EP3C80F780I7

IC FPGA 429 I/O 780FBGA
Part Description

Cyclone® III Field Programmable Gate Array (FPGA) IC 429 2810880 81264 780-BGA

Quantity 1,257 Available (as of May 5, 2026)
Product CategoryField Programmable Gate Array (FPGA)
ManufacturerIntel
Manufacturing StatusActive
Manufacturer Standard Lead Time26 Weeks
Datasheet

Specifications & Environmental

Device Package780-FBGA (29x29)GradeIndustrialOperating Temperature-40°C – 100°C
Package / Case780-BGANumber of I/O429Voltage1.15 V - 1.25 V
Mounting MethodSurface MountRoHS ComplianceRoHS CompliantREACH ComplianceREACH Unaffected
Moisture Sensitivity Level3 (168 Hours)Number of LABs/CLBs5079Number of Logic Elements/Cells81264
Number of GatesN/AECCN3A991DHTS Code8542.39.0001
QualificationN/ATotal RAM Bits2810880

Overview of EP3C80F780I7 – Cyclone III FPGA, 780-BGA

The EP3C80F780I7 is a Cyclone® III field-programmable gate array (FPGA) in a 780-ball BGA package designed for low-power, high-density logic integration. Built on the Cyclone III device family platform, it targets high-volume, cost-sensitive and power-conscious applications that require significant logic capacity, on-chip memory and a large I/O count.

With 81,264 logic elements, approximately 2.81 Mbits of embedded memory, and 429 I/Os, this industrial-grade, surface-mount FPGA delivers the integration and I/O flexibility needed for embedded control, communications, and mixed-signal interface tasks while operating across a wide supply and temperature envelope.

Key Features

  • Logic Capacity — 81,264 logic elements provide substantial programmable fabric for combinational and sequential logic, state machines, and custom peripherals.
  • Embedded Memory — Approximately 2.81 Mbits of on-chip RAM for buffering, FIFOs, and embedded data structures.
  • High I/O Count — 429 I/Os to support complex board-level connectivity and multiple parallel interfaces.
  • Low-Power Architecture — Based on the Cyclone III family’s low-power process optimizations to address power-sensitive designs and extend operational lifetimes in battery-powered and thermally constrained environments.
  • Clock Management — Cyclone III family features such as multiple phase-locked loops (PLLs) enable robust clock synthesis and distribution for system and I/O clocks.
  • I/O Flexibility — Family-level support for a wide range of I/O standards and adjustable slew rates helps with signal integrity across diverse interface requirements.
  • Package and Mounting — 780-FBGA (29 × 29) supplier package, surface-mount mounting for compact, high-density PCB layouts.
  • Supply and Temperature — Operates from 1.15 V to 1.25 V and rated for industrial temperatures from −40 °C to 100 °C.
  • Industrial Grade — Specified as industrial grade to meet the environmental expectations of factory and infrastructure applications.
  • Ecosystem and IP — Cyclone III family offers pre-built and verified IP cores for accelerated development and integration (as described in the Cyclone III device handbook).

Typical Applications

  • Industrial Control — Motor control, PLC augmentation, and factory automation where industrial temperature range and high I/O count are required.
  • Embedded Processing & System Integration — Custom logic, glue logic, and embedded subsystem integration using on-chip RAM and abundant logic elements.
  • Communications and Networking — Protocol bridging, packet buffering and interface translation leveraging the device’s high I/O count and embedded memory.
  • Portable and Battery-Powered Products — Low-power device family characteristics suit handheld and portable equipment that require extended battery life.

Unique Advantages

  • Substantial Logic Density: 81,264 logic elements enable complex designs and multiple concurrent functions on a single device, reducing BOM complexity.
  • Integrated Memory Resources: Approximately 2.81 Mbits of embedded RAM supports buffering and local data storage without external memory overhead.
  • Large, Flexible I/O: 429 I/Os provide headroom for parallel interfaces, diverse signaling standards, and board-level consolidation.
  • Industrial Operating Range: Rated for −40 °C to 100 °C, making it suitable for demanding temperature environments commonly found in industrial applications.
  • Design Ecosystem: Cyclone III family documentation and pre-verified IP cores accelerate development and validation cycles.
  • Compact BGA Package: 780-FBGA (29 × 29) allows high-density PCB implementations while maintaining robust thermal and signal routing characteristics.

Why Choose EP3C80F780I7?

The EP3C80F780I7 packs high logic capacity, sizable embedded memory, and an industry-grade operating range into a compact 780-BGA package, delivering a strong balance of integration, I/O capability, and power efficiency for cost-sensitive, high-volume designs. It is well suited for engineers seeking to consolidate discrete functions, implement complex protocols, or add programmable intelligence to systems while maintaining industrial robustness.

Backed by the Cyclone III device family handbook and available IP, this FPGA provides a practical platform for developers who need predictable power behavior, flexible clocking and extensive I/O, all within a mature FPGA ecosystem.

Request a quote or submit an inquiry to receive pricing, availability, and procurement details for the EP3C80F780I7 FPGA.

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