EP3C80U484C7N

The EP3C80U484C7N is an Intel Cyclone® III field-programmable gate array supplied in a 484-FBGA (484-UBGA, 19×19) package. It delivers a high logic capacity FPGA optimized for low-power, cost-sensitive applications and system integration.

Featuring 81,264 logic elements, approximately 2.81 Mbits of embedded memory, and 295 user I/Os, this Cyclone III device is suited to high‑volume, low‑power embedded designs that need substantial logic and I/O integration within a commercial temperature range.

Key Features

• Core logic — 81,264 logic elements to implement complex digital functions and custom logic.
• Embedded memory — Approximately 2.81 Mbits of on-chip RAM for buffering, FIFOs, and temporary storage.
• I/O capacity and flexibility — 295 user I/Os with support for a wide range of I/O standards including LVTTL, LVCMOS, SSTL, HSTL, PCI, PCI‑X, LVPECL, BLVDS, LVDS, mini‑LVDS, RSDS, and PPDS.
• Clock management — Four phase‑locked loops (PLLs) per device with multiple outputs, cascading and dynamic reconfiguration capabilities for robust clock synthesis and interface timing.
• Power and supply — Optimized for low‑power operation; core supply range 1.15 V to 1.25 V to support power‑sensitive designs.
• Package and mounting — 484‑FBGA (484‑UBGA, 19×19) surface‑mount package for compact board designs.
• Operating range — Commercial grade operation from 0 °C to 85 °C.
• Standards and compliance — RoHS compliant for environmental regulatory alignment.
• Tool and IP ecosystem — Part of the Cyclone III family with available Quartus® II design flow and pre‑verified IP cores (family features).

Typical Applications

• Portable and handheld devices — Low‑power architecture and compact package help extend battery life and reduce board area in space‑constrained products.
• Consumer electronics — High logic capacity and flexible I/O support enable multimedia interfaces, control logic, and peripheral bridging in cost‑sensitive consumer systems.
• Communications and networking — Multiple PLLs and a large I/O count facilitate clocking and multi‑lane interface implementations for networking endpoints and edge devices.
• Embedded systems and control — Integrated memory and logic density provide the resources for protocol handling, data buffering, and custom control functions in embedded platforms.

Unique Advantages

• High logic and memory density: 81,264 logic elements and approximately 2.81 Mbits of embedded RAM reduce the need for external components and simplify system architecture.
• Broad I/O and interface support: 295 user I/Os and support for many industry I/O standards make system integration and board routing more flexible.
• Robust clocking and timing: Four PLLs with multiple outputs and dynamic reconfiguration options provide granular control over clock domains and interface timing.
• Low‑power operation: Designed on a low‑power process with a core supply range of 1.15 V to 1.25 V to help meet stringent power budgets.
• Compact, manufacturable package: 484‑FBGA (19×19) surface‑mount package supports dense PCB layouts while remaining compatible with standard assembly processes.
• Design ecosystem: Cyclone III family support in the Quartus® II tool flow and access to prebuilt IP cores accelerates development and reduces time to market.

Why Choose EP3C80U484C7N?

The EP3C80U484C7N positions itself as a high‑capacity, low‑power FPGA option within the Cyclone III family, balancing substantial logic and embedded memory with a large, flexible I/O set. Its commercial temperature rating and compact 484‑FBGA footprint make it suitable for high‑volume, cost‑sensitive embedded applications where integration and power efficiency matter.

Supported by Cyclone III family tools and IP, this part is appropriate for teams seeking to implement custom digital logic, interface bridging, and moderate embedded processing without adding significant external silicon. It delivers a scalable platform backed by documented family features and design flows.

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