EP3C5M164C7N

The EP3C5M164C7N is an Intel Cyclone® III field programmable gate array (FPGA) packaged in a 164‑TFBGA (164‑MBGA 8×8) surface‑mount package. It delivers 5,136 logic elements, approximately 0.404 Mbits of embedded memory, and 106 user I/Os in a low‑power FPGA architecture targeted at cost‑sensitive, high‑volume designs.

Built on the Cyclone III device family, this FPGA emphasizes low power consumption and system integration—making it suitable for designs that require on‑chip memory, flexible I/O, and compact packaging while operating from a 1.15 V to 1.25 V supply over a 0 °C to 85 °C commercial temperature range.

Key Features

• Core Logic  5,136 logic elements enable mid‑range programmable logic capacity for control, glue logic, and custom processing functions.
• Embedded Memory  Total on‑chip RAM of 423,936 bits (approximately 0.404 Mbits) supports local buffers, FIFOs, and small data tables without external memory.
• I/O Count & Flexibility  106 user I/Os provide broad connectivity for sensors, peripherals, and external interfaces; the Cyclone III family supports a wide collection of I/O standards for flexible board‑level integration.
• Clock Management  Cyclone III devices include multiple PLLs for clock synthesis and distribution, enabling robust clocking schemes for system and interface timing.
• Low‑Voltage Operation  Nominal supply range of 1.15 V to 1.25 V reduces power draw and aligns with low‑power system rails.
• Package & Mounting  164‑TFBGA (164‑MBGA, 8×8) surface‑mount package offers a compact footprint for space‑constrained PCBs.
• Commercial Temperature Grade  Rated for 0 °C to 85 °C operation for mainstream consumer and industrial‑adjacent applications.
• RoHS Compliant  Meets RoHS requirements for lead‑free manufacturing and assembly.

Typical Applications

• Portable and Handheld Devices  Low‑power Cyclone III technology and low nominal supply voltage make this FPGA suitable for battery‑sensitive and portable applications that require programmable logic.
• Consumer and Embedded Systems  Use for user interface control, peripheral aggregation, or custom protocol bridging where moderate logic density and local memory are required.
• I/O‑Intensive Interfaces  With 106 I/Os and family support for multiple I/O standards, the device is well matched to sensor hubs, display interfaces, and mixed‑signal front ends.
• System Integration and Prototyping  On‑chip memory and clock management resources support embedded processing, control functions, and rapid hardware iteration in mid‑range designs.

Unique Advantages

• Balanced Logic and Memory: 5,136 logic elements paired with approximately 0.404 Mbits of embedded RAM provide on‑chip resources for control and buffering without immediate need for external memory.
• Compact, Solderable Package: 164‑TFBGA surface‑mount package enables dense PCB layouts while maintaining a standard assembly flow.
• Low‑Voltage, Low‑Power Operation: 1.15 V–1.25 V supply range and Cyclone III family low‑power optimizations help reduce system power consumption.
• Flexible I/O Connectivity: 106 I/Os and family support for multiple I/O standards simplify integration with a broad set of peripherals and interfaces.
• Commercial Temperature Range: Rated 0 °C to 85 °C for mainstream applications where commercial grade operation is required.
• Standards‑Compliant Manufacturing: RoHS compliance supports lead‑free production and regulatory requirements.

Why Choose EP3C5M164C7N?

The EP3C5M164C7N combines Cyclone III family low‑power design with mid‑range logic capacity and embedded memory in a compact 164‑TFBGA package. It is positioned for designers who need a programmable, energy‑efficient FPGA with flexible I/O and on‑chip resources for cost‑sensitive, volume products.

This device is a practical choice for engineering teams developing portable electronics, consumer devices, and embedded systems that require configurable logic, local RAM, and robust clocking options within a commercial temperature window. Its RoHS compliance and surface‑mount form factor support standard manufacturing and assembly processes.

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