EP3C55F484C6N

The EP3C55F484C6N is a Cyclone® III field-programmable gate array (FPGA) in a 484-ball BGA package, designed for low-power, cost-sensitive applications. It integrates 55,856 logic elements, approximately 2.4 Mbits of embedded memory, and 327 user I/Os to support mid-range integration and system I/O requirements.

As part of the Cyclone III family, this device targets high-volume, low-power applications that require balanced logic, memory, and I/O resources in a commercial-temperature, surface-mount form factor.

Key Features

• Logic Capacity — 55,856 logic elements to implement complex combinational and sequential logic functions.
• On-chip Memory — Approximately 2.4 Mbits of embedded RAM for buffering, FIFOs, and local storage.
• I/O Resources — 327 user I/Os to support a wide range of external interfaces and parallel/serial connectivity.
• Power — Core voltage supply range of 1.15 V to 1.25 V consistent with low-power Cyclone III device operation.
• Clock Management — Cyclone III family architecture includes multiple PLLs for robust clock synthesis and distribution (family-level feature).
• Package and Mounting — 484-FBGA (23 × 23) package, surface-mount for compact PCB integration.
• Operating Range — Commercial-grade operation from 0 °C to 85 °C.
• Environmental Compliance — RoHS compliant for environmental and regulatory requirements.

Typical Applications

• Portable and Consumer Electronics — Low-power Cyclone III family characteristics and the device’s on-chip memory make it suitable for battery-conscious, high-volume consumer designs.
• Embedded Systems — Use the FPGA’s logic capacity and embedded memory for custom peripherals, signal preprocessing, or as glue logic in embedded platforms.
• Communications and I/O Aggregation — High I/O count supports aggregation, protocol bridging, and I/O-constrained board-level designs.
• Remote Upgradeable Systems — Family features support system-level upgrade strategies and in-field reconfiguration scenarios.

Unique Advantages

• Balanced Integration: Combines substantial logic (55,856 elements), embedded memory, and 327 I/Os to reduce external components and simplify BOM.
• Low-Power Foundation: Built on the Cyclone III low-power family platform to help meet power budgets in portable and thermally constrained designs.
• Compact Packaging: 484-FBGA (23×23) delivers high integration density for space-constrained PCBs while supporting surface-mount assembly.
• Commercial Temperature Rating: Rated for 0 °C to 85 °C to match common consumer and industrial-environment deployment scenarios that require commercial-grade devices.
• Regulatory Compliance: RoHS compliance reduces design-level environmental constraints and simplifies regulatory considerations.

Why Choose EP3C55F484C6N?

The EP3C55F484C6N positions itself as a practical Cyclone III FPGA option for designers who need mid-to-high logic capacity, substantial on-chip memory, and a high I/O count in a commercial-temperature, surface-mount BGA package. Its core voltage range and family-level low-power attributes support efficient system designs where power and integration are important.

This device is well suited for developers of consumer electronics, embedded controllers, and communication interfaces who want a scalable FPGA platform backed by the Cyclone III device family architecture and ecosystem.

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