EP3C55F484C8N

The EP3C55F484C8N is a Cyclone® III field-programmable gate array (FPGA) offered in a 484-BGA (23×23) surface-mount package. It delivers 55,856 logic elements and approximately 2.4 Mbits of embedded memory, with up to 327 user I/Os, making it suitable for high-density, cost-sensitive, and low-power designs.

Built on the Cyclone III device family architecture, this commercial-grade FPGA targets applications that require significant on-chip logic and memory integration while operating with a 1.15–1.25 V core supply and a standard commercial temperature range of 0 °C to 85 °C.

Key Features

• Core Density  55,856 logic elements to implement complex digital functions and custom accelerators.
• Logic Array Blocks  3,491 CLBs for organized, scalable logic placement and routing.
• Embedded Memory  Approximately 2.4 Mbits of on-chip RAM to reduce external memory requirements and speed local data access.
• I/O Capability  327 user I/Os to support multiple interfaces and high-pin-count system designs.
• Power Supply  Core supply range of 1.15 V to 1.25 V for modern low-voltage system integration.
• Package & Mounting  484-FBGA (23×23) surface-mount package delivering a compact footprint for dense PCB layouts.
• Operating Range  Commercial grade operation from 0 °C to 85 °C for standard consumer and embedded environments.
• RoHS Compliance  RoHS status: Compliant, meeting environmental material requirements.
• Cyclone III Family Characteristics  Based on Cyclone III architecture with low-power process optimizations, advanced clocking resources (family documentation cites up to four PLLs per device), and support for a broad set of I/O standards as defined by the family.

Typical Applications

• Portable and Handheld Devices  Leverages Cyclone III low-power characteristics and on-chip memory to extend battery life and reduce external components.
• High-density I/O Systems  High I/O count supports multi-channel interfaces, sensor aggregation, and complex I/O bridging without excessive external glue logic.
• Consumer Electronics  Integrates application-specific logic and memory for functions such as user interfaces, signal conditioning, and control logic.
• Embedded Processing  On-chip RAM and abundant logic resources enable custom data-paths, protocol handling, and hardware acceleration for embedded systems.

Unique Advantages

• High logic capacity: 55,856 logic elements allow consolidation of multiple functions onto a single device, reducing BOM complexity.
• Generous on-chip memory: Approximately 2.4 Mbits of embedded RAM minimizes the need for external memory and improves system throughput.
• Large I/O resource pool: 327 user I/Os simplify integration of multiple peripherals and high-pin-count interfaces.
• Compact package: 484-FBGA (23×23) delivers a small PCB footprint for space-constrained designs while preserving signal density.
• Low-voltage core operation: 1.15–1.25 V supply aligns with modern low-power system architectures.
• Standards and compliance: RoHS compliance supports environmental requirements for commercial products.

Why Choose EP3C55F484C8N?

The EP3C55F484C8N combines high logic density, substantial on-chip memory, and a large I/O complement in a compact 484-BGA package, making it well suited for designs that require integrated digital processing and extensive interfacing while maintaining a commercial temperature rating. As a member of the Cyclone III family, it benefits from the family’s low-power design emphasis and documented architecture, providing designers with a platform that balances integration and power efficiency.

This device is appropriate for engineers and procurement teams building cost-sensitive, high-volume embedded systems and consumer designs that need scalable logic, on-chip memory, and robust I/O resources, backed by Cyclone III family documentation and design flows.

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