EP3C5F256A7N

The EP3C5F256A7N is a Cyclone® III family FPGA offering a low-power, highly integrated programmable logic solution. It provides 5,136 logic elements and approximately 0.4 Mbits of embedded memory in a 256-ball BGA package, targeting high-volume, low-power and cost-sensitive embedded designs.

Designed for systems that need a balance of logic capacity, I/O density and robust operating range, this device is suited for applications requiring flexible I/O, on-chip memory and automotive qualification for demanding temperature and reliability requirements.

Key Features

• Core and Architecture  Cyclone III family architecture optimized for low power operation and efficient logic utilization.
• Logic Capacity  5,136 logic elements provide a practical fabric for mid-range control, interface and glue-logic functions.
• Embedded Memory  Approximately 0.4 Mbits of on-chip RAM to support buffering, state machines and small data tables.
• I/O Density  182 general-purpose I/O pins for rich peripheral and interface connectivity in a single device.
• Power Supply  Core supply range 1.15 V to 1.25 V to match system power rails and optimize power consumption.
• Clocking and Integration  Family-level clock-management features (including PLL resources) facilitate clock synthesis and robust timing for multi-domain designs.
• Package and Mounting  256-LBGA package (supplier device package: 256-FBGA, 17×17); surface-mount mounting for compact PCB implementations.
• Operating Range  Extended operating temperature from −40 °C to 125 °C to support thermally demanding environments.
• Automotive Qualification  Device grade: Automotive with AEC‑Q100 qualification for applications that require automotive-grade component qualification.
• Compliance  RoHS‑compliant materials for regulatory and environmental alignment.

Typical Applications

• Automotive control and sensing  AEC‑Q100 qualification and −40 °C to 125 °C range make this device suitable for vehicle electronic subsystems where programmable logic and reliable operation are required.
• Portable and handheld devices  Low-power family characteristics support battery-powered equipment that needs on-chip logic and memory without high static power draw.
• High-density I/O systems  182 I/Os enable integration of multiple interfaces and peripheral control in communications or instrumentation designs.
• Embedded control and sensor aggregation  On-chip RAM and mid-range logic density support sensor fusion, preprocessing and custom state-machine logic.

Unique Advantages

• Balanced mid-range logic and memory: 5,136 logic elements paired with approximately 0.4 Mbits of embedded RAM deliver a practical combination for control and interface functions without over-sizing the BOM.
• High I/O count: 182 I/Os reduce external glue logic and simplify PCB routing for multi-peripheral systems.
• Automotive-grade qualification: AEC‑Q100 qualification provides documented supply-chain and device-level assurance for automotive applications.
• Robust temperature performance: −40 °C to 125 °C operating range supports thermally-challenging environments and extends deployment flexibility.
• Low-power family heritage: Cyclone III family design optimizations target low static power, helping reduce system power budgets for portable and always-on products.
• Compact package: 256-ball BGA in a 17×17 supplier footprint enables space-efficient PCB layouts for compact systems.

Why Choose EP3C5F256A7N?

The EP3C5F256A7N positions itself as a capable mid-range FPGA option where low power, a solid complement of logic resources and a high I/O count are required. Its automotive qualification and wide operating temperature range make it suitable for designs that must meet stricter environmental and reliability targets while retaining the flexibility of programmable logic.

As a member of the Cyclone III family, this device benefits from family-level development resources and architecture choices focused on power efficiency and system integration, delivering a practical balance between capability, integration and cost for embedded system designers and procurement teams.

Request a quote or contact sales to discuss availability, lead times and pricing for EP3C5F256A7N.