EP3C5F256C7N

The EP3C5F256C7N is an Intel Cyclone® III field programmable gate array (FPGA) supplied in a 256‑pin BGA package. It delivers 5,136 logic elements and approximately 0.42 Mbits of embedded memory, combined with 182 user I/Os and industry‑standard low‑power operation characteristics from the Cyclone III device family.

This device is intended for cost‑ and power‑sensitive commercial applications that require moderate logic density, on‑chip memory, and flexible I/O, packaged for surface‑mount assembly and RoHS compliance.

Key Features

• Logic Core 5,136 logic elements suitable for mid‑range programmable logic tasks; device family optimizations target low power consumption.
• Embedded Memory Approximately 0.42 Mbits of on‑chip RAM for buffers, FIFOs, and small lookup tables.
• I/O Capacity & Flexibility 182 user I/Os to support multiple interfaces and peripheral connections. The Cyclone III family supports a wide range of I/O standards (as described in the device handbook).
• Clock Management Family architecture includes up to four phase‑locked loops (PLLs) for clock generation and distribution (Cyclone III family feature).
• Power Supply Core voltage range specified at 1.15 V to 1.25 V to match system power rails and enable predictable power budgeting.
• Package & Mounting 256‑pin BGA package (256‑LBGA; supplier device package noted as 256‑FBGA 17×17) designed for surface‑mount assembly.
• Operating Conditions Commercial temperature grade with an operating range of 0 °C to 85 °C.
• Compliance RoHS compliant for environmental and assembly requirements.

Typical Applications

• Portable and handheld electronics — Mid‑range logic density and low‑power family characteristics suit battery‑sensitive products that require on‑device processing and interface control.
• Consumer and high‑volume products — Cost‑sensitive designs that need programmable logic and embedded memory for feature differentiation and BOM consolidation.
• Embedded control and glue logic — Use for protocol bridging, I/O expansion, and custom control functions where moderate logic and memory resources are adequate.

Unique Advantages

• Balanced logic and memory — 5,136 logic elements paired with roughly 0.42 Mbits of RAM provide a practical balance for mid‑range designs without excessive resource overhead.
• High I/O count — 182 user I/Os enable multiple peripheral interfaces and flexible board-level integration.
• Low‑power family heritage — Cyclone III family design emphasis on low power supports longer battery life and reduced cooling needs in commercial products.
• Robust clocking options — Family PLL features support diverse clocking and synchronization schemes for system and I/O timing.
• Commercial temperature and surface‑mount packaging — 256‑pin BGA in a surface‑mount form factor simplifies board assembly for mainstream electronic products.
• Regulatory readiness — RoHS compliance facilitates use in environments where lead‑free assembly is required.

Why Choose EP3C5F256C7N?

The EP3C5F256C7N positions itself as a practical Cyclone III FPGA option for designers targeting commercial, cost‑sensitive products that need mid‑level programmable logic, embedded memory, and a substantial I/O complement. Its combination of 5,136 logic elements, approximately 0.42 Mbits of on‑chip RAM, and 182 I/Os makes it suitable for system glue logic, interface bridging, and feature integration while maintaining a low‑power profile.

For teams focused on scalable designs and predictable manufacturing, this device’s surface‑mount 256‑pin BGA package, commercial temperature rating, and RoHS compliance provide a straightforward integration path with the broader Cyclone III family resources and documentation.

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