EP3C5M164C8N

IC FPGA 106 I/O 164MBGA
Part Description

Cyclone® III Field Programmable Gate Array (FPGA) IC 106 423936 5136 164-TFBGA

Quantity 308 Available (as of May 5, 2026)
Product CategoryField Programmable Gate Array (FPGA)
ManufacturerIntel
Manufacturing StatusActive
Manufacturer Standard Lead Time26 Weeks
Datasheet

Specifications & Environmental

Device Package164-MBGA (8x8)GradeCommercialOperating Temperature0°C – 85°C
Package / Case164-TFBGANumber of I/O106Voltage1.15 V - 1.25 V
Mounting MethodSurface MountRoHS ComplianceRoHS CompliantREACH ComplianceREACH Unaffected
Moisture Sensitivity Level3 (168 Hours)Number of LABs/CLBs321Number of Logic Elements/Cells5136
Number of GatesN/AECCNEAR99HTS Code8542.39.0001
QualificationN/ATotal RAM Bits423936

Overview of EP3C5M164C8N – Cyclone® III FPGA, 5136 logic elements, 164-TFBGA

The EP3C5M164C8N is an Intel Cyclone III family field-programmable gate array (FPGA) in a 164-TFBGA package, offering mid-range programmable logic capacity and a compact footprint for commercial applications. It combines a low-power Cyclone III architecture with integrated memory and flexible I/O to address cost-sensitive, low-power designs.

Typical target uses include commercial embedded systems, interface bridging, and display or user-interface control where a balance of logic resources, on-chip memory, and I/O count are required. The device benefits from the Cyclone III family’s low-power process optimizations and architecture described in the device handbook.

Key Features

  • Cyclone III low-power architecture  Built on TSMC low-power (LP) process technology and silicon optimizations for reduced power consumption as described in the Cyclone III device handbook.
  • Logic capacity  Approximately 5,136 logic elements, providing mid-range programmable logic for control, glue-logic, and datapath functions.
  • Embedded memory  Approximately 0.424 Mbits of on-chip RAM (423,936 total RAM bits) for FIFOs, buffers, and small on-chip data storage.
  • I/O capability  106 user I/Os to support multiple interfaces and peripheral connections on a single device.
  • Clock management  Cyclone III family architecture includes four phase-locked loops (PLLs) per device for flexible clock synthesis and distribution.
  • Power supply  Core operating voltage range of 1.15 V to 1.25 V to match system power-rail requirements.
  • Package & mounting  164-TFBGA package (supplier device package listed as 164-MBGA, 8×8) with surface-mount mounting type for compact PCB integration.
  • Temperature & grade  Commercial grade device rated for 0 °C to 85 °C operation.
  • Compliance  RoHS compliant for regulatory and environmental compatibility.

Typical Applications

  • Commercial embedded systems — Implement control logic, protocol handling, and peripheral interfacing in consumer and commercial products requiring mid-range programmable resources.
  • Interface bridging and protocol conversion — Use the device’s 106 I/Os and programmable fabric to connect and translate between multiple digital interfaces.
  • Display and user-interface control — Drive and manage displays, buttons, and indicators with integrated logic and on-chip memory for buffering and timing.
  • Low-power portable electronics — Leverage the Cyclone III low-power architecture and modest logic/memory resources for battery-conscious applications.

Unique Advantages

  • Balanced mid-range resources: Combines roughly 5,136 logic elements with ~0.424 Mbits of embedded memory to handle control logic and modest data buffering without over-specifying the bill of materials.
  • Flexible I/O count: 106 user I/Os enable multiple peripheral connections and protocol implementations from a single device.
  • Compact BGA packaging: 164-TFBGA (164-MBGA, 8×8) provides a small PCB footprint while preserving signal routing density.
  • Low-voltage core: Operates on a 1.15 V–1.25 V core supply for compatibility with modern low-voltage power domains.
  • Family-level low power: Benefits from Cyclone III low-power process technology and power-aware design features described in the device handbook, helping extend battery life and reduce cooling needs.
  • Regulatory readiness: RoHS compliance supports environmental requirements for commercial products.

Why Choose EP3C5M164C8N?

The EP3C5M164C8N positions itself as a commercial-grade, mid-range Cyclone III FPGA that balances logic capacity, embedded memory, and I/O density in a space-efficient BGA package. It is suitable for designers who need programmable flexibility and low-power operation for commercial embedded products, interface logic, and user-interface subsystems.

Choosing this device provides access to the Cyclone III family architecture and its low-power optimizations while keeping BOM and board area constrained. The combination of 5,136 logic elements, approximately 0.424 Mbits of memory, 106 I/Os, and a 164-TFBGA package makes it a practical option for cost- and power-conscious designs.

Request a quote or submit an inquiry to receive pricing and lead-time information for EP3C5M164C8N and to discuss how this Cyclone III device fits your design requirements.

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