EP3C55F484C8

The EP3C55F484C8 is a Cyclone® III FPGA delivering a balance of integration, low-power operation, and mid-range logic density for commercial applications. Built on the Cyclone III device architecture, it provides 55,856 logic elements, approximately 2.4 Mbits of embedded memory, and 327 user I/Os in a 484-ball BGA package for compact system integration. Typical use cases include cost- and power-sensitive designs that require flexible programmable logic, on-chip memory, and a broad set of I/O capabilities.

Key Features

• Logic Capacity  55,856 logic elements for implementing complex state machines, glue logic, and custom datapaths.
• Embedded Memory  Approximately 2.4 Mbits of on-chip RAM to support buffering, FIFOs, and small embedded data stores without external memory.
• I/O Density  327 user I/Os, enabling multiple high-pin-count interfaces and parallel buses from a single device.
• Low-Voltage Core  Core supply range of 1.15 V to 1.25 V supports low-power system designs.
• Commercial Temperature Grade  Rated for 0 °C to 85 °C operation, suitable for standard commercial environments.
• Package  484-FBGA (23 × 23) surface-mount package for space-efficient board designs and reliable solder assembly.
• Low-Power Family Design  Cyclone III family-level optimizations target low static power, supporting battery-powered and thermally constrained systems.
• Clock Management  Family-level support for up to four PLLs per device for robust clock synthesis and domain generation.
• I/O Standards & Signal Integrity  Family-level support for a wide range of I/O standards and adjustable I/O slew rates to help manage signal integrity across interfaces.
• Integration & IP  Supports a broad collection of pre-built, verified IP cores (family-level) to accelerate common functions and system integration.

Typical Applications

• Communications & Networking  Implement protocol bridges, packet buffering, and custom packet processing logic using high I/O count and on-chip RAM.
• Embedded Control  Replace multiple discrete components with programmable logic for motor control, I/O aggregation, and customized control algorithms.
• Video & Imaging  Use on-chip memory and plentiful logic elements for preprocessing, timing control, and parallel data paths in video capture or display front ends.
• Industrial Automation  Address mid-range logic and I/O needs for PLC peripherals, sensor interfacing, and deterministic control functions within commercial temperature ranges.

Unique Advantages

• High Logic Density in a Mid-Range Device: 55,856 logic elements provide ample resources for complex application logic without moving to higher-cost families.
• On-Chip Memory Reduces BOM: Approximately 2.4 Mbits of embedded memory lowers dependence on external RAM, simplifying board design and reducing component count.
• Rich I/O Count: 327 I/Os support multiple parallel interfaces and mixed-signal front ends from a single FPGA, streamlining system connectivity.
• Low-Power Operation: Cyclone III family-level low-power process and a 1.15–1.25 V core supply enable designs targeting reduced power budgets.
• Compact, Assembly-Friendly Package: 484-FBGA (23×23) provides a compact footprint while supporting surface-mount assembly practices for production volumes.
• Family-Level IP & Clocking: Access to pre-validated IP cores and multiple PLLs accelerates design schedules and simplifies clock-domain management.

Why Choose EP3C55F484C8?

The EP3C55F484C8 is positioned for designers who need a mid-range, low-power FPGA with substantial logic and memory resources, high I/O density, and a compact BGA package. Its specifications make it well suited for commercial applications where integration, power efficiency, and flexible I/O are primary considerations.

Choosing this Cyclone® III device enables scalable designs that leverage family-level IP, clock management features, and low-power silicon optimizations to reduce system complexity and shorten development time.

Request a quote or submit an inquiry to check availability and pricing for the EP3C55F484C8 and see how it fits into your next design.