) in a surface-mount form factor for dense PCB integration.
• Industrial Grade — Specified operating temperature range of −40 °C to 100 °C suitable for industrial environments.
• Regulatory — RoHS compliant.

Typical Applications

• Industrial Control — Implement motor control, deterministic I/O aggregation, and custom sequencing logic using the device’s ample logic and I/O resources.
• Communications & Networking — Use on-chip RAM and PLL-based clock management for data buffering, protocol bridging, and interface bridging tasks.
• Embedded Systems — Integrate custom processing logic and peripherals; Cyclone III family support for Nios II and pre-built IP can accelerate embedded design flows.
• High-volume Consumer or Portable Electronics — Low-power characteristics and compact BGA package make the device suitable for cost- and power-sensitive product lines.

Unique Advantages

• High logic density: 55,856 logic elements provide headroom for complex state machines, datapaths, and custom accelerators, reducing the need for multiple devices.
• Integrated on-chip memory: Approximately 2.396 Mbits of embedded RAM reduces external memory dependencies and simplifies board-level design.
• Extensive I/O: 377 user I/Os enable direct interfacing to sensors, buses, and peripherals, minimizing external interface components.
• Low-voltage core operation: 1.15 V–1.25 V supply range supports reduced power consumption in system designs.
• Industrial temperature range: −40 °C to 100 °C rating supports deployment in thermally demanding environments.
• Compact BGA package: 780-FBGA (29×29) surface-mount package enables high-density PCB layouts for space-constrained applications.

Why Choose EP3C55F780I7N?

The EP3C55F780I7N combines substantial logic capacity, embedded memory, and a high I/O count within a low-voltage, industrial-temperature FPGA package. It is well suited to engineers seeking a single-chip solution to consolidate interfaces, custom logic, and buffering in industrial and cost-sensitive products.

Supported by Cyclone III family architecture and associated design flows and IP, this device offers a practical balance of integration, power efficiency, and system-level features that help reduce BOM and simplify board design while meeting industrial environmental requirements.

Request a quote or submit a pricing and availability inquiry to evaluate the EP3C55F780I7N for your next design.