EP3C5U256C6N

The EP3C5U256C6N is a Cyclone III family FPGA from Intel, delivering a compact, low-power programmable logic solution in a 256-LFBGA package. Built for designs that require a balance of logic capacity, embedded memory, and a high I/O count, this device targets cost- and power-sensitive applications across consumer, communications, and embedded systems.

Key device characteristics include 5,136 logic elements, approximately 0.4 Mbits of on-chip embedded memory, 182 user I/Os, a supply voltage range of 1.15 V to 1.25 V, and a commercial operating temperature range of 0 °C to 85 °C.

Key Features

• Core & Logic: 5,136 logic elements provide programmable logic capacity for glue logic, protocol bridging, and moderate-complexity custom hardware acceleration.
• Embedded Memory: Approximately 0.4 Mbits of on-chip RAM to support FIFOs, small buffers, and local storage without external memory.
• I/O Capacity & Standards: 182 user I/O pins give flexibility for parallel interfaces and multiple peripherals; as a Cyclone III device it supports a broad set of common I/O standards.
• Clock Management: Cyclone III family devices include robust clock management features such as multiple PLLs for clock synthesis and distribution.
• Power & Supply: Low-power Cyclone III architecture with a core supply range of 1.15 V to 1.25 V, enabling efficiency for battery-powered or thermally constrained designs.
• Package & Mounting: 256-LFBGA (supplier 256-UBGA, 14×14) surface-mount package for compact PCB integration and high-density routing.
• Operating Range & Compliance: Commercial-grade device rated for 0 °C to 85 °C and RoHS compliant for global manufacturing requirements.

Typical Applications

• Portable and Handheld Electronics: Low-power operation and compact 256-LFBGA packaging suit battery-powered devices and portable instrumentation.
• Embedded Control Systems: On-chip logic and embedded memory enable real-time control tasks such as sensor interfacing, protocol translation, and motor control logic.
• Communications and Networking: High I/O count and programmable logic are useful for protocol bridging, peripheral interface buffering, and customized packet handling.
• Consumer Electronics: Cost-sensitive, high-volume products can leverage the Cyclone III family’s low-power profile and integration to reduce BOM and board area.

Unique Advantages

• Balanced Logic and Memory: 5,136 logic elements paired with approximately 0.4 Mbits of embedded RAM provide a practical mix for mid-range FPGA functions without external memory.
• High I/O Density: 182 user I/Os allow multiple interfaces and parallel connections, simplifying interconnect on feature-rich boards.
• Low-Power Architecture: Built on the Cyclone III low-power family characteristics and a narrow core voltage range, the device supports energy-efficient system designs.
• Compact, Surface-Mount Package: The 256-LFBGA (14×14 UBGA) package offers a small footprint for space-constrained PCBs while maintaining robust routing capability.
• Commercial Temperature and RoHS Compliance: Rated for 0 °C to 85 °C and RoHS compliant to meet common manufacturing and environmental requirements.

Why Choose EP3C5U256C6N?

The EP3C5U256C6N positions itself as a pragmatic Cyclone III FPGA option for designers needing mid-range programmable logic with low-power operation, meaningful embedded memory, and a high I/O count in a compact package. It is well suited for OEMs developing cost- and power-sensitive products where board space and energy efficiency matter.

Designed for straightforward integration, this device offers the Cyclone III family’s system-level features—such as robust clock management—while providing the supplier support and ecosystem typical for Intel FPGAs. It’s a fit for teams scaling production of consumer, communications, and embedded control solutions that require reliable, workaday FPGA resources.

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