EP3C55F780C7N

The EP3C55F780C7N is an Intel Cyclone® III field-programmable gate array (FPGA) supplied in a 780-ball FBGA (29×29) package. It delivers a balance of integration and low-power operation targeted at cost-sensitive, high-volume applications that require medium-density programmable logic and abundant I/O.

Built on the Cyclone III device family, the part is intended for designs that need substantial logic resources, on-chip memory and flexible I/O in a compact surface-mount BGA footprint while operating within commercial temperature and power ranges.

Key Features

• Logic Capacity — 55,856 logic elements to implement complex state machines, datapaths and custom logic functions.
• Embedded Memory — Approximately 2.4 Mbits of on-chip RAM for frame buffering, lookup tables and embedded storage.
• I/O Density — 377 user I/Os to support multiple interfaces, parallel buses and dense board-level connectivity.
• Power and Voltage — Core supply range of 1.15 V to 1.25 V for compatibility with Cyclone III power domains and low-power system designs.
• Package and Mounting — 780-FBGA (29×29) surface-mount package suitable for compact PCB layouts and high-pin-count routing.
• Operating Range and Grade — Commercial grade with an operating temperature range of 0 °C to 85 °C.
• RoHS Compliant — Meets RoHS environmental requirements for reduced hazardous substances.
• Cyclone III Family Attributes — Family-level features include a low-power TSMC LP process, configurable clock management (PLLs), and a broad set of I/O standard support and system integration options (as documented for Cyclone III devices).

Typical Applications

• Portable and Handheld Devices — Low-power family characteristics and on-chip memory make this FPGA suitable for battery-powered and thermally constrained systems where extended runtime matters.
• Consumer and Low-Cost Communications Equipment — Medium-density logic and high I/O count enable protocol bridging, interface aggregation and feature-rich consumer designs at scale.
• Embedded Control and Instrumentation — Large logic and RAM resources provide headroom for custom control logic, signal conditioning and local buffering in instrumentation and control units.
• Interface and Peripheral Expansion — Abundant I/Os allow the FPGA to serve as an I/O concentrator, bridge multiple buses or implement parallel interfaces on compact PCBs.

Unique Advantages

• High integration density: 55,856 logic elements and approximately 2.4 Mbits of embedded RAM reduce the need for external logic and memory, simplifying BOM and board area.
• Generous I/O resources: 377 I/Os enable complex multi-interface designs without adding external multiplexers or interface chips.
• Compact, manufacturable package: 780-FBGA (29×29) supports high pin count in a compact footprint suitable for automated surface-mount assembly.
• Commercial-grade operating window: Rated for 0 °C to 85 °C to meet mainstream environmental requirements for consumer and enterprise applications.
• Environmentally compliant: RoHS compliance reduces regulatory and disposal concerns for mass-produced electronics.

Why Choose EP3C55F780C7N?

The EP3C55F780C7N positions itself as a practical, mid-density FPGA solution for designers who need substantial programmable logic, embedded memory and high I/O count in a compact BGA package. Its commercial temperature rating and RoHS compliance make it well suited for mainstream consumer, communications and embedded applications where cost, power and board area are primary considerations.

Leveraging the Cyclone III family architecture, this device offers a combination of low-power process benefits and system-level integration options that help streamline design, reduce external components and support scalable development across similar Cyclone III devices.

Request a quote or submit an inquiry to check availability and pricing for the EP3C55F780C7N. Our team can provide lead-time details and ordering options to support your project schedule.