EP3C55F780C7

The EP3C55F780C7 is a Cyclone® III field programmable gate array (FPGA) optimized for low-power, high-functionality, cost-sensitive designs. As a member of the Cyclone III family, it combines a mid-range logic fabric with embedded memory and on-chip clock management to support a wide range of commercial applications requiring flexible I/O and system integration.

With 55,856 logic elements, approximately 2.396 Mbits of embedded memory, and 377 user I/Os in a 780-ball FBGA (29 × 29 mm) package, this device is suited for high-volume, low-power designs that need a compact programmable logic solution.

Key Features

• Logic Capacity — 55,856 logic elements to implement mid-range combinational and sequential logic blocks for complex glue logic, protocol bridging, and custom datapaths.
• Embedded Memory — Approximately 2.396 Mbits of on-chip RAM for buffering, FIFOs, and local data storage.
• I/O Resources — 377 user I/Os to support multiple interfaces and parallel external peripherals in a single device.
• Power and Supply — Core supply range of 1.15 V to 1.25 V consistent with low-power Cyclone III family operation.
• Clock Management — Family-level support for four phase-locked loops (PLLs) for clock synthesis and distribution.
• Package and Mounting — 780-ball FBGA (29 × 29 mm) surface-mount package (780-BGA case) enabling compact board integration.
• Operating Range — Commercial-grade operating temperature from 0 °C to 85 °C.
• Design Ecosystem — Cyclone III family features include low-power process technology and support for pre-built IP and development flows to streamline design cycles.
• Compliance — RoHS compliant for regulatory and environmental considerations.

Typical Applications

• Consumer Electronics — Implements display controllers, interface bridging, and custom logic in compact, low-power consumer products.
• Communications Equipment — Provides protocol conversion, packet buffering, and timing management for mid-range networking and comms devices.
• Embedded Systems — Serves as a programmable control and glue-logic element in commercial embedded platforms that require flexible I/O and local memory.
• High-Volume, Low-Power Designs — Suits applications where cost, power efficiency, and integration density are primary concerns.

Unique Advantages

• High Logic Density: 55,856 logic elements enable substantial on-chip functionality without resorting to multiple devices.
• Ample On-Chip Memory: Approximately 2.396 Mbits of embedded RAM reduces dependence on external memory for buffering and temporary storage.
• Rich I/O Count: 377 user I/Os allow direct connection to multiple peripherals and parallel interfaces, simplifying board design.
• Integrated Clock Resources: Four PLLs provide flexible clocking and synchronization options for complex multi-domain designs.
• Compact Surface-Mount Package: 780-FBGA (29 × 29 mm) balances footprint and pin count for dense board layouts.
• Commercial Temperature Suitability: Rated 0 °C to 85 °C for a wide range of ambient conditions in commercial deployments.

Why Choose EP3C55F780C7?

The EP3C55F780C7 positions itself as a practical, mid-range Cyclone III FPGA offering a balanced combination of logic capacity, embedded memory, and I/O density in a compact 780-FBGA package. It is well suited to designers targeting high-volume, cost- and power-sensitive commercial applications that require flexible programmable logic, local buffering, and robust clock management.

Backed by Cyclone III family features—including low-power process optimizations, clocking resources, and a library of pre-built IP and development tools—this device provides a scalable and supported platform for accelerated development and long-term deployment in commercial systems.

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