EP3C80F484I7N

The EP3C80F484I7N is an Intel Cyclone® III family FPGA offering a high-density, low-power programmable logic platform. Based on the Cyclone III device architecture and manufactured using a low-power process, this device targets high-volume, cost-sensitive and thermally-challenged applications that require substantial on-chip logic and I/O integration.

With 81,264 logic elements, approximately 2.81 Mbits of embedded memory and 295 user I/Os in a compact 484-BGA (23×23) surface-mount package, the EP3C80F484I7N is suited to designs that demand integration, industrial operating range, and optimized power efficiency.

Key Features

• Logic Capacity — 81,264 logic elements provide significant programmable logic resources for medium- to high-density designs.
• Embedded Memory — Approximately 2.81 Mbits of on-chip RAM to support buffering, state storage, and data processing functions without external memory.
• I/O Integration — 295 user I/Os enable broad interface connectivity and flexible board-level integration for diverse peripheral and bus standards.
• Power Supply — Core supply range of 1.15 V to 1.25 V for compatibility with low-voltage system rails.
• Package & Mounting — 484-BGA (supplier designation 484-FBGA, 23×23) in a surface-mount form factor for compact PCB implementation.
• Industrial Temperature Range — Rated for operation from −40°C to 100°C, supporting industrial environment deployment.
• RoHS Compliant — Conforms to RoHS requirements for lead-free manufacturing and environmental compliance.
• Cyclone III Family Capabilities — Inherits Cyclone III family attributes such as low-power operation, high memory-to-logic ratio, and access to family-level IP and embedded processor integration described in the device handbook.

Typical Applications

• Portable and Handheld Devices — Low-power process technology and modest static power consumption help extend battery life and support thermally-constrained designs.
• Industrial Control & Automation — Industrial temperature rating (−40°C to 100°C) and robust I/O count make the device suitable for sensor interfacing, motor control, and automation logic.
• High-Volume, Cost-Sensitive Products — The Cyclone III family positioning toward low cost and high functionality suits mass-market electronics where BOM cost and integration matter.
• Communications and Interface Hubs — High I/O density and on-chip memory enable protocol handling, buffering, and signal aggregation in networking or peripheral bridge applications.

Unique Advantages

• High Logic Density: 81,264 logic elements enables complex logic consolidation on a single device, reducing system-level component count.
• Integrated Memory: Approximately 2.81 Mbits of embedded RAM minimizes dependence on external memory for many buffering and processing tasks.
• Wide I/O Capability: 295 user I/Os provide flexibility to support multiple interfaces and simplify PCB routing for multi-peripheral systems.
• Industrial Robustness: −40°C to 100°C operating range supports deployment in demanding environmental conditions common in industrial applications.
• Compact Surface-Mount Packaging: 484-BGA (23×23) offers a space-efficient footprint for compact boards while maintaining high pin count.
• Standards-Ready Family: Benefits from Cyclone III family resources such as available IP cores and embedded processor options referenced in the device handbook.

Why Choose EP3C80F484I7N?

The EP3C80F484I7N combines substantial programmable logic, embedded memory, and broad I/O capacity in a compact industrial-grade package. It is positioned for engineers who need to consolidate functionality, manage power consumption, and maintain reliability across temperature extremes. Supported by the Cyclone III family feature set and documentation, the device is a practical choice for designs that require a balance of integration, cost efficiency, and deployable performance.

Request a quote or submit an RFQ to receive pricing and availability for EP3C80F484I7N and to discuss how this Cyclone® III FPGA can fit your design requirements.