EP3C80F484C7

The EP3C80F484C7 is a Cyclone III family field programmable gate array (FPGA) supplied in a 484‑ball BGA package. It integrates 81,264 logic elements and a high I/O count in a surface‑mount, commercial‑grade device aimed at high‑volume, low‑power and cost‑sensitive applications.

Designed around the Cyclone III architecture, this device combines substantial logic capacity, embedded memory and flexible I/O to support mid‑range embedded designs where power efficiency, integration and compact packaging are priorities.

Key Features

• Logic Capacity — 81,264 logic elements with 5,079 LABs (logic array blocks) to support complex combinational and sequential logic implementations.
• Embedded Memory — Approximately 2.68 Mbits of on‑chip RAM (2,810,880 total RAM bits) for buffering, FIFOs and local data storage.
• I/O Density — 295 user I/O pins enabling multiple parallel interfaces and peripheral connectivity in a single device.
• Voltage Range — Core supply range of 1.15 V to 1.25 V, compatible with low‑voltage system rails.
• Package & Mounting — 484‑BGA (484‑FBGA, 23×23) surface‑mount package for compact board footprints and reliable solder connections.
• Commercial Temperature Range — Rated for 0 °C to 85 °C operation for commercial applications.
• Low‑Power Family Attributes — As a Cyclone III device, it benefits from the series’ low‑power process optimizations and power‑aware design flow to support energy‑sensitive products.
• System Integration Features — Cyclone III family capabilities include high memory‑to‑logic and multiplier‑to‑logic ratios and multiple PLLs for robust clock management and synthesis (family feature).
• Regulatory Compliance — RoHS compliant, supporting current environmental requirements for commercial electronics.

Typical Applications

• Portable and Handheld Devices — Low‑power operation and compact BGA packaging suit battery‑sensitive, space‑constrained designs.
• Consumer Electronics — High logic capacity and dense I/O enable control, signal processing and custom peripheral interfacing in consumer products.
• Communications and Networking — Multiple I/Os and on‑chip memory support packet buffering, protocol handling and interface bridging in mid‑range network equipment.
• Embedded Processing and Prototyping — Large logic fabric and embedded RAM make the device appropriate for custom logic, hardware accelerators and system prototypes where integration reduces BOM count.

Unique Advantages

• High Logic Integration: 81,264 logic elements provide a large fabric for implementing complex state machines, datapaths and custom accelerators without external glue logic.
• Balanced On‑Chip Memory: Approximately 2.68 Mbits of embedded RAM enables local buffering and memory‑centric functions while reducing external memory requirements.
• Flexible Connectivity: 295 I/O pins accommodate parallel buses, wide interfaces and mixed signaling options for versatile board designs.
• Compact, Manufacturable Package: 484‑FBGA (23×23) surface‑mount package offers a small PCB footprint and straightforward assembly for volume production.
• Commercial‑Grade Thermal Range: Rated 0 °C to 85 °C to match typical commercial product temperature requirements.
• Environmentally Compliant: RoHS compliance simplifies regulatory considerations for consumer and commercial deployments.

Why Choose EP3C80F484C7?

The EP3C80F484C7 delivers a practical balance of logic density, embedded memory and I/O capability in a compact 484‑BGA package, positioned for commercial, high‑volume, low‑power designs. Its Cyclone III family characteristics provide low‑power operation and system integration features useful for reducing board complexity and BOM cost.

This device is well suited to engineers and product teams building mid‑range embedded systems, consumer electronics and communication equipment who need substantial on‑chip resources, flexible interfacing and a commercially rated component with environmental compliance.

Request a quote or submit an inquiry to obtain pricing and availability for EP3C80F484C7. Our team can assist with lead times and ordering details.