EP3C55F484C7

IC FPGA 327 I/O 484FBGA
Part Description

Cyclone® III Field Programmable Gate Array (FPGA) IC 327 2396160 55856 484-BGA

Quantity 127 Available (as of May 5, 2026)
Product CategoryField Programmable Gate Array (FPGA)
ManufacturerIntel
Manufacturing StatusActive
Manufacturer Standard Lead Time26 Weeks
Datasheet

Specifications & Environmental

Device Package484-FBGA (23x23)GradeCommercialOperating Temperature0°C – 85°C
Package / Case484-BGANumber of I/O327Voltage1.15 V - 1.25 V
Mounting MethodSurface MountRoHS ComplianceRoHS non-compliantREACH ComplianceREACH Unaffected
Moisture Sensitivity Level3 (168 Hours)Number of LABs/CLBs3491Number of Logic Elements/Cells55856
Number of GatesN/AECCN3A991DHTS Code8542.39.0001
QualificationN/ATotal RAM Bits2396160

Overview of EP3C55F484C7 – Cyclone® III FPGA, 55,856 logic elements, 484-BGA

The EP3C55F484C7 is a Cyclone® III Field Programmable Gate Array (FPGA) from Intel, built for low-power, cost-sensitive designs that require high integration. As a member of the Cyclone III family, this device combines a mid-range logic capacity with on-chip embedded memory, flexible I/O, and clock management features suitable for portable, communications, and general embedded applications.

Key device attributes include 55,856 logic elements, approximately 2.396 Mbits of embedded memory, 327 I/Os, a 484-ball BGA package, and a core supply range of 1.15 V to 1.25 V. The device is specified for commercial operation from 0°C to 85°C and is RoHS compliant.

Key Features

  • Logic Capacity  55,856 logic elements provide a mid-range programmable fabric for custom logic, control, and signal processing functions.
  • Embedded Memory  Approximately 2.396 Mbits of on-chip RAM to support buffering, packet processing, and local data storage without external memory.
  • I/O Density and Standards  327 user I/O pins in a 484-BGA (23×23) package accommodate high pin-count interfaces; the Cyclone III family supports a broad set of I/O standards for system-level flexibility.
  • Power and Process  Designed for low-power operation with a core voltage range of 1.15 V to 1.25 V, aligned with the Cyclone III family emphasis on minimizing static power for thermally constrained designs.
  • Clock Management  Family-level features include multiple PLLs for robust clock synthesis and distribution, enabling complex clocking schemes and interface timing.
  • Package and Mounting  484-FBGA (23×23) surface-mount package provides compact, high-density board integration for space-constrained applications.
  • Operating Range and Grade  Commercial grade operation from 0°C to 85°C, suitable for consumer and many industrial-adjacent applications that operate within this range.
  • Regulatory Compliance  RoHS compliant, meeting common environmental and lead-free requirements for modern electronics production.

Typical Applications

  • Portable and Handheld Devices  Low-power characteristics and on-chip memory make the device suitable for battery-powered equipment and thermally constrained designs.
  • Embedded Control and Signal Processing  Logic density and embedded RAM support custom control logic, protocol handling, and medium-complexity signal processing tasks.
  • High-Density I/O Interfaces  High I/O count and flexible I/O standards support bridging, aggregation, and interface conversion in communications and instrumentation systems.
  • Upgradeable System Designs  Cyclone III family features enable remote system update scenarios and in-field reconfiguration for long-lived or evolving products.

Unique Advantages

  • Balanced Mid-Range Capacity: 55,856 logic elements and approximately 2.396 Mbits of embedded memory deliver a strong balance of logic and storage for mid-complexity designs without excess cost.
  • High I/O Integration: 327 I/Os in a 484-BGA package reduce the need for external multiplexing and simplify board-level routing for I/O-heavy applications.
  • Low-Power Operation: Core voltage support at 1.15 V–1.25 V and family-level low-power process optimizations help reduce system power and thermal management requirements.
  • Robust Clocking: Integrated PLL-based clock management enables flexible clock generation and distribution for multi-domain systems.
  • Compact Packaging: 484-FBGA (23×23) surface-mount package offers a compact footprint for space-constrained PCBs while providing ample I/O.
  • Standards and Compliance: RoHS compliance supports contemporary manufacturing and environmental requirements.

Why Choose EP3C55F484C7?

The EP3C55F484C7 positions itself as a practical, mid-range FPGA choice for designers who need a combination of substantial logic resources, on-chip memory, and a high I/O count in a compact BGA package. Its Cyclone III family heritage emphasizes low power and cost-efficiency, making it suitable for volume-sensitive and thermally limited applications.

This device is well suited to developers building portable systems, embedded controllers, and I/O-intensive interfaces who require a commercially graded FPGA with proven family-level features such as PLL-based clock management and broad I/O standard support. RoHS compliance and a defined commercial temperature range provide predictable integration into modern product flows.

Request a quote or submit a pricing inquiry for EP3C55F484C7 to evaluate availability and lead time for your next design.

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