EP3C5U256C6

IC FPGA 182 I/O 256UBGA
Part Description

Cyclone® III Field Programmable Gate Array (FPGA) IC 182 423936 5136 256-LFBGA

Quantity 1,610 Available (as of October 8, 2026)
Product CategoryField Programmable Gate Array (FPGA)
ManufacturerIntel
Manufacturing StatusActive
Manufacturer Standard Lead Time26 Weeks
Datasheet

Specifications & Environmental

Device Package256-UBGA (14x14)GradeCommercialOperating Temperature0°C – 85°C
Package / Case256-LFBGANumber of I/O182Voltage1.15 V - 1.25 V
Mounting MethodSurface MountRoHS ComplianceRoHS non-compliantREACH ComplianceREACH Unaffected
Moisture Sensitivity Level3 (168 Hours)Number of LABs/CLBs321Number of Logic Elements/Cells5136
Number of GatesN/AECCNEAR99HTS Code8542.39.0001
QualificationN/ATotal RAM Bits423936

Overview of EP3C5U256C6 – Cyclone® III Field Programmable Gate Array (FPGA) IC 182 423936 5136 256-LFBGA

The EP3C5U256C6 is a Cyclone III family FPGA offering a low-power, highly integrated programmable logic solution in a compact 256-LFBGA package. It delivers 5,136 logic elements, approximately 0.424 Mbits of embedded memory and 182 user I/Os, making it suitable for cost-sensitive, I/O‑rich commercial applications.

As part of the Cyclone III device family, this device is designed to balance functionality and power efficiency and includes family-level features such as advanced clock management and a broad collection of supported I/O standards for system integration and interface bridging.

Key Features

  • Logic Capacity  5,136 logic elements to implement combinational and sequential logic, custom state machines, and glue logic.
  • Embedded Memory  Approximately 0.424 Mbits of on-chip RAM for FIFOs, buffers, and small data stores.
  • I/O Resources  182 user I/Os to support multiple interfaces and parallel connections in I/O-constrained designs.
  • Clock Management  Family-level support includes up to four phase-locked loops (PLLs) for flexible clock synthesis and distribution.
  • Low-Power Architecture  Cyclone III family optimizations and TSMC low-power process technology target reduced static power for battery‑sensitive and thermally constrained designs.
  • Voltage Supply  Core operating range of 1.15 V to 1.25 V.
  • Package & Mounting  256-LFBGA (supplier package: 256-UBGA, 14×14) in a surface-mount footprint for compact board layouts.
  • Commercial Grade  Specified for operation from 0 °C to 85 °C and supplied as a commercial-grade device.
  • Standards & I/O Flexibility  Cyclone III family support for a wide collection of I/O standards and on-chip termination calibration to aid signal integrity across PVT conditions.
  • RoHS Compliant  Manufactured to meet RoHS environmental compliance requirements.

Typical Applications

  • Cost-sensitive consumer electronics  Implements custom logic, peripheral control, and protocol bridging while maintaining low power and BOM cost.
  • Embedded control and processing  On-chip memory and logic capacity support control tasks, interface handling and lightweight embedded functions.
  • Interface bridging and I/O expansion  High I/O count and multiple supported standards make the device suitable for translating between system buses and adding parallel I/O.
  • Clocked data interfaces  Integrated PLLs enable clock synthesis and management for stable timing across multi-domain interfaces.

Unique Advantages

  • Highly integrated logic and memory: Combines 5,136 logic elements with embedded RAM to reduce external components and streamline board design.
  • Flexible I/O resources: 182 user I/Os support diverse interfaces and reduce the need for external multiplexers or translators.
  • Power-aware family architecture: Cyclone III family design and low-power process choices help control static power for energy-sensitive applications.
  • Compact, surface-mount package: 256-LFBGA (256-UBGA 14×14) enables dense PCB layouts and space-constrained designs.
  • Commercial temperature rating: Qualified for 0 °C to 85 °C operation to meet typical commercial deployment environments.
  • Standards support and system integration: Family-level support for multiple I/O standards and PLL-based clock management simplifies interfacing and timing design.

Why Choose EP3C5U256C6?

The EP3C5U256C6 positions itself as a versatile Cyclone III FPGA option for designers who need a balance of logic capacity, on-chip memory, and a high I/O count in a compact commercial-grade package. Its low-power family attributes and integrated clock management capabilities make it appropriate for high-volume, cost-sensitive and thermally constrained designs that require reliable programmable logic and interface flexibility.

Coupled with the Cyclone III device family’s ecosystem of design tools, IP and clocking resources, EP3C5U256C6 provides a platform that supports rapid integration and scalable development for a wide range of commercial embedded applications.

Request a quote or submit an inquiry to start a procurement or evaluation for EP3C5U256C6.

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