EP3C80F484I7

The EP3C80F484I7 is a Cyclone® III field programmable gate array (FPGA) optimized for mid-range logic integration with low-power operation. As a member of the Cyclone III family, it targets high-volume, cost-sensitive and power-conscious applications that require substantial logic density, embedded memory and a high I/O count in a compact surface-mount package.

Key Features

• Core density – Approximately 81,264 logic elements, providing the resources needed for complex control, protocol handling, and custom logic implementation.
• Embedded memory – Approximately 2.81 Mbits of on-chip RAM (2,810,880 bits) to reduce external memory dependence and simplify board design.
• I/O resources – 295 user I/Os for broad peripheral and interface connectivity on demanding designs.
• Low-voltage operation – Nominal supply range 1.15 V to 1.25 V, consistent with low-power Cyclone III family operation.
• Clock management – Cyclone III devices include up to four phase-locked loops (PLLs) for flexible clock synthesis and distribution.
• I/O standard support – The Cyclone III family supports a wide range of I/O standards to accommodate diverse signaling requirements.
• Package and mounting – 484-FBGA (23 × 23) package, surface-mount for compact PCB layouts.
• Industrial temperature grade – Rated for operation from –40 °C to 100 °C for deployment in industrial environments.
• Standards compliance – RoHS compliant for environmentally conscious designs.

Typical Applications

• Industrial control and automation – Implement real-time control logic, interface multiple sensors and actuators, and maintain operation across –40 °C to 100 °C.
• Embedded processing and system integration – Use on-chip resources and available Cyclone III family IP (including Nios® II support) for compact embedded systems.
• Communications and networking – High I/O count and flexible clocking allow protocol bridging, packet processing, and custom interface functions.
• Portable and battery-powered equipment – Low-voltage, low-power family characteristics help extend battery life and reduce cooling requirements.

Unique Advantages

• High logic capacity: 81,264 logic elements enable substantial on-chip functionality without immediate reliance on external logic.
• On-chip memory that reduces BOM: Approximately 2.81 Mbits of embedded RAM helps minimize external memory components and PCB complexity.
• Extensive I/O: 295 user I/Os provide flexibility for multiple interfaces and peripheral connections.
• Power-efficient platform: Low supply voltage range and Cyclone III family low-power process characteristics support energy-sensitive designs.
• Industrial temperature capability: –40 °C to 100 °C rating suits deployments in thermally challenging or outdoor industrial settings.
• Compact BGA footprint: 484-FBGA (23×23) facilitates high-density PCB designs while maintaining robust soldering and signal routing.

Why Choose EP3C80F484I7?

The EP3C80F484I7 delivers a balanced combination of mid-range logic density, substantial embedded memory and high I/O count within a compact industrial-grade package. It is well suited for designers who need to consolidate logic, memory, and interfaces into a single FPGA platform while preserving low-voltage operation and RoHS compliance.

As a member of the Cyclone III family, this device benefits from a low-power process, family-level clocking and I/O flexibility, making it appropriate for cost-sensitive, power-aware applications that require reliable operation across a wide temperature range.

Request a quote or submit an RFQ to get pricing and availability for EP3C80F484I7.