EP3C55U484C7

The EP3C55U484C7 is an Intel Cyclone III family field-programmable gate array (FPGA) offered in a 484‑FBGA package. It combines mid-range logic capacity with on-chip memory and a high I/O count for cost-sensitive, low-power designs.

Built to address high-volume and power-conscious markets, this Cyclone III device is suited for applications that require flexible logic integration, multiple system interfaces, and compact packaging for surface-mount assembly.

Key Features

• Logic Capacity — 55,856 logic elements (LEs) to consolidate glue logic, control functions, and custom processing on a single device.
• Embedded Memory — Approximately 2.4 Mbits of on-chip RAM for buffering, FIFOs, and small data stores without external memory.
• I/O Density — 327 user I/O pins to support diverse interfaces and peripherals.
• Power Supply — Core supply range of 1.15 V to 1.25 V, compatible with low-voltage system rails.
• Package & Mounting — 484‑FBGA (supplier package: 484‑UBGA, 19×19) in a surface-mount form factor for compact PCB layouts.
• Operating Range & Grade — Commercial grade with an operating temperature range of 0 °C to 85 °C.
• Regulatory — RoHS compliant for lead‑free assembly processes.
• Cyclone III Family Capabilities — Family-level features emphasize low power operation and system integration (including multiple PLLs and broad I/O standard support) to optimize power and interface flexibility in end applications.

Typical Applications

• Portable and Handheld Electronics — Low-voltage core and family-focused low-power characteristics help extend battery life while integrating control and interface logic.
• Industrial and Commercial Control — Use for sensor aggregation, motor control interfaces, and user-interface glue logic where commercial temperature range is appropriate.
• Communications and Networking — On-chip RAM and a high I/O count support packet buffering, protocol bridging, and custom interface logic.
• Video and Imaging Subsystems — Logic capacity and embedded memory enable processing blocks, buffering, and custom timing control in compact hardware designs.

Unique Advantages

• High Logic Density: 55,856 logic elements allow consolidation of multiple discrete functions into a single FPGA, reducing BOM and board area.
• Substantial On‑Chip Memory: Approximately 2.4 Mbits of embedded RAM reduce dependency on external memory for mid‑range buffering and data paths.
• Extensive I/O: 327 user I/Os provide flexibility to connect sensors, peripherals, and high-speed interfaces without additional interface chips.
• Compact Surface‑Mount Package: 484‑FBGA (19×19 UBGA) enables dense PCB layouts in space-constrained designs.
• Low‑Voltage Core Operation: 1.15–1.25 V supply range supports modern low-voltage system architectures and helps lower overall power consumption.
• RoHS Compliant: Suitable for lead‑free manufacturing flows and global environmental requirements.

Why Choose EP3C55U484C7?

The EP3C55U484C7 delivers a balance of mid-range logic capacity, on-chip memory, and a high I/O count in a compact surface-mount FBGA package—making it well suited to designers targeting cost- and power-sensitive electronic products. Its Cyclone III family lineage emphasizes low-power operation and system integration features that help reduce component count and simplify board-level design.

This part is ideal for teams building high-volume consumer, commercial, and embedded systems that require flexible programmable logic, multiple interfaces, and compact packaging with RoHS compliance and commercial temperature operation.

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