EP3C5F256I7

The EP3C5F256I7 is an Intel Cyclone® III family field programmable gate array (FPGA) offered in a 256‑ball LFBGA package and specified for industrial temperature operation. It integrates 5,136 logic elements and approximately 0.42 Mbits of embedded memory, delivering a compact, low‑power programmable fabric for mid‑range logic and I/O‑centric designs.

Designed for applications that require moderate logic density, extensive I/O and industrial temperature capability, this Cyclone III device balances integration and power efficiency while supporting the family’s low‑power process optimizations and system‑level features.

Key Features

• Logic Capacity — 5,136 logic elements provide the programmable resources needed for mid‑range control, glue‑logic and custom datapath implementations.
• Embedded Memory — Approximately 0.42 Mbits of on‑chip RAM for FIFOs, buffers and small lookup tables directly inside the FPGA fabric.
• I/O Resources — 182 user I/Os to support extensive peripheral, sensor and interface connectivity in dense I/O applications.
• Low‑Voltage Core — Core supply voltage range from 1.15 V to 1.25 V to match low‑power system designs.
• Industrial Temperature — Rated for operation from −40 °C to 100 °C for deployment in industrial and thermally demanding environments.
• Package — 256‑LBGA package (supplier device package noted as 256‑FBGA, 17×17) for compact board integration and high‑density routing.
• RoHS Compliant — Meets RoHS requirements for lead‑free assembly and environmentally responsible designs.
• Cyclone III Family Attributes — Built on the Cyclone III device family platform, leveraging the family’s low‑power process and device architecture for efficient system integration and clock management capabilities.

Typical Applications

• Industrial Control and Automation — Use the device for PLC logic, motor drive interface glue logic and sensor aggregation where extended temperature range and plentiful I/O are required.
• Embedded System Glue Logic — Implement custom interfacing, protocol bridging and peripheral controllers that benefit from on‑chip memory and abundant I/Os.
• Communications and Networking — Ideal for mid‑range data path functions, packet buffering and I/O adaptation in equipment with moderate logic and memory needs.
• Test and Measurement — Deploy for real‑time signal conditioning, timing control and custom data handling in industrial test fixtures and instrumentation.

Unique Advantages

• Balanced Logic and Memory: 5,136 logic elements paired with approximately 0.42 Mbits of embedded RAM provide the right mix for mid‑range designs without excessive board level memory.
• High I/O Count: 182 user I/Os simplify integration with sensors, actuators and external controllers, reducing the need for external I/O expanders.
• Industrial‑Grade Operation: Specified from −40 °C to 100 °C for reliable performance in demanding ambient and industrial environments.
• Low‑Voltage Core: 1.15 V to 1.25 V core supply supports low‑power system architectures and helps minimize overall power consumption.
• Compact Packaging: 256‑ball BGA footprint (256‑FBGA supplier reference, 17×17) enables space‑constrained board layouts while preserving routing density.
• Standards‑oriented Family Features: As a Cyclone III family device, it benefits from the family’s low‑power process and device architecture aimed at efficient system‑level integration.

Why Choose EP3C5F256I7?

The EP3C5F256I7 offers a practical balance of programmable logic, embedded memory and I/O density in a compact industrial‑rated package. It is suited to engineers who need a mid‑range FPGA solution for control, interface and data handling tasks where low‑power operation and industrial temperature capability are required.

Choosing this Cyclone III device gives access to a family of low‑power FPGA capabilities and an established device architecture, making it a reliable option for designers looking for scalable, manufacturable solutions with meaningful on‑chip resources.

Request a quote or submit an inquiry for EP3C5F256I7 to check availability, lead times and pricing for your next design.