EP3C5U256C6
| Part Description |
Cyclone® III Field Programmable Gate Array (FPGA) IC 182 423936 5136 256-LFBGA |
|---|---|
| Quantity | 13 Available (as of October 8, 2026) |
| Product Category | Field Programmable Gate Array (FPGA) |
|---|---|
| Manufacturer | Intel |
| Manufacturing Status | Active |
| Manufacturer Standard Lead Time | 26 Weeks |
| Datasheet |
Specifications & Environmental
| Device Package | 256-UBGA (14x14) | Grade | Commercial | Operating Temperature | 0°C – 85°C | ||
|---|---|---|---|---|---|---|---|
| Package / Case | 256-LFBGA | Number of I/O | 182 | Voltage | 1.15 V - 1.25 V | ||
| Mounting Method | Surface Mount | RoHS Compliance | RoHS non-compliant | REACH Compliance | REACH Unaffected | ||
| Moisture Sensitivity Level | 3 (168 Hours) | Number of LABs/CLBs | 321 | Number of Logic Elements/Cells | 5136 | ||
| Number of Gates | N/A | ECCN | EAR99 | HTS Code | 8542.39.0001 | ||
| Qualification | N/A | Total RAM Bits | 423936 |
Overview of EP3C5U256C6 – Cyclone® III Field Programmable Gate Array (FPGA) IC 182 423936 5136 256-LFBGA
The EP3C5U256C6 is a Cyclone III family FPGA offering a low-power, highly integrated programmable logic solution in a compact 256-LFBGA package. It delivers 5,136 logic elements, approximately 0.424 Mbits of embedded memory and 182 user I/Os, making it suitable for cost-sensitive, I/O‑rich commercial applications.
As part of the Cyclone III device family, this device is designed to balance functionality and power efficiency and includes family-level features such as advanced clock management and a broad collection of supported I/O standards for system integration and interface bridging.
Key Features
- Logic Capacity 5,136 logic elements to implement combinational and sequential logic, custom state machines, and glue logic.
- Embedded Memory Approximately 0.424 Mbits of on-chip RAM for FIFOs, buffers, and small data stores.
- I/O Resources 182 user I/Os to support multiple interfaces and parallel connections in I/O-constrained designs.
- Clock Management Family-level support includes up to four phase-locked loops (PLLs) for flexible clock synthesis and distribution.
- Low-Power Architecture Cyclone III family optimizations and TSMC low-power process technology target reduced static power for battery‑sensitive and thermally constrained designs.
- Voltage Supply Core operating range of 1.15 V to 1.25 V.
- Package & Mounting 256-LFBGA (supplier package: 256-UBGA, 14×14) in a surface-mount footprint for compact board layouts.
- Commercial Grade Specified for operation from 0 °C to 85 °C and supplied as a commercial-grade device.
- Standards & I/O Flexibility Cyclone III family support for a wide collection of I/O standards and on-chip termination calibration to aid signal integrity across PVT conditions.
- RoHS Compliant Manufactured to meet RoHS environmental compliance requirements.
Typical Applications
- Cost-sensitive consumer electronics Implements custom logic, peripheral control, and protocol bridging while maintaining low power and BOM cost.
- Embedded control and processing On-chip memory and logic capacity support control tasks, interface handling and lightweight embedded functions.
- Interface bridging and I/O expansion High I/O count and multiple supported standards make the device suitable for translating between system buses and adding parallel I/O.
- Clocked data interfaces Integrated PLLs enable clock synthesis and management for stable timing across multi-domain interfaces.
Unique Advantages
- Highly integrated logic and memory: Combines 5,136 logic elements with embedded RAM to reduce external components and streamline board design.
- Flexible I/O resources: 182 user I/Os support diverse interfaces and reduce the need for external multiplexers or translators.
- Power-aware family architecture: Cyclone III family design and low-power process choices help control static power for energy-sensitive applications.
- Compact, surface-mount package: 256-LFBGA (256-UBGA 14×14) enables dense PCB layouts and space-constrained designs.
- Commercial temperature rating: Qualified for 0 °C to 85 °C operation to meet typical commercial deployment environments.
- Standards support and system integration: Family-level support for multiple I/O standards and PLL-based clock management simplifies interfacing and timing design.
Why Choose EP3C5U256C6?
The EP3C5U256C6 positions itself as a versatile Cyclone III FPGA option for designers who need a balance of logic capacity, on-chip memory, and a high I/O count in a compact commercial-grade package. Its low-power family attributes and integrated clock management capabilities make it appropriate for high-volume, cost-sensitive and thermally constrained designs that require reliable programmable logic and interface flexibility.
Coupled with the Cyclone III device family’s ecosystem of design tools, IP and clocking resources, EP3C5U256C6 provides a platform that supports rapid integration and scalable development for a wide range of commercial embedded applications.
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