EP3C55U484C8

The EP3C55U484C8 is a Cyclone® III field programmable gate array (FPGA) offered by Intel. It delivers 55,856 logic elements with approximately 2.4 Mbits of embedded memory, 327 user I/Os, and a compact 484‑FBGA (484‑UBGA 19×19) package for space‑conscious designs.

Designed for high‑volume, low‑power, cost‑sensitive applications, this commercial‑grade device operates from 1.15 V to 1.25 V and across an operating temperature range of 0 °C to 85 °C. It is RoHS compliant and suitable where integration, I/O density, and low static power are priorities.

Key Features

• Logic Capacity 55,856 logic elements provide substantial programmable fabric for complex digital logic, control, and glue‑logic tasks.
• Embedded Memory Approximately 2.4 Mbits of on‑chip RAM supports buffering, lookup tables, and small data stores without external memory.
• I/O Density and Standards 327 user I/Os enable broad external interfacing. The Cyclone III family supports a wide range of I/O standards (LVTTL, LVCMOS, SSTL, HSTL, PCI, LVDS variants, and others) to accommodate varied signaling requirements.
• Low‑Voltage Operation Core supply range of 1.15 V to 1.25 V supports low static power operation consistent with the Cyclone III low‑power device family.
• Clocking and System Management Family features include multiple PLLs and dynamic clocking capabilities for robust clock management and interface timing (family‑level specification).
• Package and Mounting Surface mount 484‑FBGA (484‑UBGA 19×19) package offers a compact, high‑pin‑count solution for modern PCB layouts.
• Commercial Temperature Grade Rated for 0 °C to 85 °C operation, appropriate for commercial‑grade applications and environments.
• RoHS Compliant Conforms to RoHS requirements for lead‑free assembly and environmental compliance.

Typical Applications

• Portable and Handheld Devices — Low‑voltage operation and Cyclone III low‑power design make this FPGA suitable for battery‑sensitive consumer and portable products.
• Consumer and Industrial Control — High logic capacity and abundant I/Os enable motor control, sensor interfacing, and custom control logic implementations.
• Communications and Networking — Dense I/O and programmable fabric support protocol bridging, interface adaptation, and control plane functions.
• Embedded Processing and Peripherals — On‑chip memory and Cyclone III family support for embedded processors enable compact system integration and offload of dedicated tasks.

Unique Advantages

• Highly Integrated Fabric: 55,856 logic elements with embedded memory reduce the need for external glue logic and memory, lowering BOM complexity.
• High I/O Count: 327 user I/Os provide flexibility to connect multiple peripherals, sensors, and high‑speed links without external multiplexers.
• Compact, High‑Pin Package: 484‑FBGA (19×19) delivers high connectivity in a small footprint for dense board layouts.
• Low‑Voltage, Low‑Power Operation: 1.15 V to 1.25 V core supply and Cyclone III family optimizations support reduced static power consumption.
• Commercial‑Grade Reliability: Specified for 0 °C to 85 °C operation and RoHS compliance for mainstream product development.
• Family Ecosystem: Built on the Cyclone III device family platform, with documented clock management and system features that streamline design integration.

Why Choose EP3C55U484C8?

The EP3C55U484C8 positions itself as a high‑capacity, low‑voltage Cyclone III FPGA for designers who need a balance of programmable logic, embedded memory, and extensive I/O in a compact package. Its commercial temperature rating, RoHS compliance, and family‑level low‑power characteristics make it suitable for cost‑sensitive, high‑volume applications where integration and interface flexibility matter.

Engineers targeting portable products, consumer and industrial controls, or communication interfaces will find the device’s combination of logic density, on‑chip RAM, and 327 I/Os useful for consolidating functions and reducing external components while leveraging the Cyclone III device family capabilities.

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