EP3C55F484C7
| Part Description |
Cyclone® III Field Programmable Gate Array (FPGA) IC 327 2396160 55856 484-BGA |
|---|---|
| Quantity | 127 Available (as of May 5, 2026) |
| Product Category | Field Programmable Gate Array (FPGA) |
|---|---|
| Manufacturer | Intel |
| Manufacturing Status | Active |
| Manufacturer Standard Lead Time | 26 Weeks |
| Datasheet |
Specifications & Environmental
| Device Package | 484-FBGA (23x23) | Grade | Commercial | Operating Temperature | 0°C – 85°C | ||
|---|---|---|---|---|---|---|---|
| Package / Case | 484-BGA | Number of I/O | 327 | Voltage | 1.15 V - 1.25 V | ||
| Mounting Method | Surface Mount | RoHS Compliance | RoHS non-compliant | REACH Compliance | REACH Unaffected | ||
| Moisture Sensitivity Level | 3 (168 Hours) | Number of LABs/CLBs | 3491 | Number of Logic Elements/Cells | 55856 | ||
| Number of Gates | N/A | ECCN | 3A991D | HTS Code | 8542.39.0001 | ||
| Qualification | N/A | Total RAM Bits | 2396160 |
Overview of EP3C55F484C7 – Cyclone® III FPGA, 55,856 logic elements, 484-BGA
The EP3C55F484C7 is a Cyclone® III Field Programmable Gate Array (FPGA) from Intel, built for low-power, cost-sensitive designs that require high integration. As a member of the Cyclone III family, this device combines a mid-range logic capacity with on-chip embedded memory, flexible I/O, and clock management features suitable for portable, communications, and general embedded applications.
Key device attributes include 55,856 logic elements, approximately 2.396 Mbits of embedded memory, 327 I/Os, a 484-ball BGA package, and a core supply range of 1.15 V to 1.25 V. The device is specified for commercial operation from 0°C to 85°C and is RoHS compliant.
Key Features
- Logic Capacity 55,856 logic elements provide a mid-range programmable fabric for custom logic, control, and signal processing functions.
- Embedded Memory Approximately 2.396 Mbits of on-chip RAM to support buffering, packet processing, and local data storage without external memory.
- I/O Density and Standards 327 user I/O pins in a 484-BGA (23×23) package accommodate high pin-count interfaces; the Cyclone III family supports a broad set of I/O standards for system-level flexibility.
- Power and Process Designed for low-power operation with a core voltage range of 1.15 V to 1.25 V, aligned with the Cyclone III family emphasis on minimizing static power for thermally constrained designs.
- Clock Management Family-level features include multiple PLLs for robust clock synthesis and distribution, enabling complex clocking schemes and interface timing.
- Package and Mounting 484-FBGA (23×23) surface-mount package provides compact, high-density board integration for space-constrained applications.
- Operating Range and Grade Commercial grade operation from 0°C to 85°C, suitable for consumer and many industrial-adjacent applications that operate within this range.
- Regulatory Compliance RoHS compliant, meeting common environmental and lead-free requirements for modern electronics production.
Typical Applications
- Portable and Handheld Devices Low-power characteristics and on-chip memory make the device suitable for battery-powered equipment and thermally constrained designs.
- Embedded Control and Signal Processing Logic density and embedded RAM support custom control logic, protocol handling, and medium-complexity signal processing tasks.
- High-Density I/O Interfaces High I/O count and flexible I/O standards support bridging, aggregation, and interface conversion in communications and instrumentation systems.
- Upgradeable System Designs Cyclone III family features enable remote system update scenarios and in-field reconfiguration for long-lived or evolving products.
Unique Advantages
- Balanced Mid-Range Capacity: 55,856 logic elements and approximately 2.396 Mbits of embedded memory deliver a strong balance of logic and storage for mid-complexity designs without excess cost.
- High I/O Integration: 327 I/Os in a 484-BGA package reduce the need for external multiplexing and simplify board-level routing for I/O-heavy applications.
- Low-Power Operation: Core voltage support at 1.15 V–1.25 V and family-level low-power process optimizations help reduce system power and thermal management requirements.
- Robust Clocking: Integrated PLL-based clock management enables flexible clock generation and distribution for multi-domain systems.
- Compact Packaging: 484-FBGA (23×23) surface-mount package offers a compact footprint for space-constrained PCBs while providing ample I/O.
- Standards and Compliance: RoHS compliance supports contemporary manufacturing and environmental requirements.
Why Choose EP3C55F484C7?
The EP3C55F484C7 positions itself as a practical, mid-range FPGA choice for designers who need a combination of substantial logic resources, on-chip memory, and a high I/O count in a compact BGA package. Its Cyclone III family heritage emphasizes low power and cost-efficiency, making it suitable for volume-sensitive and thermally limited applications.
This device is well suited to developers building portable systems, embedded controllers, and I/O-intensive interfaces who require a commercially graded FPGA with proven family-level features such as PLL-based clock management and broad I/O standard support. RoHS compliance and a defined commercial temperature range provide predictable integration into modern product flows.
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