EP3C40U484C8N

IC FPGA 331 I/O 484UBGA
Part Description

Cyclone® III Field Programmable Gate Array (FPGA) IC 331 1161216 39600 484-FBGA

Quantity 232 Available (as of May 5, 2026)
Product CategoryField Programmable Gate Array (FPGA)
ManufacturerIntel
Manufacturing StatusActive
Manufacturer Standard Lead Time26 Weeks
Datasheet

Specifications & Environmental

Device Package484-UBGA (19x19)GradeCommercialOperating Temperature0°C – 85°C
Package / Case484-FBGANumber of I/O331Voltage1.15 V - 1.25 V
Mounting MethodSurface MountRoHS ComplianceRoHS CompliantREACH ComplianceREACH Unaffected
Moisture Sensitivity Level3 (168 Hours)Number of LABs/CLBs2475Number of Logic Elements/Cells39600
Number of GatesN/AECCN3A991DHTS Code8542.39.0001
QualificationN/ATotal RAM Bits1161216

Overview of EP3C40U484C8N – Cyclone® III FPGA, 39,600 logic elements, 484-FBGA

The EP3C40U484C8N is a Cyclone® III family field programmable gate array (FPGA) in a 484-FBGA package designed for commercial-grade applications. It integrates 39,600 logic elements, approximately 1.16 Mbits of embedded memory, and 331 user I/Os to address high-density logic, moderate embedded memory, and rich I/O requirements.

Built on the Cyclone III device family architecture, this device targets high-volume, low-power, and cost-sensitive markets where on-chip integration, flexible clocking, and diverse I/O support improve system-level design efficiency.

Key Features

  • Logic Capacity — 39,600 logic elements provide substantial combinational and sequential resources for mid-range FPGA designs.
  • Embedded Memory — Approximately 1.16 Mbits of on-chip RAM for buffering, FIFOs, and data storage close to logic.
  • I/O Resources — 331 user I/Os to support broad connectivity and multiple interface domains on a single device.
  • Clock Management — Cyclone III family architecture includes up to four PLLs per device with five outputs each for flexible clock synthesis and phase control.
  • Package & Mounting — 484-FBGA (484-UBGA, 19×19) surface-mount package suitable for dense PCB layouts.
  • Supply & Temperature — Core voltage range of 1.15 V to 1.25 V and commercial operating temperature range of 0 °C to 85 °C.
  • Low-Power Family Architecture — Cyclone III family emphasizes low power through process and architecture choices to support thermally constrained designs and extended battery life in portable applications.
  • I/O Standards & Signal Integrity — Family-level support for a wide range of I/O standards and adjustable slew rates, plus features such as on-chip termination calibration to address PVT variations.
  • Compliance — RoHS compliant.

Typical Applications

  • Portable and Handheld Devices — Low-power family architecture and compact 484-FBGA package make the device suitable for battery-powered and space-constrained systems.
  • Consumer and Industrial Controls — Abundant logic elements, embedded memory, and 331 I/Os enable motor control, sensor aggregation, and user-interface management.
  • Communications and I/O Bridging — Multiple I/Os and flexible clocking fit protocol bridging, I/O expansion, and interface consolidation tasks.
  • Embedded System Integration — On-chip RAM, clock management, and family support for embedded processors (Nios II on the family) allow tight integration of control and data-path logic.

Unique Advantages

  • Substantial Logic Density: 39,600 logic elements enable implementation of mid-range logic designs without external glue logic, reducing board complexity.
  • High I/O Count: 331 user I/Os allow direct connection to multiple peripherals and high-pin-count interfaces, minimizing the need for external I/O expanders.
  • Integrated Memory: Approximately 1.16 Mbits of embedded RAM keeps data paths on-chip for lower latency and simpler PCB routing.
  • Flexible Clocking: Up to four PLLs with multiple outputs provide on-chip clock synthesis and phase control to simplify timing architectures.
  • Commercial Temperature and RoHS Compliance: 0 °C to 85 °C rating with RoHS compliance supports mainstream commercial production and environmental requirements.
  • Compact, Surface-Mount Packaging: 484-FBGA (19×19) package balances pin count and board area for dense, manufacturable designs.

Why Choose EP3C40U484C8N?

The EP3C40U484C8N positions itself as a practical, mid-range Cyclone III FPGA option where logic capacity, moderate embedded memory, and extensive I/O are required in a compact, commercial-grade device. Its family-level low-power architecture and on-chip clocking resources make it well suited to designs that demand integration and power-conscious operation.

Designers targeting high-volume or cost-sensitive products will appreciate the balance of logic, memory, and I/O in a RoHS-compliant 484-FBGA package, supported by the Cyclone III device family architecture and tool ecosystem.

Request a quote or submit an inquiry to receive pricing and availability for EP3C40U484C8N and to discuss how it fits your next design.

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