EP3C55F780I7

The EP3C55F780I7 is an Intel Cyclone® III family FPGA optimized for low-power, high-functionality applications. As part of the Cyclone III device family, it targets high-volume, cost-sensitive designs that require a balance of logic capacity, embedded memory, and flexible I/O.

This device provides 55,856 logic elements, approximately 2.396 Mbits of embedded memory, and 377 user I/O in a 780-ball FBGA (29 × 29) surface-mount package, making it suitable for industrial systems that require extended temperature operation and RoHS compliance.

Key Features

• Core Logic — 55,856 logic elements and 3,491 LABs (logic array blocks) for implementing complex digital logic and custom hardware acceleration.
• Embedded Memory — Approximately 2.396 Mbits of on-chip RAM to support buffering, FIFOs, and on-chip data structures without external memory.
• I/O and Interfaces — 377 user I/O pins to support multiple external interfaces and high-density board integration.
• Power Supply — Core voltage range of 1.15 V to 1.25 V, suitable for low-power system designs within the Cyclone III family power ecosystem.
• Clock Management — Cyclone III family features include multiple PLLs for robust clock synthesis and management (family-level feature).
• Package & Mounting — 780-FBGA (29 × 29) surface-mount package for compact, high-density PCB layouts.
• Industrial Temperature Range — Specified for operation from −40 °C to 100 °C for use in thermally demanding or outdoor industrial environments.
• Standards & Compliance — RoHS compliant to meet environmental and regulatory requirements.

Typical Applications

• Industrial Control — Implement motor control logic, sensor interfacing, and real-time control functions that benefit from on-chip memory and high I/O density.
• Embedded Systems — Use the device to offload deterministic tasks, glue logic, or custom accelerators where integrated memory and abundant logic elements reduce BOM complexity.
• Communications & Networking — Leverage the device’s logic capacity and I/O count for protocol bridging, packet processing, and interface adaptation in networked equipment.
• Portable and Handheld Products — Cyclone III family low-power characteristics support battery-powered or thermally constrained designs that require efficient FPGA resources.

Unique Advantages

• High logic capacity with manageable footprint — 55,856 logic elements in a 780-FBGA package enable complex designs without large board area impact.
• On-chip memory reduces external components — Approximately 2.396 Mbits of embedded RAM lowers dependency on external memories and simplifies PCB routing.
• Wide I/O count for system integration — 377 user I/Os allow direct interfacing to numerous peripherals and high-pin-count connectors.
• Industrial temperature rating — −40 °C to 100 °C operation supports deployments in harsh or temperature-variable environments.
• Low-voltage core operation — 1.15 V to 1.25 V supply range supports power-optimized designs consistent with Cyclone III low-power objectives.
• Regulatory readiness — RoHS compliance eases integration into products requiring environmental compliance.

Why Choose EP3C55F780I7?

The EP3C55F780I7 delivers a balanced combination of logic density, embedded memory, and I/O capacity in a compact 780-FBGA package, positioned for industrial and high-volume, cost-sensitive applications. Its operating range and RoHS compliance make it a practical choice for designers who need reliable FPGA performance in thermally and environmentally demanding systems.

Choosing this Cyclone III family device lets you scale functionality while leveraging a proven low-power FPGA architecture and family-level features for clock management and system integration, supporting long-term product development and deployment.

Request a quote or submit a purchase inquiry to obtain pricing, availability, and lead-time information for the EP3C55F780I7.