EP3C40U484I7

IC FPGA 331 I/O 484UBGA
Part Description

Cyclone® III Field Programmable Gate Array (FPGA) IC 331 1161216 39600 484-FBGA

Quantity 838 Available (as of October 8, 2026)
Product CategoryField Programmable Gate Array (FPGA)
ManufacturerIntel
Manufacturing StatusActive
Manufacturer Standard Lead Time26 Weeks
Datasheet

Specifications & Environmental

Device Package484-UBGA (19x19)GradeIndustrialOperating Temperature-40°C – 100°C
Package / Case484-FBGANumber of I/O331Voltage1.15 V - 1.25 V
Mounting MethodSurface MountRoHS ComplianceRoHS non-compliantREACH ComplianceREACH Unaffected
Moisture Sensitivity Level3 (168 Hours)Number of LABs/CLBs2475Number of Logic Elements/Cells39600
Number of GatesN/AECCN3A001A7AHTS Code8542.39.0001
QualificationN/ATotal RAM Bits1161216

Overview of EP3C40U484I7 – Cyclone III FPGA, 39,600 logic elements, 484‑FBGA

The EP3C40U484I7 is an Intel Cyclone® III field‑programmable gate array supplied in a 484‑FBGA package intended for industrial applications. It delivers 39,600 logic elements and approximately 1.16 Mbits of embedded memory, making it suitable for low‑power, integration‑focused designs that require substantial on‑chip logic and memory resources.

With a wide I/O count and an operating range tailored for industrial environments, this device targets system designers building cost‑sensitive, power‑efficient applications that need flexible I/O and programmable logic integration.

Key Features

  • Logic Capacity — 39,600 logic elements provide programmable logic resources for custom digital functions and control logic.
  • Embedded Memory — Total on‑chip RAM of 1,161,216 bits (approximately 1.16 Mbits) for data buffering, state storage, and local scratch memory.
  • Programmable Logic Structure — 2,475 LABs (logic array blocks) to structure and organize logic implementation across the device.
  • I/O Density — 331 user I/Os to support multiple interfaces, external devices, and high‑pin‑count systems.
  • Power Supply — Core voltage range of 1.15 V to 1.25 V to match low‑power system designs and defined power rails.
  • Package & Mounting — 484‑FBGA (484‑UBGA, 19×19) surface‑mount package for compact board integration and reliable soldered connections.
  • Industrial Temperature Grade — Rated for operation from −40°C to 100°C to meet industrial thermal requirements.
  • Regulatory — RoHS compliant, supporting lead‑free manufacturing and environmental requirements.

Typical Applications

  • Industrial Control — Implements custom control logic, real‑time processing, and I/O aggregation in factory automation and process control equipment.
  • Communications & Networking — Provides programmable data path logic and high I/O counts for medium‑density switching, protocol bridging, and interface adaptation.
  • Embedded Processing — Hosts custom accelerators or soft processors using on‑chip memory and logic resources for low‑power embedded systems.
  • Test & Measurement — Enables flexible signal conditioning, timing control, and data capture in instrumentation requiring industrial temperature operation.

Unique Advantages

  • High Logic and Memory Integration: 39,600 logic elements alongside approximately 1.16 Mbits of embedded RAM reduces external component count and simplifies board design.
  • Substantial I/O Count: 331 user I/Os support multiple interfaces and parallel connectivity without adding external glue logic.
  • Industrial Reliability: −40°C to 100°C operating range and a robust FBGA package support deployment in demanding environments.
  • Low‑power Core Voltage: Defined core supply range (1.15–1.25 V) aligns with low‑power design practices and predictable power budgeting.
  • Compact Package: 484‑FBGA (19×19) surface‑mount footprint enables dense PCB layouts while maintaining soldered reliability.
  • RoHS Compliance: Facilitates lead‑free manufacturing and regulatory alignment across international markets.

Why Choose EP3C40U484I7?

The EP3C40U484I7 brings a balanced combination of programmable logic, embedded memory, and high I/O count in an industrial‑grade Cyclone III FPGA package. It is well suited for engineers who need a power‑aware, high‑integration solution for mid‑range FPGA designs where on‑chip resources and industrial temperature operation are essential.

Choosing this device supports scalable designs that benefit from the Cyclone III family architecture, enabling compact BOMs, flexible interface options, and reliable operation across industrial temperature ranges, backed by vendor datasheet specifications and family features.

Request a quote or submit an inquiry to get pricing and availability for EP3C40U484I7 and to discuss how this Cyclone III FPGA can fit into your next design.

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