EP3C5F256C8

The EP3C5F256C8 is a Cyclone III field-programmable gate array (FPGA) IC offered in a 256-LBGA package. It belongs to the Cyclone III device family and targets high-volume, low-power, cost-sensitive applications that need a balance of logic resources, on-chip memory, and versatile I/O.

Built on the Cyclone III family architecture, this device provides a compact, commercial-grade FPGA solution with 5,136 logic elements and substantial on-chip RAM to support mid-range embedded logic, glue logic, and I/O-intensive functions.

Key Features

• Core Architecture  Cyclone III family FPGA architecture designed for low power and integration as described in the device handbook.
• Logic Capacity  5,136 logic elements suitable for mid-range logic implementations and user-defined digital functions.
• Embedded Memory  Approximately 0.4 Mbits (423,936 bits) of on-chip RAM for buffers, FIFOs, and small data storage.
• I/O Count & Standards  182 user I/Os supporting a wide range of I/O standards suited for versatile system interfacing (family-level supported I/O standards include LVTTL, LVCMOS, SSTL, HSTL, PCI, LVPECL, LVDS and more).
• Clock Management  Family-level support for four phase-locked loops (PLLs) per device to consolidate clocking and reduce external components.
• Power Supply  Core voltage supply range 1.15 V to 1.25 V to match Cyclone III device requirements.
• Package & Mounting  256-LBGA package (supplier device package listed as 256-FBGA 17×17) with surface-mount mounting for compact PCB designs.
• Operating Range & Grade  Commercial grade with an operating temperature range of 0 °C to 85 °C.
• RoHS Compliant  Environmentally compliant (RoHS) for global assembly and manufacturing requirements.

Typical Applications

• High-volume, cost-sensitive products  Suited to designs that require low-power, integrated FPGA functionality while controlling BOM cost and form factor.
• Battery-powered and portable systems  Low-power characteristics of the Cyclone III family make the device appropriate for handheld and portable applications where power budget matters.
• I/O-constrained designs  High user I/O count supports bridging, protocol translation, and interface consolidation in systems with diverse peripheral standards.
• Embedded logic and peripheral control  Mid-range logic and on-chip RAM provide resources for control logic, data buffering, and small embedded subsystems.

Unique Advantages

• Balanced logic and memory  5,136 logic elements paired with approximately 0.4 Mbits of embedded RAM allow compact implementations of mixed control and data-path functions.
• Broad I/O flexibility  182 I/Os and family-level support for many standards reduce external translator chips and simplify board-level design.
• Integrated clocking  On-chip PLL resources streamline clock management and reduce reliance on external clocking components.
• Compact surface-mount package  256-LBGA (256-FBGA 17×17) package enables dense PCB layouts while maintaining manufacturability for volume production.
• Commercial-grade thermal range  Rated 0 °C to 85 °C to align with typical commercial environment deployments.
• Regulatory readiness  RoHS compliance supports global manufacturing and assembly flows.

Why Choose EP3C5F256C8?

The EP3C5F256C8 brings Cyclone III family benefits—low-power operation, practical logic capacity, and flexible I/O—into a compact 256-LBGA package for commercial designs. Its combination of 5,136 logic elements, substantial on-chip RAM, and 182 user I/Os makes it a practical choice for mid-range embedded systems, interface bridging, and cost-driven product lines.

This device is well suited for engineers and procurement teams looking for a commercial-grade FPGA that balances integration, power efficiency, and board-level flexibility while leveraging documented Cyclone III family features for predictable system behavior and design reuse.

Request a quote or submit a pricing and availability inquiry to receive lead-time and quantity pricing for the EP3C5F256C8.