EP3C55F780C6N

The EP3C55F780C6N is a Cyclone III field programmable gate array (FPGA) in a 780-ball fine-pitch BGA package. It combines a mid-range logic capacity with substantial embedded memory and high I/O density, making it suitable for cost- and power-sensitive designs that require flexible, reprogrammable logic.

Built on the Cyclone III device family architecture, this commercial-grade FPGA targets applications that benefit from low-power operation, system integration, and a broad set of device-level features provided by the Cyclone III family.

Key Features

• Logic Capacity  Provides 55,856 logic elements for implementing complex digital logic, state machines, and custom datapaths.
• Embedded Memory  Approximately 2.4 Mbits of on-chip RAM to support buffering, FIFOs, and local data storage without external memory in many use cases.
• I/O Density  377 I/O pins available in the 780-FBGA package to support high-pin-count interfaces and multiple peripherals.
• Power Supply  Operates from a core voltage range of 1.15 V to 1.25 V compatible with Cyclone III family power architecture.
• Package and Mounting  780-ball fine-pitch BGA (29 × 29 mm) in a surface-mount package for compact board integration.
• Operating Range  Commercial temperature range from 0 °C to 85 °C for typical commercial electronics deployments.
• RoHS Compliance  RoHS compliant for environmental and regulatory alignment in standard commercial products.
• Cyclone III Family Capabilities  Leverages family-level features such as low-power process technology, on-chip PLLs for clock management, and a range of I/O standard support as defined by the Cyclone III device handbook.

Typical Applications

• Industrial Control & Automation  Implements custom logic for motor control, sensor aggregation, and real-time control functions where reconfigurability and moderate logic density are required.
• Communications & Networking  Supports packet processing, protocol bridging, and interface adaptation using available logic and high I/O counts for multiple lanes and peripherals.
• Consumer & Portable Electronics  Enables display controllers, user-interface processing, and peripheral aggregation in cost- and power-sensitive consumer devices.
• Embedded Systems  Provides glue logic, custom accelerators, and interface consolidation for single-board systems and compact embedded designs.

Unique Advantages

• Balanced Logic and Memory:  55,856 logic elements paired with approximately 2.4 Mbits of embedded RAM lets designers map sizable logic and buffering on-chip, reducing external components.
• High I/O Count:  377 I/Os in a single package simplify integration of multiple peripherals and high-pin-count interfaces without complex board routing across multiple devices.
• Compact, Surface-Mount BGA:  780-FBGA (29 × 29 mm) provides a dense, manufacturable footprint suitable for space-constrained PCBs.
• Commercial Temperature Suitability:  Rated for 0 °C to 85 °C operation for standard commercial product environments.
• Family-Level Power and Clock Features:  Built on the Cyclone III family platform, benefiting from low-power process optimizations and integrated clock-management resources described in the device handbook.
• Regulatory Compliance:  RoHS-compliant construction aligns with common environmental and manufacturing requirements.

Why Choose EP3C55F780C6N?

The EP3C55F780C6N offers a practical combination of mid-range logic capacity, substantial on-chip memory, and high I/O density in a compact 780-FBGA package. It is positioned for designers who need a reprogrammable, power-conscious FPGA solution with the system-level capabilities of the Cyclone III family.

This part is well suited for teams developing cost-sensitive commercial products that require flexible hardware acceleration, interface consolidation, or custom digital logic while leveraging the Cyclone III device family’s architectural capabilities and ecosystem resources.

Request a quote or submit an inquiry to get pricing, availability, and technical support for the EP3C55F780C6N.