EP3C5E144A7N

IC FPGA 94 I/O 144EQFP
Part Description

Cyclone® III Field Programmable Gate Array (FPGA) IC 94 423936 5136 144-LQFP Exposed Pad

Quantity 1,169 Available (as of October 8, 2026)
Product CategoryField Programmable Gate Array (FPGA)
ManufacturerIntel
Manufacturing StatusActive
Manufacturer Standard Lead Time26 Weeks
Datasheet

Specifications & Environmental

Device Package144-EQFP (20x20)GradeAutomotiveOperating Temperature-40°C – 125°C
Package / Case144-LQFP Exposed PadNumber of I/O94Voltage1.15 V - 1.25 V
Mounting MethodSurface MountRoHS ComplianceRoHS CompliantREACH ComplianceREACH Unaffected
Moisture Sensitivity Level3 (168 Hours)Number of LABs/CLBs321Number of Logic Elements/Cells5136
Number of GatesN/AECCNEAR99HTS Code8542.39.0001
QualificationAEC-Q100Total RAM Bits423936

Overview of EP3C5E144A7N – Cyclone® III FPGA, 5,136 Logic Elements, 144‑LQFP

The EP3C5E144A7N is a Cyclone® III field programmable gate array (FPGA) IC designed for low-power, high-functionality applications. This device provides 5,136 logic elements with approximately 0.42 Mbits of embedded memory, making it suitable for cost- and power-sensitive high-volume designs.

Manufactured to automotive-grade standards with AEC‑Q100 qualification, the device supports a 1.15 V to 1.25 V core supply range, up to 94 user I/Os, and a 144‑LQFP exposed pad surface-mount package for compact system integration across temperature ranges from −40 °C to 125 °C.

Key Features

  • Core Logic 5,136 logic elements (LEs) derived from the Cyclone III architecture providing a balance of functionality and low power for mid-range FPGA applications.
  • Embedded Memory Approximately 0.42 Mbits of on-chip RAM, enabling local buffering and deterministic data handling without external memory for many control and interface tasks.
  • I/O Capability Up to 94 general-purpose I/Os in a 144‑LQFP exposed pad package, supporting flexible interfacing to peripherals and system buses.
  • Power and Voltage Core supply voltage range of 1.15 V to 1.25 V to match system power budgets and enable low-power operation.
  • Automotive Qualification AEC‑Q100 qualified and specified for automotive-grade operation, with an operating temperature range of −40 °C to 125 °C.
  • Package and Mounting 144‑LQFP (20 × 20) exposed pad package, surface-mount mounting type for robust thermal performance and board-level assembly.
  • Compliance RoHS‑compliant for lead-free manufacturing and environmental compliance.
  • Cyclone III Family Capabilities Based on the Cyclone III device family, offering design features aimed at low power consumption and high integration for cost-sensitive applications.

Typical Applications

  • Automotive Systems Engineered for automotive environments (AEC‑Q100), suitable for in-vehicle control modules and sensor interfacing where extended temperature range and reliability are required.
  • Industrial Control Mid-range control and monitoring systems that benefit from on-chip memory and flexible I/O for deterministic real-time processing.
  • Portable and Low‑Power Electronics Designs that prioritize low static power and compact packaging for battery-powered or thermally constrained applications.
  • Embedded Interfaces Bridge and interface functions requiring a moderate number of I/Os and localized memory to reduce external component count.

Unique Advantages

  • Automotive-Grade Qualification: AEC‑Q100 qualification and −40 °C to 125 °C operating range enable deployment in demanding automotive applications.
  • Balanced Logic and Memory: 5,136 logic elements with approximately 0.42 Mbits of embedded RAM provide a practical mix for control, interfacing, and protocol handling.
  • Compact, Assembly-Ready Package: 144‑LQFP exposed pad surface-mount package supports efficient PCB routing and thermal dissipation in space-constrained designs.
  • Low-Power Operation: Cyclone III family design emphasis on low static power aligns with battery-powered and thermally constrained system requirements.
  • Flexible I/O Count: 94 I/Os give designers the flexibility to connect multiple peripherals or buses without immediate external logic expansion.
  • Regulatory and Environmental Compliance: RoHS compliance supports lead‑free manufacturing and regulatory alignment.

Why Choose EP3C5E144A7N?

The EP3C5E144A7N positions Cyclone III family functionality into an automotive-qualified, mid-density FPGA package ideal for customers needing a balanced combination of logic capacity, on-chip memory, and I/O in a compact surface-mount form factor. Its AEC‑Q100 qualification and wide operating temperature range make it appropriate for long-term, reliable deployment in automotive and industrial environments.

For design teams focused on cost-sensitive, low-power solutions, this device offers a practical integration point to reduce external components while maintaining the configurability and system-level flexibility inherent to FPGA-based designs.

Request a quote or submit an inquiry to receive pricing, availability, and assistance integrating EP3C5E144A7N into your next design.

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