EP3C5U256C8N
| Part Description |
Cyclone® III Field Programmable Gate Array (FPGA) IC 182 423936 5136 256-LFBGA |
|---|---|
| Quantity | 1,904 Available (as of October 8, 2026) |
| Product Category | Field Programmable Gate Array (FPGA) |
|---|---|
| Manufacturer | Intel |
| Manufacturing Status | Active |
| Manufacturer Standard Lead Time | 26 Weeks |
| Datasheet |
Specifications & Environmental
| Device Package | 256-UBGA (14x14) | Grade | Commercial | Operating Temperature | 0°C – 85°C | ||
|---|---|---|---|---|---|---|---|
| Package / Case | 256-LFBGA | Number of I/O | 182 | Voltage | 1.15 V - 1.25 V | ||
| Mounting Method | Surface Mount | RoHS Compliance | RoHS Compliant | REACH Compliance | REACH Unaffected | ||
| Moisture Sensitivity Level | 3 (168 Hours) | Number of LABs/CLBs | 321 | Number of Logic Elements/Cells | 5136 | ||
| Number of Gates | N/A | ECCN | 3A991D | HTS Code | 8542.39.0001 | ||
| Qualification | N/A | Total RAM Bits | 423936 |
Overview of EP3C5U256C8N – Cyclone® III Field Programmable Gate Array (FPGA) IC 182 423936 5136 256-LFBGA
The EP3C5U256C8N is an Intel Cyclone III FPGA offering 5,136 logic elements and approximately 0.42 Mbits of embedded memory in a 256-LFBGA surface-mount package with 182 user I/Os. It is part of the Cyclone III device family, which targets low-power, high-functionality implementations for cost-sensitive, high-volume applications.
Designed to support a wide range of I/O standards and on-chip clock management, this device is suited for portable and thermally-challenged designs as well as systems that require a compact, power-aware programmable logic solution.
Key Features
- Core logic — 5,136 logic elements provide programmable logic resources for moderate-density designs.
- On-chip memory — Approximately 0.42 Mbits (423,936 bits) of embedded RAM for buffering, lookup tables and state storage.
- I/O capacity — 182 user I/Os to support multiple external interfaces and peripherals.
- Clock management — Four phase-locked loops (PLLs) per device with five outputs per PLL; PLLs are cascadable and dynamically reconfigurable for flexible clock synthesis and distribution.
- Low-voltage operation — Core voltage supply range of 1.15 V to 1.25 V consistent with low-power system designs.
- Package and mounting — 256-LFBGA (supplier package: 256-UBGA, 14×14), surface-mount for compact PCB integration.
- Operating conditions — Commercial grade with an operating temperature range of 0 °C to 85 °C.
- I/O standards and signal integrity — Family-level support for LVTTL, LVCMOS, SSTL, HSTL, PCI, PCI-X, LVPECL, BLVDS, LVDS, mini-LVDS, RSDS, and PPDS, and multi-value on-chip termination calibration.
- Environmental compliance — RoHS compliant.
Typical Applications
- Portable and handheld devices — Low-power Cyclone III architecture and low-voltage operation help extend battery life and reduce cooling requirements in compact products.
- High-volume, cost-sensitive products — Device family positioning and package options support production-focused designs where cost and power are primary constraints.
- I/O-constrained systems — High I/O count and family features aimed at user I/O constrained applications make the device useful for designs requiring multiple external interfaces.
- Thermally-challenged environments — Low static power characteristics of the Cyclone III family support operation in designs with limited cooling.
Unique Advantages
- Low-voltage, power-aware design: 1.15–1.25 V core supply and Cyclone III low-power process enable reduced power consumption for battery-operated and thermally-limited systems.
- Balanced logic and memory: 5,136 logic elements paired with approximately 0.42 Mbits of on-chip RAM support a broad mix of control, buffering, and data-path functions on a single device.
- Rich I/O flexibility: 182 I/Os and support for a wide range of I/O standards let you interface directly to common buses, serializers, and legacy signaling without external translators.
- Integrated clock synthesis: Four PLLs with multiple outputs provide flexible, cascadable clocking options to simplify timing architecture and reduce external components.
- Compact, board-ready package: 256-LFBGA (256-UBGA 14×14) surface-mount package minimizes PCB footprint while delivering robust I/O density.
- Regulatory readiness: RoHS compliance supports lead-free manufacturing and aligns with common environmental requirements.
Why Choose EP3C5U256C8N?
The EP3C5U256C8N positions itself as a compact, low-power Cyclone III FPGA option for designs that require moderate logic density, meaningful on-chip memory, and extensive I/O in a surface-mount 256-LFBGA package. Its family-level features—including multiple PLLs, broad I/O standard support, and a power-aware architecture—make it suitable for portable, high-volume, and I/O-intensive applications where board space and power budgets matter.
Engineers and procurement teams looking for a commercially graded, RoHS-compliant Cyclone III device with clearly defined supply and thermal limits will find the EP3C5U256C8N a practical choice for scalable, production-oriented designs backed by the Cyclone III device family feature set.
Request a quote or submit a product inquiry to receive pricing and availability information for the EP3C5U256C8N.

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