EP3C5M164C8N
| Part Description |
Cyclone® III Field Programmable Gate Array (FPGA) IC 106 423936 5136 164-TFBGA |
|---|---|
| Quantity | 308 Available (as of May 5, 2026) |
| Product Category | Field Programmable Gate Array (FPGA) |
|---|---|
| Manufacturer | Intel |
| Manufacturing Status | Active |
| Manufacturer Standard Lead Time | 26 Weeks |
| Datasheet |
Specifications & Environmental
| Device Package | 164-MBGA (8x8) | Grade | Commercial | Operating Temperature | 0°C – 85°C | ||
|---|---|---|---|---|---|---|---|
| Package / Case | 164-TFBGA | Number of I/O | 106 | Voltage | 1.15 V - 1.25 V | ||
| Mounting Method | Surface Mount | RoHS Compliance | RoHS Compliant | REACH Compliance | REACH Unaffected | ||
| Moisture Sensitivity Level | 3 (168 Hours) | Number of LABs/CLBs | 321 | Number of Logic Elements/Cells | 5136 | ||
| Number of Gates | N/A | ECCN | EAR99 | HTS Code | 8542.39.0001 | ||
| Qualification | N/A | Total RAM Bits | 423936 |
Overview of EP3C5M164C8N – Cyclone® III FPGA, 5136 logic elements, 164-TFBGA
The EP3C5M164C8N is an Intel Cyclone III family field-programmable gate array (FPGA) in a 164-TFBGA package, offering mid-range programmable logic capacity and a compact footprint for commercial applications. It combines a low-power Cyclone III architecture with integrated memory and flexible I/O to address cost-sensitive, low-power designs.
Typical target uses include commercial embedded systems, interface bridging, and display or user-interface control where a balance of logic resources, on-chip memory, and I/O count are required. The device benefits from the Cyclone III family’s low-power process optimizations and architecture described in the device handbook.
Key Features
- Cyclone III low-power architecture Built on TSMC low-power (LP) process technology and silicon optimizations for reduced power consumption as described in the Cyclone III device handbook.
- Logic capacity Approximately 5,136 logic elements, providing mid-range programmable logic for control, glue-logic, and datapath functions.
- Embedded memory Approximately 0.424 Mbits of on-chip RAM (423,936 total RAM bits) for FIFOs, buffers, and small on-chip data storage.
- I/O capability 106 user I/Os to support multiple interfaces and peripheral connections on a single device.
- Clock management Cyclone III family architecture includes four phase-locked loops (PLLs) per device for flexible clock synthesis and distribution.
- Power supply Core operating voltage range of 1.15 V to 1.25 V to match system power-rail requirements.
- Package & mounting 164-TFBGA package (supplier device package listed as 164-MBGA, 8×8) with surface-mount mounting type for compact PCB integration.
- Temperature & grade Commercial grade device rated for 0 °C to 85 °C operation.
- Compliance RoHS compliant for regulatory and environmental compatibility.
Typical Applications
- Commercial embedded systems — Implement control logic, protocol handling, and peripheral interfacing in consumer and commercial products requiring mid-range programmable resources.
- Interface bridging and protocol conversion — Use the device’s 106 I/Os and programmable fabric to connect and translate between multiple digital interfaces.
- Display and user-interface control — Drive and manage displays, buttons, and indicators with integrated logic and on-chip memory for buffering and timing.
- Low-power portable electronics — Leverage the Cyclone III low-power architecture and modest logic/memory resources for battery-conscious applications.
Unique Advantages
- Balanced mid-range resources: Combines roughly 5,136 logic elements with ~0.424 Mbits of embedded memory to handle control logic and modest data buffering without over-specifying the bill of materials.
- Flexible I/O count: 106 user I/Os enable multiple peripheral connections and protocol implementations from a single device.
- Compact BGA packaging: 164-TFBGA (164-MBGA, 8×8) provides a small PCB footprint while preserving signal routing density.
- Low-voltage core: Operates on a 1.15 V–1.25 V core supply for compatibility with modern low-voltage power domains.
- Family-level low power: Benefits from Cyclone III low-power process technology and power-aware design features described in the device handbook, helping extend battery life and reduce cooling needs.
- Regulatory readiness: RoHS compliance supports environmental requirements for commercial products.
Why Choose EP3C5M164C8N?
The EP3C5M164C8N positions itself as a commercial-grade, mid-range Cyclone III FPGA that balances logic capacity, embedded memory, and I/O density in a space-efficient BGA package. It is suitable for designers who need programmable flexibility and low-power operation for commercial embedded products, interface logic, and user-interface subsystems.
Choosing this device provides access to the Cyclone III family architecture and its low-power optimizations while keeping BOM and board area constrained. The combination of 5,136 logic elements, approximately 0.424 Mbits of memory, 106 I/Os, and a 164-TFBGA package makes it a practical option for cost- and power-conscious designs.
Request a quote or submit an inquiry to receive pricing and lead-time information for EP3C5M164C8N and to discuss how this Cyclone III device fits your design requirements.

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