EP3C80U484C8N

The EP3C80U484C8N is an Intel Cyclone III field-programmable gate array (FPGA) offered in a 484-ball FBGA package. It delivers a balance of integration and low-power operation suitable for cost-sensitive, high-volume designs.

Built on the Cyclone III device family architecture, this device combines 81,264 logic elements with approximately 2.81 Mbits of embedded memory and up to 295 user I/Os, enabling flexible system integration for a wide range of commercial applications.

Key Features

• Core Logic  81,264 logic elements provide substantial programmable logic resources for glue logic, protocol bridging, and mid-range signal processing tasks.
• Embedded Memory  Approximately 2.81 Mbits of on-chip RAM to support FIFOs, buffers, and small on-chip data structures without external memory.
• I/O Capacity & Standards  295 user I/Os to support dense peripheral and interface requirements; Cyclone III family devices support a wide collection of I/O standards for flexible interfacing.
• Clocking  Family-level clock management features (including multiple PLLs) provide on-chip clock synthesis and flexible timing/topology options for system design.
• Power and Voltage  Operates from a core supply range of 1.15 V to 1.25 V, enabling low-power operation consistent with Cyclone III family low-power objectives.
• Package & Mounting  484-FBGA (484-UBGA, 19×19) surface-mount package for compact PCB integration while supporting high I/O counts.
• Commercial Temperature Grade  Rated for operation from 0 °C to 85 °C for standard commercial applications.
• Regulatory  RoHS-compliant construction for environmental compliance in mainstream electronics manufacturing.

Typical Applications

• Battery-powered and portable devices  Low-voltage operation and Cyclone III family low-power characteristics help extend battery life in handheld and portable equipment.
• User I/O–intensive systems  High I/O count (295 I/Os) supports designs with many peripherals, interfaces, or front-panel controls.
• Cost-sensitive, high-volume products  Cyclone III family focus on low cost and low power makes this device suitable for high-volume commercial products where BOM cost and power budgets are constrained.
• Thermally-challenged environments  Low-power architecture supports operation in applications with limited cooling or compact enclosures.

Unique Advantages

• High integration in a compact package: 81,264 logic elements and ~2.81 Mbits of embedded memory reduce dependence on external devices and lower overall BOM.
• Large I/O capacity: 295 user I/Os provide flexibility to support multiple interfaces and complex board-level connectivity without additional IO expanders.
• Low-voltage core: 1.15–1.25 V supply range aligns with low-power system designs and helps minimize static power draw.
• Surface-mount FBGA packaging: 484-UBGA (19×19) package delivers a high pin-count footprint suitable for dense PCB routing while maintaining a small board area.
• Designed for commercial deployments: Operating temperature range of 0 °C to 85 °C and RoHS compliance support mainstream electronics manufacturing and product lifecycles.

Why Choose EP3C80U484C8N?

The EP3C80U484C8N combines substantial programmable logic capacity, multi-megabit on-chip memory, and a high pin-count I/O set in a compact 484-FBGA package. Its low-voltage core and Cyclone III family low-power characteristics make it well suited to cost-sensitive commercial products that require efficient on-board processing and broad interface support.

This device is a fit for designers seeking a balance of logic density, embedded memory, and I/O flexibility for portable equipment, user-interface intensive boards, and other commercial applications where integration and power efficiency matter. The Cyclone III device family ecosystem and device-level specifications support scalable, production-focused designs.

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