EP3C5U256C8N

IC FPGA 182 I/O 256UBGA
Part Description

Cyclone® III Field Programmable Gate Array (FPGA) IC 182 423936 5136 256-LFBGA

Quantity 1,904 Available (as of October 8, 2026)
Product CategoryField Programmable Gate Array (FPGA)
ManufacturerIntel
Manufacturing StatusActive
Manufacturer Standard Lead Time26 Weeks
Datasheet

Specifications & Environmental

Device Package256-UBGA (14x14)GradeCommercialOperating Temperature0°C – 85°C
Package / Case256-LFBGANumber of I/O182Voltage1.15 V - 1.25 V
Mounting MethodSurface MountRoHS ComplianceRoHS CompliantREACH ComplianceREACH Unaffected
Moisture Sensitivity Level3 (168 Hours)Number of LABs/CLBs321Number of Logic Elements/Cells5136
Number of GatesN/AECCN3A991DHTS Code8542.39.0001
QualificationN/ATotal RAM Bits423936

Overview of EP3C5U256C8N – Cyclone® III Field Programmable Gate Array (FPGA) IC 182 423936 5136 256-LFBGA

The EP3C5U256C8N is an Intel Cyclone III FPGA offering 5,136 logic elements and approximately 0.42 Mbits of embedded memory in a 256-LFBGA surface-mount package with 182 user I/Os. It is part of the Cyclone III device family, which targets low-power, high-functionality implementations for cost-sensitive, high-volume applications.

Designed to support a wide range of I/O standards and on-chip clock management, this device is suited for portable and thermally-challenged designs as well as systems that require a compact, power-aware programmable logic solution.

Key Features

  • Core logic — 5,136 logic elements provide programmable logic resources for moderate-density designs.
  • On-chip memory — Approximately 0.42 Mbits (423,936 bits) of embedded RAM for buffering, lookup tables and state storage.
  • I/O capacity — 182 user I/Os to support multiple external interfaces and peripherals.
  • Clock management — Four phase-locked loops (PLLs) per device with five outputs per PLL; PLLs are cascadable and dynamically reconfigurable for flexible clock synthesis and distribution.
  • Low-voltage operation — Core voltage supply range of 1.15 V to 1.25 V consistent with low-power system designs.
  • Package and mounting — 256-LFBGA (supplier package: 256-UBGA, 14×14), surface-mount for compact PCB integration.
  • Operating conditions — Commercial grade with an operating temperature range of 0 °C to 85 °C.
  • I/O standards and signal integrity — Family-level support for LVTTL, LVCMOS, SSTL, HSTL, PCI, PCI-X, LVPECL, BLVDS, LVDS, mini-LVDS, RSDS, and PPDS, and multi-value on-chip termination calibration.
  • Environmental compliance — RoHS compliant.

Typical Applications

  • Portable and handheld devices — Low-power Cyclone III architecture and low-voltage operation help extend battery life and reduce cooling requirements in compact products.
  • High-volume, cost-sensitive products — Device family positioning and package options support production-focused designs where cost and power are primary constraints.
  • I/O-constrained systems — High I/O count and family features aimed at user I/O constrained applications make the device useful for designs requiring multiple external interfaces.
  • Thermally-challenged environments — Low static power characteristics of the Cyclone III family support operation in designs with limited cooling.

Unique Advantages

  • Low-voltage, power-aware design: 1.15–1.25 V core supply and Cyclone III low-power process enable reduced power consumption for battery-operated and thermally-limited systems.
  • Balanced logic and memory: 5,136 logic elements paired with approximately 0.42 Mbits of on-chip RAM support a broad mix of control, buffering, and data-path functions on a single device.
  • Rich I/O flexibility: 182 I/Os and support for a wide range of I/O standards let you interface directly to common buses, serializers, and legacy signaling without external translators.
  • Integrated clock synthesis: Four PLLs with multiple outputs provide flexible, cascadable clocking options to simplify timing architecture and reduce external components.
  • Compact, board-ready package: 256-LFBGA (256-UBGA 14×14) surface-mount package minimizes PCB footprint while delivering robust I/O density.
  • Regulatory readiness: RoHS compliance supports lead-free manufacturing and aligns with common environmental requirements.

Why Choose EP3C5U256C8N?

The EP3C5U256C8N positions itself as a compact, low-power Cyclone III FPGA option for designs that require moderate logic density, meaningful on-chip memory, and extensive I/O in a surface-mount 256-LFBGA package. Its family-level features—including multiple PLLs, broad I/O standard support, and a power-aware architecture—make it suitable for portable, high-volume, and I/O-intensive applications where board space and power budgets matter.

Engineers and procurement teams looking for a commercially graded, RoHS-compliant Cyclone III device with clearly defined supply and thermal limits will find the EP3C5U256C8N a practical choice for scalable, production-oriented designs backed by the Cyclone III device family feature set.

Request a quote or submit a product inquiry to receive pricing and availability information for the EP3C5U256C8N.

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