EP3C55U484C6N

The EP3C55U484C6N is a Cyclone® III field programmable gate array (FPGA) in a 484-FBGA (484-UBGA 19×19) package. It provides mid-range logic density with 55,856 logic elements, approximately 2.396 Mbits of embedded memory, and 327 user I/Os for designs that require a balance of integration, I/O capacity, and low-power operation.

Built on the Cyclone III device family architecture, this commercial-grade, RoHS-compliant device targets cost-sensitive, high-volume and low-power applications where compact packaging, on-chip memory, and flexible I/O are important design drivers.

Key Features

• Logic Capacity  55,856 logic elements to implement mid-range combinational and sequential logic designs.
• Embedded Memory  Approximately 2.396 Mbits of on-chip RAM for buffering, FIFOs, and small memory structures without external memory.
• I/O Resources  327 user I/Os to support dense peripheral interfacing and multi-channel I/O requirements.
• Power Supply  Core voltage range 1.15 V to 1.25 V, enabling low-power operation consistent with Cyclone III family goals.
• Package and Mounting  484-FBGA (484-UBGA, 19×19) surface-mount package for high pin-count in a compact footprint.
• Operating Range & Grade  Commercial grade device specified for 0 °C to 85 °C operation and RoHS compliant.
• Cyclone III Family Capabilities  Family-level features include low-power process optimizations, four phase-locked loops (PLLs) per device for robust clock management, and a wide collection of pre-built IP cores for accelerated design.

Typical Applications

• Portable and Handheld Devices  Low-power architecture helps extend battery life for handheld applications requiring programmable logic and embedded memory.
• High‑I/O Embedded Systems  High I/O count supports multi-channel sensor interfaces, parallel peripherals, and board-level aggregation tasks where many signals must be routed to a single device.
• Cost‑Sensitive Consumer Electronics  Mid-range logic capacity and on-chip memory enable integration of control, glue logic, and data buffering while managing BOM cost.
• Clocked Logic and Interface Bridging  On-chip PLLs provide flexible clock synthesis and distribution for bridging between clock domains and managing I/O timing requirements.

Unique Advantages

• Highly integrated mid-range FPGA: 55,856 logic elements together with approximately 2.396 Mbits of embedded RAM reduce the need for external logic and memory components.
• Substantial I/O capacity: 327 user I/Os simplify board-level design by consolidating multiple interfaces into a single device.
• Compact, manufacturable package: 484-FBGA (19×19) surface-mount package offers dense pin count in a space-efficient footprint suitable for high-volume assembly.
• Low-power family heritage: Based on Cyclone III low-power process optimizations to help meet power budgets in thermally constrained or battery-powered applications.
• Clocking and design productivity: Four on-chip PLLs and the Cyclone III ecosystem of pre-built IP cores provide clock management and accelerated development options.
• Commercial readiness and compliance: Commercial temperature grade (0 °C to 85 °C) and RoHS compliance for mainstream electronic product deployment.

Why Choose EP3C55U484C6N?

The EP3C55U484C6N positions itself as a balanced solution for designers who need substantial mid-range logic capacity, meaningful on-chip memory, and a high I/O count in a compact 484-FBGA package. Its Cyclone III family characteristics—focused on low power and practical system integration—make it suited for cost-sensitive, high-volume embedded designs where power, board area, and I/O consolidation matter.

Backed by the Cyclone III device family ecosystem and available IP, this device is appropriate for teams looking to accelerate development while keeping system-level component count and power consumption under control.

If you require pricing or availability for EP3C55U484C6N, request a quote or submit an inquiry to obtain current lead-time and ordering information.