EP3C40U484I7N

IC FPGA 331 I/O 484UBGA
Part Description

Cyclone® III Field Programmable Gate Array (FPGA) IC 331 1161216 39600 484-FBGA

Quantity 337 Available (as of May 5, 2026)
Product CategoryField Programmable Gate Array (FPGA)
ManufacturerIntel
Manufacturing StatusActive
Manufacturer Standard Lead Time26 Weeks
Datasheet

Specifications & Environmental

Device Package484-UBGA (19x19)GradeIndustrialOperating Temperature-40°C – 100°C
Package / Case484-FBGANumber of I/O331Voltage1.15 V - 1.25 V
Mounting MethodSurface MountRoHS ComplianceRoHS CompliantREACH ComplianceREACH Unaffected
Moisture Sensitivity Level3 (168 Hours)Number of LABs/CLBs2475Number of Logic Elements/Cells39600
Number of GatesN/AECCN3A001A7AHTS Code8542.39.0001
QualificationN/ATotal RAM Bits1161216

Overview of EP3C40U484I7N – Cyclone® III Field Programmable Gate Array (FPGA) IC 331 1161216 39600 484-FBGA

The EP3C40U484I7N is a Cyclone III family FPGA offering a balance of programmable logic, on-chip memory and I/O density in a 484-ball FBGA package. Built on the Cyclone III architecture, it targets cost- and power-sensitive industrial applications that need moderate logic capacity, extensive I/O, and flexible system integration.

With 39,600 logic elements, approximately 1.16 Mbits of embedded memory and 331 user I/Os, this device suits designs that require substantial on-chip resources while operating across an industrial temperature range.

Key Features

  • Logic Capacity — 39,600 logic elements provide the programmable fabric for implementing custom logic, state machines, and control functions.
  • Logic Array Blocks — 2,475 logic array blocks (CLBs) for structured routing and logic placement within the device architecture.
  • Embedded Memory — Approximately 1.16 Mbits of on-chip RAM to support FIFOs, buffers, and small data stores without external memory.
  • I/O Count & Flexibility — 331 user I/Os to interface with sensors, peripherals, and high-pin-count system buses in complex designs.
  • Power Supply — Core voltage range of 1.15 V to 1.25 V to match system power domains and support optimized power profiles.
  • Package & Mounting — 484-FBGA (484-UBGA, 19×19) in a surface-mount form factor suitable for compact PCBs and high-density board layouts.
  • Industrial Temperature Grade — Rated for operation from −40 °C to 100 °C for reliable use in industrial environments.
  • RoHS Compliant — Meets RoHS environmental requirements for lead-free manufacturing processes.
  • Cyclone III Family Architecture — Leverages Cyclone III family design characteristics such as low-power operation and integrated clocking resources suitable for system-level clock management (family-level feature).

Typical Applications

  • Industrial Control — Implement real-time control logic, motor control interfaces, and protocol bridging while operating across industrial temperature ranges.
  • Embedded Systems — Integrate peripheral control, custom data paths and local buffering using on-chip memory and abundant logic elements.
  • Communications & Interfaces — Manage parallel and serial I/O-intensive interfaces requiring many user I/Os and flexible I/O topology.
  • Prototyping & Low- to Mid-Volume Products — Provide a programmable platform for validating system logic and moving to production without fixed-function ASIC costs.

Unique Advantages

  • Substantial Logic Density: 39,600 logic elements allow complex control and processing functions on a single device, reducing external components.
  • High I/O Count: 331 user I/Os enable direct connection to multiple peripherals and buses, minimizing the need for external multiplexing.
  • On-Chip Memory: Approximately 1.16 Mbits of embedded RAM supports buffering and local data storage, simplifying board-level memory requirements.
  • Industrial Readiness: −40 °C to 100 °C operating range and surface-mount FBGA packaging support deployment in industrial environments and compact assemblies.
  • Power Domain Compatibility: 1.15–1.25 V core supply range aligns with modern low-voltage system designs for power-efficient operation.
  • Regulatory Compliance: RoHS compliance supports lead-free manufacturing and regulatory alignment for many markets.

Why Choose EP3C40U484I7N?

The EP3C40U484I7N combines a sizeable FPGA fabric with significant on-chip memory and high I/O density in a compact 484-FBGA package. Its industrial temperature rating and RoHS compliance make it suitable for embedded and industrial applications where reliable, programmable logic and flexible interfacing are required.

This device is well suited for design teams seeking a cost- and power-conscious Cyclone III FPGA platform that delivers scalable logic resources, integrated memory, and extensive connectivity while supporting standard surface-mount board assembly.

Request a quote or submit an inquiry to check availability and start your procurement process for the EP3C40U484I7N.

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