EP3C80U484C6

The EP3C80U484C6 is a Cyclone III family FPGA offering a balance of high functionality and low power for cost-sensitive, high-volume applications. Built on TSMC low-power process technology, this device integrates a large logic fabric, substantial on-chip memory, and a high I/O count in a compact 484-FBGA package.

This commercial-grade FPGA is suited for portable and handheld devices, consumer and communications equipment, and embedded platforms where efficient power consumption, significant logic capacity, and flexible I/O are required.

Key Features

• Logic Capacity  81,264 logic elements to implement complex digital logic and custom processing pipelines.
• Embedded Memory  Approximately 2.81 Mbits of on-chip RAM for frame buffers, FIFOs, and data buffering close to logic.
• I/O Resources  295 user I/Os provide broad connectivity for peripherals, sensors, and high-pin-count interfaces.
• Power and Process  Designed on TSMC low-power (LP) process technology; Cyclone III family devices offer low static power (family-level guidance shows less than ¼ watt static power consumption).
• Clock Management  Four phase-locked loops (PLLs) per device for comprehensive clock synthesis and distribution.
• I/O Standards and Signal Integrity  Family-level support for a wide range of I/O standards including LVTTL, LVCMOS, SSTL, HSTL, PCI, PCI-X, LVPECL, BLVDS, LVDS, mini-LVDS, RSDS, and PPDS, plus adjustable I/O slew rates and on-chip termination calibration.
• Package and Mounting  484-FBGA (supplier package 484-UBGA, 19×19) surface-mount package optimized for dense board-level integration.
• Supply and Operating Range  Core voltage range 1.15 V to 1.25 V; commercial operating temperature 0 °C to 85 °C.
• Compliance  RoHS compliant.

Typical Applications

• Portable and Handheld Devices  Low-power process and modest on-chip memory make this device suitable for battery-powered or thermally constrained systems.
• Consumer and Multimedia Systems  High logic capacity and embedded RAM support video pre-processing, interfaces, and custom media pipelines.
• Communications and Networking Equipment  Large I/O count and flexible I/O standards support front-end interface logic, protocol bridging, and peripheral control.
• Embedded Computing and Prototyping  Significant logic resources combined with family-level IP and Nios II processor support enable rapid development of custom embedded systems.

Unique Advantages

• High Logic Density: 81,264 logic elements let you consolidate multiple functions into a single FPGA, reducing board-level complexity.
• Substantial On-Chip Memory: Approximately 2.81 Mbits of embedded RAM reduces dependence on external memory for buffering and local storage.
• Large I/O Count: 295 I/Os enable direct interfacing to many peripherals and parallel buses without extensive external glue logic.
• Low-Power Platform: TSMC low-power process and Cyclone III family optimizations help meet tight power budgets for portable and cost-sensitive products.
• Flexible Clocking: Four PLLs provide on-chip clock synthesis and phase control to support multiple clock domains and serial/memory interfaces.
• Compact, Surface-Mount Package: 484-FBGA (19×19) package offers high pin density in a compact footprint for modern PCB designs.

Why Choose EP3C80U484C6?

The EP3C80U484C6 positions itself as a practical choice for designers who need substantial logic capacity, meaningful embedded memory, and a high I/O count in a compact, surface-mount FPGA. Its combination of TSMC low-power process technology, family-level low static power characteristics, and comprehensive clocking and I/O capabilities make it a fit for cost- and power-sensitive designs in consumer, communications, and embedded markets.

As part of the Cyclone III family, this device benefits from a library of verified IP and embedded processor support to accelerate development and simplify system integration, helping teams shorten time-to-market while retaining scalability for future revisions.

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