EP3C5E144A7N
| Part Description |
Cyclone® III Field Programmable Gate Array (FPGA) IC 94 423936 5136 144-LQFP Exposed Pad |
|---|---|
| Quantity | 1,169 Available (as of October 8, 2026) |
| Product Category | Field Programmable Gate Array (FPGA) |
|---|---|
| Manufacturer | Intel |
| Manufacturing Status | Active |
| Manufacturer Standard Lead Time | 26 Weeks |
| Datasheet |
Specifications & Environmental
| Device Package | 144-EQFP (20x20) | Grade | Automotive | Operating Temperature | -40°C – 125°C | ||
|---|---|---|---|---|---|---|---|
| Package / Case | 144-LQFP Exposed Pad | Number of I/O | 94 | Voltage | 1.15 V - 1.25 V | ||
| Mounting Method | Surface Mount | RoHS Compliance | RoHS Compliant | REACH Compliance | REACH Unaffected | ||
| Moisture Sensitivity Level | 3 (168 Hours) | Number of LABs/CLBs | 321 | Number of Logic Elements/Cells | 5136 | ||
| Number of Gates | N/A | ECCN | EAR99 | HTS Code | 8542.39.0001 | ||
| Qualification | AEC-Q100 | Total RAM Bits | 423936 |
Overview of EP3C5E144A7N – Cyclone® III FPGA, 5,136 Logic Elements, 144‑LQFP
The EP3C5E144A7N is a Cyclone® III field programmable gate array (FPGA) IC designed for low-power, high-functionality applications. This device provides 5,136 logic elements with approximately 0.42 Mbits of embedded memory, making it suitable for cost- and power-sensitive high-volume designs.
Manufactured to automotive-grade standards with AEC‑Q100 qualification, the device supports a 1.15 V to 1.25 V core supply range, up to 94 user I/Os, and a 144‑LQFP exposed pad surface-mount package for compact system integration across temperature ranges from −40 °C to 125 °C.
Key Features
- Core Logic 5,136 logic elements (LEs) derived from the Cyclone III architecture providing a balance of functionality and low power for mid-range FPGA applications.
- Embedded Memory Approximately 0.42 Mbits of on-chip RAM, enabling local buffering and deterministic data handling without external memory for many control and interface tasks.
- I/O Capability Up to 94 general-purpose I/Os in a 144‑LQFP exposed pad package, supporting flexible interfacing to peripherals and system buses.
- Power and Voltage Core supply voltage range of 1.15 V to 1.25 V to match system power budgets and enable low-power operation.
- Automotive Qualification AEC‑Q100 qualified and specified for automotive-grade operation, with an operating temperature range of −40 °C to 125 °C.
- Package and Mounting 144‑LQFP (20 × 20) exposed pad package, surface-mount mounting type for robust thermal performance and board-level assembly.
- Compliance RoHS‑compliant for lead-free manufacturing and environmental compliance.
- Cyclone III Family Capabilities Based on the Cyclone III device family, offering design features aimed at low power consumption and high integration for cost-sensitive applications.
Typical Applications
- Automotive Systems Engineered for automotive environments (AEC‑Q100), suitable for in-vehicle control modules and sensor interfacing where extended temperature range and reliability are required.
- Industrial Control Mid-range control and monitoring systems that benefit from on-chip memory and flexible I/O for deterministic real-time processing.
- Portable and Low‑Power Electronics Designs that prioritize low static power and compact packaging for battery-powered or thermally constrained applications.
- Embedded Interfaces Bridge and interface functions requiring a moderate number of I/Os and localized memory to reduce external component count.
Unique Advantages
- Automotive-Grade Qualification: AEC‑Q100 qualification and −40 °C to 125 °C operating range enable deployment in demanding automotive applications.
- Balanced Logic and Memory: 5,136 logic elements with approximately 0.42 Mbits of embedded RAM provide a practical mix for control, interfacing, and protocol handling.
- Compact, Assembly-Ready Package: 144‑LQFP exposed pad surface-mount package supports efficient PCB routing and thermal dissipation in space-constrained designs.
- Low-Power Operation: Cyclone III family design emphasis on low static power aligns with battery-powered and thermally constrained system requirements.
- Flexible I/O Count: 94 I/Os give designers the flexibility to connect multiple peripherals or buses without immediate external logic expansion.
- Regulatory and Environmental Compliance: RoHS compliance supports lead‑free manufacturing and regulatory alignment.
Why Choose EP3C5E144A7N?
The EP3C5E144A7N positions Cyclone III family functionality into an automotive-qualified, mid-density FPGA package ideal for customers needing a balanced combination of logic capacity, on-chip memory, and I/O in a compact surface-mount form factor. Its AEC‑Q100 qualification and wide operating temperature range make it appropriate for long-term, reliable deployment in automotive and industrial environments.
For design teams focused on cost-sensitive, low-power solutions, this device offers a practical integration point to reduce external components while maintaining the configurability and system-level flexibility inherent to FPGA-based designs.
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