EP3C55U484C7N

IC FPGA 327 I/O 484UBGA
Part Description

Cyclone® III Field Programmable Gate Array (FPGA) IC 327 2396160 55856 484-FBGA

Quantity 1,209 Available (as of May 5, 2026)
Product CategoryField Programmable Gate Array (FPGA)
ManufacturerIntel
Manufacturing StatusActive
Manufacturer Standard Lead Time26 Weeks
Datasheet

Specifications & Environmental

Device Package484-UBGA (19x19)GradeCommercialOperating Temperature0°C – 85°C
Package / Case484-FBGANumber of I/O327Voltage1.15 V - 1.25 V
Mounting MethodSurface MountRoHS ComplianceRoHS CompliantREACH ComplianceREACH Unaffected
Moisture Sensitivity Level3 (168 Hours)Number of LABs/CLBs3491Number of Logic Elements/Cells55856
Number of GatesN/AECCN3A991DHTS Code8542.39.0001
QualificationN/ATotal RAM Bits2396160

Overview of EP3C55U484C7N – Cyclone III FPGA, 55,856 logic elements, 484-FBGA

The EP3C55U484C7N is a Cyclone III field-programmable gate array (FPGA) in a 484-FBGA package designed for high-volume, low-power, cost-sensitive applications. Built on the Cyclone III device family architecture, it combines a high logic count and on-chip memory with robust I/O capacity and low static power characteristics.

This device is suited to commercial applications that require substantial programmable logic, significant embedded memory, and broad interfacing options while operating within a 0 °C to 85 °C commercial temperature range and a 1.15 V to 1.25 V core supply window.

Key Features

  • Logic Capacity — 55,856 logic elements provide a large programmable fabric for customized digital logic, signal processing, and control functions.
  • Embedded Memory — Approximately 2.4 Mbits of on-chip RAM for buffering, FIFOs, and local data storage to reduce external memory requirements.
  • I/O and Packaging — 327 user I/Os in a 484-FBGA (484-UBGA, 19×19) footprint; surface-mount package suitable for dense PCB layouts.
  • Low-Power Architecture — Cyclone III family optimizations and TSMC low-power process enable low static power consumption (family reference to less than ¼ watt static power), helping extend battery life and reduce cooling needs.
  • Clock Management — Four phase-locked loops (PLLs) per device give flexible clock synthesis and management for internal logic and external interfaces.
  • Voltage and Thermal Range — Core supply 1.15 V to 1.25 V and operating temperature 0 °C to 85 °C (commercial grade) to match typical commercial system environments.
  • Design Ecosystem — Cyclone III family includes support for embedded processing and a library of pre-built IP cores and design tools (family-level capability) to accelerate development.
  • Compliance — RoHS compliant for broad regulatory compatibility in commercial product assemblies.

Typical Applications

  • Portable and Handheld Devices — Low static power and the Cyclone III low-power design help extend battery life while providing significant programmable logic for device control and signal handling.
  • Communications and Networking — High logic density, on-chip RAM, and multiple PLLs enable protocol processing, packet buffering, and clock domain management.
  • Consumer Electronics — Large I/O count and flexible packaging support display interfaces, sensor aggregation, and user-interface control in compact commercial products.
  • Embedded Control and Processing — On-chip memory and family-level support for embedded processors and IP cores make this device suitable for control, data acquisition, and system orchestration tasks.

Unique Advantages

  • High Integration: 55,856 logic elements and approximately 2.4 Mbits of embedded memory reduce the need for external logic and memory components, simplifying BOM and board layout.
  • Large I/O Count: 327 I/Os in a compact 484-FBGA package provide flexible interfacing for multi-signal systems and high-density connectors.
  • Power-Efficient Operation: Family-level low-power process and silicon optimizations support low static power consumption, helping lower system power budgets.
  • Robust Clocking: Four PLLs per device enable complex clocking schemes, frequency synthesis, and jitter management without additional external components.
  • Commercial Temperature Suitability: Qualified for 0 °C to 85 °C operation, aligning with typical commercial product requirements.
  • Design Acceleration: Cyclone III family support for pre-built IP and development tools helps shorten development cycles and enable reuse across projects.

Why Choose EP3C55U484C7N?

The EP3C55U484C7N delivers a balanced combination of high programmable logic capacity, on-chip memory, and extensive I/O in a compact 484-FBGA package optimized for commercial applications. Its Cyclone III family heritage emphasizes low-power operation and a mature design ecosystem, making it a practical choice for teams developing cost-sensitive, power-aware products that still require significant integration and flexibility.

This part is well suited to designers targeting portable electronics, communications equipment, consumer products, and embedded control systems who need scalable programmable logic, readily available IP and tools, and predictable commercial-grade operating limits.

Request a quote or submit an inquiry to obtain pricing and availability for EP3C55U484C7N and to discuss how this Cyclone III FPGA can fit into your next design.

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