EP3C5E144C8N

The EP3C5E144C8N is a Cyclone® III field programmable gate array (FPGA) IC from Intel, offering 5,136 logic elements and family-level low-power, high-functionality architecture. It is designed for cost- and power-sensitive commercial applications that require mid-range logic capacity, a moderate embedded memory footprint, and flexible I/O resources.

This surface-mount device in a 144-LQFP exposed pad package targets mainstream electronic designs where integration, power efficiency, and I/O density are important design drivers.

Key Features

• Logic Capacity — 5,136 logic elements driven by 321 CLBs provide mid-range programmable logic resources for control, glue-logic, and moderate processing tasks.
• On-chip Memory — 423,936 bits of embedded memory (approximately 0.42 Mbits) for buffering, small data stores, and local state retention.
• I/O Resources — 94 user I/Os in a package optimized for board-level routing and peripheral interfacing.
• Power — Core voltage supply range of 1.15 V to 1.25 V consistent with Cyclone III low-power device family characteristics.
• Package and Mounting — 144-LQFP with exposed pad (supplier package: 144-EQFP, 20 × 20) supplied for surface-mount PCB assembly and improved thermal path.
• Operating Range — Commercial temperature grade with specified operating range from 0 °C to 85 °C.
• RoHS Compliance — Device is RoHS compliant for environmental/lead-free requirements.
• Cyclone III Family Attributes — Family-level features include low-power operation and high memory-to-logic ratios, plus robust clock management options (family supports up to four PLLs) as described in the Cyclone III device documentation.

Typical Applications

• Portable and Handheld Devices — Mid-range logic and low-power family characteristics make the part suitable for battery-conscious, compact electronics.
• High-volume, Cost-sensitive Products — Cyclone III family positioning supports designs where low unit cost and efficient power use are primary constraints.
• I/O-Constrained Systems — With 94 user I/Os, this device fits designs requiring a balance of logic and moderate external interfacing, such as interface bridging or sensor aggregation.
• Embedded Control and Glue Logic — 5,136 logic elements and embedded memory enable control functions, protocol adaptation, and custom peripheral logic in commercial applications.

Unique Advantages

• Mid-range Integration: 5,136 logic elements and 321 CLBs deliver substantial programmable logic without moving to larger, more expensive packages.
• On-chip Memory Available: 423,936 bits (~0.42 Mbits) of embedded RAM supports local buffering and state retention, reducing external memory requirements.
• Compact Thermal-aware Package: 144-LQFP with exposed pad provides a small board footprint with an exposed thermal pad for improved heat transfer to PCB.
• Low-voltage Core: 1.15–1.25 V supply aligns with modern low-power FPGA operation practices and power budgets.
• RoHS Compliant: Meets lead-free directives for environmentally conscious manufacturing and procurement.
• Commercial Temperature Rating: 0 °C to 85 °C supports mainstream electronic products and consumer-facing applications.

Why Choose EP3C5E144C8N?

The EP3C5E144C8N delivers a balanced combination of mid-range logic capacity, embedded memory, and practical I/O count in a compact 144-LQFP exposed-pad package. It leverages Cyclone III family characteristics—low power and efficient integration—making it a practical choice for commercial designs where cost, power, and board area are constrained.

This part is well suited to engineers and procurement teams building battery-conscious, high-volume products or systems requiring reliable, mid-range programmable logic with straightforward thermal and mounting considerations. Its RoHS compliance and commercial temperature rating support standard manufacturing and deployment practices.

Request a quote or submit a procurement inquiry to check availability, lead time, and pricing for EP3C5E144C8N.