EP3C80F484C6

The EP3C80F484C6 is a Cyclone III family FPGA in a 484-ball BGA package optimized for commercial applications that require high integration and low power. It provides a balance of programmable logic capacity, on-chip memory, and a high I/O count to support cost-sensitive, high-volume designs.

Built on the Cyclone III device family architecture, this device targets system integration tasks such as embedded processing, I/O-rich interfaces, and low-power designs where static power and board-level footprint are important considerations.

Key Features

• Core Logic  Approximately 81,264 logic elements for implementing glue logic, custom state machines, and complex RTL functions.
• Embedded Memory  Approximately 2.81 Mbits of on-chip RAM (2,810,880 bits) to support buffers, FIFOs, and small on-chip data stores.
• I/O Capacity  295 user I/Os to handle multiple parallel interfaces and board-level connectivity in compact designs.
• Clock Management  Family-level clock resources include up to four PLLs per device for flexible clock synthesis and distribution.
• Low-Voltage Core Supply  Core voltage supply range of 1.15 V to 1.25 V, enabling low-power operation in compatible system power domains.
• Power and Efficiency  Cyclone III family optimizations target low static power consumption (family-level examples indicate static power under 0.25 W for typical-density devices), helping extend battery life and reduce cooling needs.
• Package & Mounting  484-BGA (supplier package: 484-FBGA, 23×23) surface-mount package for compact PCB integration and high I/O density.
• Commercial Temperature Grade  Rated for 0 °C to 85 °C operating temperature for commercial applications.
• RoHS Compliant  Device is RoHS compliant for lead-free assembly and environmental compliance.
• Device Family Capabilities  As part of the Cyclone III family, this device benefits from family-level features including FPGA security options on Cyclone III LS variants, a wide collection of pre-built IP, and support for the Nios II embedded processor and Quartus II design flows.

Typical Applications

• Consumer & Portable Electronics  Low-power core and compact BGA package make the device suitable for battery-sensitive consumer modules and portable equipment.
• Communications & Networking  High I/O count and on-chip memory support protocol glue logic, interface bridging, and buffering in networking equipment and edge devices.
• Video and Imaging Subsystems  On-chip RAM and abundant logic elements enable real-time data handling tasks such as buffering, preprocessing, and custom pipelines.
• Embedded Control & Interfaces  Use as an integration hub for sensor interfaces, motor-control glue logic, and display or human–machine interface controllers where moderate logic density and many I/Os are required.

Unique Advantages

• Balanced Logic and Memory  Combines roughly 81k logic elements with ~2.81 Mbits of embedded RAM to implement both control and data-path functions on one device, reducing external component count.
• High I/O Density  295 I/Os provide flexible board-level connectivity for multi-channel interfaces without requiring additional interface chips.
• Low-Voltage, Low-Power Operation  1.15–1.25 V core supply and Cyclone III family low-power optimizations help minimize system power and cooling demands.
• Compact Package  484-FBGA (23×23) delivers a small PCB footprint for space-constrained designs while preserving high I/O availability.
• Commercial Temperature Compatibility  Rated 0 °C to 85 °C for reliable operation across typical commercial operating environments.
• Design Ecosystem and IP  Access to Cyclone III family IP and support for the Nios II processor and Quartus II design tools enables faster design cycles and proven system integration options.

Why Choose EP3C80F484C6?

The EP3C80F484C6 offers a practical mix of logic, embedded memory, and I/O in a compact surface-mount BGA package, positioned for commercial designs that need on-chip integration without compromising power efficiency. Its Cyclone III family heritage brings low-power silicon optimizations and a mature IP/tool ecosystem to accelerate development.

This device is well-suited for designers building cost-sensitive, high-volume products where reduced BOM, compact PCB area, and moderate logic and memory capacity deliver measurable system-level benefits.

Request a quote or submit a purchasing inquiry to obtain pricing, availability, and lead-time details for EP3C80F484C6. Our team can help match the device to your project requirements and provide ordering assistance.