EP3C5F256C8N

The EP3C5F256C8N is an Intel Cyclone III family FPGA packaged in a 256-LBGA surface-mount package. It delivers a balanced set of resources—approximately 5,136 logic elements, about 0.424 Mbits of embedded memory, and 182 I/Os—targeted at high-volume, low-power, cost-sensitive designs.

Built on the Cyclone III device family architecture, this device is optimized for low static power and system integration, suited to portable and commercial electronic applications that require compact logic integration, flexible I/O, and predictable supply and thermal limits.

Key Features

• Logic Density — 5,136 logic elements (LEs) suitable for mid-range programmable logic integration and custom control functions.
• Embedded Memory — 423,936 total on-chip RAM bits, approximately 0.424 Mbits of embedded memory for FIFOs, buffers, and small data stores.
• I/O Capacity — 182 user I/Os to support multiple peripheral interfaces and board-level connectivity.
• Power Supply — Core voltage range 1.15 V to 1.25 V for predictable power budgeting in system designs.
• Package & Mounting — 256-LBGA (surface mount); supplier package listed as 256-FBGA (17×17) for compact board footprint.
• Operating Range — Commercial grade with operating temperature range 0 °C to 85 °C.
• Low-Power Family Characteristics — As part of the Cyclone III family, the device benefits from low-power process optimizations designed to minimize static power consumption in battery-powered and thermally constrained designs.
• System Integration Features — Cyclone III family-level features include multiple PLLs, high memory-to-logic ratio, and broad I/O standard support to simplify clocking and interface design (family-level information).
• Compliance — RoHS compliant.

Typical Applications

• Portable & Handheld Electronics — Low-power Cyclone III family characteristics help extend battery life in space-constrained portable products while providing on-chip logic and memory for application control.
• Consumer & Commercial Devices — Mid-range logic density and abundant I/Os enable user-interface control, peripheral aggregation, and protocol bridging in consumer and commercial equipment.
• Communication & Interface Modules — Flexible I/O and embedded memory support data buffering and custom interface logic in compact communication modules.
• High-Volume, Cost-Sensitive Designs — Family emphasis on low-cost implementation makes the device suitable for applications where unit cost and power are primary constraints.

Unique Advantages

• Balanced Resource Set: Approximately 5,136 logic elements combined with ~0.424 Mbits of on-chip RAM offers a practical mix of logic and memory for mid-range designs without external memory.
• Broad I/O Count: 182 I/Os enable consolidation of multiple peripherals and interfaces, reducing the need for additional interface ICs and simplifying board routing.
• Compact Packaging: 256-LBGA (256-FBGA 17×17) enables dense PCB designs and supports surface-mount assembly workflows.
• Predictable Power Envelope: Specified core voltage range (1.15 V–1.25 V) and Cyclone III low-power family attributes aid in power budgeting for portable and thermally constrained systems.
• Commercial Temperature Suitability: Rated for 0 °C to 85 °C, aligning with a wide range of consumer and commercial product environments.
• RoHS Compliance: Conforms to RoHS requirements to meet common regulatory and manufacturing needs.

Why Choose EP3C5F256C8N?

The EP3C5F256C8N provides a practical, mid-range FPGA solution for designers targeting low-power, cost-conscious products that still require meaningful logic and memory resources. Its combination of approximately 5,136 logic elements, roughly 0.424 Mbits of embedded RAM, and 182 I/Os in a compact 256-LBGA package makes it well suited to commercial consumer and portable applications where board space, power, and BOM cost are key considerations.

As a member of the Cyclone III family, it benefits from architecture optimizations focused on low static power and system integration, helping teams scale designs and leverage family-level features for clocking and interface tasks while maintaining predictable supply and thermal requirements.

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