EP3C55F484I7N

The EP3C55F484I7N is an Intel Cyclone® III family FPGA supplied in a 484-ball BGA package. It combines a mid-range logic capacity with substantial embedded memory and I/O density for industrial applications that require configurable logic, on-chip memory, and flexible interfacing.

Built on the Cyclone III device family architecture, this device targets cost- and power-sensitive applications while offering the integration and integration features commonly used for embedded processing, system interfacing, and real-time control.

Key Features

• Logic Capacity  Provides 55,856 logic elements suitable for mid-range programmable logic implementations and custom digital functions.
• Embedded Memory  Approximately 2.396 Mbits of on-chip RAM (2,396,160 total RAM bits) to support data buffering, FIFOs, and storage for implemented logic.
• I/O Count & Flexibility  Offers 327 user I/O pins to support wide external interfacing and multiple parallel or serial connections.
• Low‑Voltage Core  Operates from a 1.15 V to 1.25 V core supply range, consistent with Cyclone III low-power device family characteristics.
• Industrial Temperature Range  Rated for operation from −40 °C to 100 °C for deployment in thermally demanding industrial environments.
• Package and Mounting  Supplied in a 484-FBGA package (484‑BGA) with surface mount mounting; package descriptor includes a 23×23 footprint specification.
• Cyclone III Family Advantages  Leverages Cyclone III family-level attributes such as low-power process technology, power-aware design flow, and device-level features intended to minimize static power consumption.
• System Integration Features  Family-level capabilities include multiple PLLs for clock management and support for a broad set of I/O standards and on-chip resources to help consolidate system functions.

Typical Applications

• Industrial Control  Use the device for configurable control logic, real-time signal processing, and I/O aggregation in factory automation and machine control systems that require industrial temperature operation.
• Embedded Processing & Interfaces  Deploy as a platform for custom soft-core processors, peripheral bridging, and protocol adaptation where moderate logic density and ample on-chip memory are needed.
• Communications & Networking  Implement interface logic, data buffering, and custom packet handling using the device’s I/O count and embedded RAM to support network and serial applications.
• Portable and Low‑Power Products  Take advantage of Cyclone III family low‑power characteristics to extend battery life and reduce thermal management needs in handheld or portable instrumentation.

Unique Advantages

• High Logic Density:  55,856 logic elements provide the capacity to implement complex state machines, DSP pipelines, and control algorithms without external glue logic.
• Substantial On‑Chip Memory:  Approximately 2.396 Mbits of embedded RAM reduces the need for external memory for many buffering and local storage needs, simplifying board design.
• Rich I/O Resources:  327 I/O pins enable flexible interfacing to sensors, serializers, buses, and peripherals, reducing the need for additional I/O expanders.
• Industrial Thermal Specified:  Rated from −40 °C to 100 °C for reliable operation in industrial environments where temperature resilience matters.
• Compact, Surface‑Mount Package:  484‑BGA (484‑FBGA) packaging provides a compact solution for space-constrained PCBs while supporting high pin count routing.
• Family-Level Low‑Power Design:  Built on Cyclone III low-power process technology and power-aware design methodology to help meet power and thermal budgets.

Why Choose EP3C55F484I7N?

The EP3C55F484I7N positions itself as a mid-range Cyclone III FPGA offering a balanced combination of logic capacity, embedded memory, and I/O density for industrial and embedded system designs. Its industrial temperature rating and low-voltage core make it suitable for applications that must perform reliably across broad thermal ranges while managing power consumption.

Engineers seeking a field-programmable solution with substantial on-chip resources and family-level support for low-power operation and system integration will find this device appropriate for consolidating logic, reducing BOM, and accelerating time to market within the Cyclone III ecosystem.

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