EP3C80F780C8

The EP3C80F780C8 is a Cyclone® III field programmable gate array from Intel, implemented in a 780‑ball FBGA (29×29) surface‑mount package. It delivers a balance of logic, on‑chip memory, and I/O density for cost‑sensitive, low‑power system designs in commercial temperature environments.

With 81,264 logic elements, approximately 2.81 Mbits of embedded memory, and 429 user I/Os, this device targets applications that require substantial programmable logic capacity and high I/O connectivity while operating within a 0 °C to 85 °C range and a 1.15 V to 1.25 V core supply.

Key Features

• Core Logic  81,264 logic elements provide a large programmable fabric for complex logic, state machines, and glue logic.
• Embedded Memory  Approximately 2.81 Mbits of on‑chip RAM to support buffering, FIFOs, and small local data storage without external memory.
• High I/O Count  429 user I/Os enable wide, parallel interfaces and multiple high‑pincount peripherals or buses.
• Power Supply  Designed for a core voltage range of 1.15 V to 1.25 V to match system power rails and power‑management schemes.
• Package & Mounting  780‑FBGA (29×29) surface‑mount package for compact board integration and dense routing on multi‑layer PCBs.
• Operating Grade  Commercial temperature range: 0 °C to 85 °C, suitable for general‑purpose commercial electronics.
• RoHS Compliance  RoHS‑compliant device suited for modern manufacturing and environmental requirements.
• Cyclone III Family Attributes  Family documentation highlights a focus on low power and high functionality, with device features that support battery‑powered and thermally‑constrained designs.

Typical Applications

• Portable and Handheld Devices  Low‑power Cyclone III family characteristics help extend battery life and support thermally constrained enclosures.
• Consumer Electronics  High logic and I/O counts enable user‑interface control, protocol bridging, and peripheral aggregation in cost‑sensitive designs.
• Communications & Data Interfaces  Large I/O complement and flexible logic resources make the device suitable for custom interface and timing adaptation tasks.
• Embedded Systems  On‑chip RAM capacity and programmable logic allow implementation of control logic, buffering, and protocol handling without immediate reliance on external memory.

Unique Advantages

• Substantial Logic Capacity: 81,264 logic elements provide headroom for complex designs and multiple concurrent functions on a single device.
• Integrated Memory: Approximately 2.81 Mbits of embedded RAM reduces the need for external memory for small to mid‑range buffering and data storage.
• High Connectivity: 429 user I/Os enable integration of many peripherals and parallel interfaces, simplifying board-level partitioning.
• Compact, Manufacturable Package: 780‑FBGA (29×29) surface‑mount package supports dense PCB layouts while meeting common assembly processes.
• Commercial Temperature Rating: Rated 0 °C to 85 °C for mainstream electronic products and systems operating in typical commercial environments.
• Environmentally Compliant: RoHS compliance supports modern environmental and manufacturing requirements.

Why Choose EP3C80F780C8?

The EP3C80F780C8 positions itself as a practical Cyclone III family FPGA option when designers need a balance of high logic density, embedded memory, and extensive I/O in a compact surface‑mount package. Its commercial temperature rating and RoHS compliance make it suitable for a wide range of mainstream electronics where power efficiency and integration matter.

Backed by Intel's Cyclone III device family documentation and ecosystem of device resources and IP, this FPGA is suited for teams developing cost‑sensitive, low‑power systems that require reliable programmable logic, scalable design reuse, and established development flows.

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