EP3C55F780C8N

The EP3C55F780C8N is an Intel Cyclone® III family FPGA in a 780‑ball FBGA package, designed for cost‑ and power‑sensitive programmable logic applications. Built on the Cyclone III architecture, it combines a high logic element count, substantial on‑chip memory, and a large I/O complement to support complex glue‑logic, embedded processing, and mid‑range system integration.

This device targets high‑volume, low‑power designs that require flexible I/O, embedded memory, and FPGA reconfigurability while operating from a core voltage of 1.15 V to 1.25 V and within a commercial temperature range of 0 °C to 85 °C.

Key Features

• Core Logic — 55,856 logic elements provide substantial programmable fabric for combinational and sequential logic, custom controllers, and glue logic.
• Embedded Memory — Approximately 2.396 Mbits of on‑chip RAM to implement FIFOs, buffers, and state storage without external memory.
• I/O Capacity — 377 user I/Os support dense peripheral interfacing and multiple simultaneous interfaces for system integration.
• Power and Voltage — Operates from a core supply in the 1.15 V to 1.25 V range consistent with Cyclone III low‑power design goals.
• Clocking and System Integration (family) — Cyclone III family devices provide multiple PLLs and clock management features for robust timing and interface conversion (as described in the Cyclone III device handbook).
• Package and Mounting — 780‑FBGA (29 × 29 mm) surface‑mount package for compact board layouts and high pin density.
• Commercial Grade & Environmental — Commercial temperature rating (0 °C to 85 °C) and RoHS compliant for standard commercial product deployments.

Typical Applications

• Embedded Systems — Implement custom peripherals, protocol bridges, or soft processors using the FPGA fabric and on‑chip memory.
• Communications & Networking — Support mid‑range packet processing, interface conditioning, and custom timing with abundant I/Os and embedded RAM.
• Video and Imaging Processing — Use the logic density and memory resources for image buffering, pre‑processing, and data movement tasks.
• Industrial Control and Automation — Provide deterministic control logic, sensor aggregation, and interface conversion within the commercial temperature range.

Unique Advantages

• High Logic Density: 55,856 logic elements enable implementation of complex state machines, custom accelerators, and multi‑function designs on a single device.
• Sizable On‑Chip Memory: Approximately 2.396 Mbits of embedded RAM reduces dependence on external memory for buffering and temporary storage, simplifying BOM and board routing.
• Extensive I/O Count: 377 user I/Os allow rich peripheral connectivity and multi‑channel interface support without additional bridge components.
• Compact, High‑Pin Package: 780‑FBGA (29×29) provides high pin density for complex designs while maintaining a compact footprint for PCB real estate savings.
• Low‑Power Family Design: Based on Cyclone III low‑power device family characteristics to help meet power budgets in portable and thermally constrained systems.
• Regulatory and Assembly Friendly: Surface‑mount packaging and RoHS compliance support modern assembly processes and environmental requirements.

Why Choose EP3C55F780C8N?

The EP3C55F780C8N positions itself as a practical, mid‑density Cyclone III FPGA offering the balance of logic capacity, embedded memory, and high I/O count needed for cost‑sensitive, low‑power designs. Its 780‑FBGA package and commercial temperature range make it suitable for a wide range of consumer, communications, and industrial automation applications where reconfigurability and integration reduce system complexity and BOM.

As part of the Cyclone III device family, it benefits from the family’s design ecosystem—pre‑built IP, clock management capabilities, and power‑aware design flows—helping teams move from concept to production with a known FPGA architecture and established toolchain support.

Request a quote or submit an inquiry to evaluate EP3C55F780C8N for your next design and confirm availability, pricing, and lead times.