EP3C80F780C6

The EP3C80F780C6 is a Cyclone® III family FPGA offering a balance of high functionality and low power for commercial applications. Built on the Cyclone III architecture, this device provides 81,264 logic elements, approximately 2.81 Mbits of embedded memory, and 429 user I/Os in a compact 780-FBGA (29×29) surface-mount package.

Designed for cost- and power-sensitive designs, the Cyclone III family emphasizes low static power and system integration features such as on-chip clock management and flexible I/O to accelerate time-to-market for handheld, consumer, and communications applications.

Key Features

• Core Logic — 81,264 logic elements provide substantial programmable capacity for complex glue logic, protocol bridging, and custom processing.
• Embedded Memory — Approximately 2.81 Mbits of on-chip RAM to support buffering, FIFOs, and small local memory needs without external SDRAM.
• High I/O Count — 429 I/O pins to enable broad interfacing options with sensors, peripherals, and high-pin-count connectors.
• Low-Power Process — Based on TSMC low-power (LP) process technology and Cyclone III family power-aware features to minimize static power consumption for battery- or thermally-constrained designs.
• Clock Management — Up to four phase-locked loops (PLLs) for robust clock synthesis and distribution, supporting multi-domain designs and interface timing requirements.
• Package & Mounting — 780-FBGA (29×29) surface-mount package balances I/O density and board-area efficiency for compact system designs.
• Supply & Operating Range — Core voltage supply from 1.15 V to 1.25 V and commercial operating temperature range of 0 °C to 85 °C.
• Standards & Tools — Device family features and design flows (Cyclone III device handbook and supporting design tools) enable integration with vendor-provided IP and development flows.
• Compliance — RoHS-compliant manufacturing.

Typical Applications

• Portable and Handheld Systems — Low static power characteristics make the device suitable for battery-powered designs that require programmable logic and local memory.
• Consumer Electronics — High logic and I/O density support user interfaces, protocol bridging, and custom peripheral control in compact form factors.
• Communications and Networking — Multiple PLLs and abundant I/Os enable clocking flexibility and interface support for communication endpoints and bridging functions.
• Embedded Processing and Control — Large programmable fabric and embedded memory allow implementation of custom controllers, offload engines, and IP-based subsystems.

Unique Advantages

• High Logic Capacity: 81,264 logic elements let you implement sizeable custom logic and accelerate integration of multiple functions onto a single device, reducing BOM and board complexity.
• Balanced On-Chip Memory: Approximately 2.81 Mbits of RAM provides local buffering and scratch memory to minimize external memory dependency for many applications.
• Extensive I/O: 429 I/Os support diverse peripherals and high-pin-count interfaces without resorting to additional multiplexing or external expanders.
• Low-Power Silicon: TSMC low-power process technology and Cyclone III power-aware features help reduce static power draw for energy-conscious designs.
• Flexible Clocking: Up to four PLLs offer configurable clock synthesis and distribution, simplifying multi-domain timing and interface management.
• Compact, High-Density Package: The 780-FBGA (29×29) package delivers dense routing and a small PCB footprint for space-constrained products.

Why Choose EP3C80F780C6?

The EP3C80F780C6 positions itself as a pragmatic choice when you need substantial programmable logic, meaningful on-chip memory, and a high I/O count while keeping power and board area under control. Its Cyclone III family characteristics—low-power process technology, multiple PLLs, and broad I/O capability—make it well suited to commercial designs that require integration, flexibility, and efficient power usage.

For teams targeting cost- and power-sensitive consumer, portable, or communications applications, this device offers a balance of capacity and integration backed by the Cyclone III device handbook and associated design flows and IP.

Request a quote or submit an RFQ to get pricing and availability for EP3C80F780C6. Our team can provide lead-time information and help match the device to your project requirements.