EP3C55U484C6

IC FPGA 327 I/O 484UBGA
Part Description

Cyclone® III Field Programmable Gate Array (FPGA) IC 327 2396160 55856 484-FBGA

Quantity 1,872 Available (as of May 5, 2026)
Product CategoryField Programmable Gate Array (FPGA)
ManufacturerIntel
Manufacturing StatusActive
Manufacturer Standard Lead Time26 Weeks
Datasheet

Specifications & Environmental

Device Package484-UBGA (19x19)GradeCommercialOperating Temperature0°C – 85°C
Package / Case484-FBGANumber of I/O327Voltage1.15 V - 1.25 V
Mounting MethodSurface MountRoHS ComplianceRoHS non-compliantREACH ComplianceREACH Unaffected
Moisture Sensitivity Level3 (168 Hours)Number of LABs/CLBs3491Number of Logic Elements/Cells55856
Number of GatesN/AECCN3A991DHTS Code8542.39.0001
QualificationN/ATotal RAM Bits2396160

Overview of EP3C55U484C6 – Cyclone® III Field Programmable Gate Array (FPGA) IC, 55,856 Logic Elements, 327 I/Os

The EP3C55U484C6 is a Cyclone® III family FPGA optimized for low-power, high-functionality designs. Built on the Cyclone III architecture, it targets high-volume, cost-sensitive commercial applications that require substantial programmable logic, a large on-chip memory footprint, and a high I/O count.

This device combines 55,856 logic elements with approximately 2.4 Mbits of embedded memory and 327 I/O pins in a compact 484‑FBGA package, delivering a flexible, low-voltage programmable platform for embedded processing, interface bridging, and system integration tasks.

Key Features

  • Core and Logic Density — 55,856 logic elements provide ample programmable logic capacity for complex custom functions and system integration.
  • Embedded Memory — Total on-chip RAM of 2,396,160 bits (approximately 2.4 Mbits) for buffering, FIFOs, and lookup tables.
  • I/O and Package — 327 I/O pins in a 484‑FBGA package (supplier package: 484‑UBGA, 19×19); surface-mount mounting for compact PCB integration.
  • Low-Voltage Operation — Specified supply range of 1.15 V to 1.25 V to support low-power system designs.
  • Commercial Temperature Grade — Rated for 0 °C to 85 °C operation for standard commercial applications.
  • Clock Management — Family-level clocking resources include four phase-locked loops (PLLs) with multiple outputs and dynamic reconfiguration capability for flexible clock synthesis and distribution.
  • Low-Power Family Architecture — Cyclone III family emphasizes low power through TSMC low-power process technology and silicon/software optimizations, helping to extend battery life and reduce system cooling requirements.
  • System Reliability and Diagnostics — Family features include error-detection circuitry to monitor configuration memory integrity and detect single-event upsets (SEUs).
  • Embedded Processing and IP — Supports the Cyclone III family’s ecosystem, including the Nios® II embedded processor and a broad collection of pre-built, verified IP cores.
  • RoHS Compliant — Device is RoHS compliant.

Typical Applications

  • High-volume, cost-sensitive consumer products — Use the device where low power and low cost are priorities while retaining significant programmable logic and memory resources.
  • Portable and battery-powered systems — Low-voltage architecture and family-level low-power optimizations help extend battery life in handheld and portable designs.
  • Embedded processing and custom peripherals — Integrate Nios® II soft processors and pre-built IP to implement application-specific control, protocol handling, or preprocessing functions.
  • Interface and I/O-heavy systems — High I/O count and flexible I/O standards on the Cyclone III family make the device suitable for designs requiring extensive external interfacing.

Unique Advantages

  • Significant logic capacity: 55,856 logic elements enable dense custom logic and feature integration on a single device, reducing BOM complexity.
  • Substantial on-chip memory: Approximately 2.4 Mbits of embedded RAM supports buffering, packet processing, and local data storage without external memory.
  • High I/O in a compact footprint: 327 I/Os in a 484‑FBGA (484‑UBGA, 19×19) package delivers broad connectivity while conserving PCB area.
  • Low-voltage, power-aware operation: 1.15–1.25 V supply range and Cyclone III low-power design features help minimize system power consumption.
  • Flexible clocking and reconfiguration: Multiple PLLs with dynamic reconfiguration provide robust clock management for diverse subsystems and interfaces.
  • Established ecosystem: Access to Nios® II soft-core support and a wide selection of pre-verified IP cores accelerates development and reduces time-to-market.

Why Choose EP3C55U484C6?

The EP3C55U484C6 presents a balanced combination of programmable logic density, embedded memory, and I/O capability in a low-power Cyclone III architecture suitable for commercial, cost-sensitive designs. Its integration of clocking resources, on-chip memory, and a rich IP ecosystem makes it a practical choice for teams seeking to consolidate functionality, shorten BOMs, and accelerate development cycles.

Choose EP3C55U484C6 for projects that require substantial logic and memory resources, high I/O counts, and low-voltage operation within the commercial temperature range, backed by the Cyclone III device family features and platform support.

Request a quote or submit an inquiry to our sales team to check availability, lead times, and pricing for EP3C55U484C6. Provide your requirements and application details to receive tailored assistance and a formal quote.

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