EP3CLS100F484C7N

IC FPGA 278 I/O 484FBGA
Part Description

Cyclone® III Field Programmable Gate Array (FPGA) IC 278 4451328 100448 484-BGA

Quantity 392 Available (as of October 7, 2026)
Product CategoryField Programmable Gate Array (FPGA)
ManufacturerIntel
Manufacturing StatusActive
Manufacturer Standard Lead Time26 Weeks
Datasheet

Specifications & Environmental

Device Package484-FBGA (23x23)GradeCommercialOperating Temperature0°C – 85°C
Package / Case484-BGANumber of I/O278Voltage1.15 V - 1.25 V
Mounting MethodSurface MountRoHS ComplianceRoHS CompliantREACH ComplianceREACH Unaffected
Moisture Sensitivity Level3 (168 Hours)Number of LABs/CLBs6278Number of Logic Elements/Cells100448
Number of GatesN/AECCN3A991DHTS Code8542.39.0001
QualificationN/ATotal RAM Bits4451328

Overview of EP3CLS100F484C7N – Cyclone® III FPGA, 100,448 logic elements, 484‑BGA

The EP3CLS100F484C7N is a Cyclone® III field-programmable gate array (FPGA) device offering a high logic density FPGA fabric with approximately 4.45 Mbits of embedded memory and 278 user I/Os in a compact 484‑BGA package. Designed for low-power, cost-sensitive designs, this device suits applications that require significant on-chip logic and memory integration in a commercial-temperature, surface-mount form factor.

Based on the Cyclone III device family architecture, this FPGA targets high-volume and low-power systems where integration, I/O capacity, and flexible clocking are important design drivers.

Key Features

  • Logic Capacity — 100,448 logic elements provide substantial on-chip programmable logic for complex glue logic, data-paths, and control functions.
  • Embedded Memory — Approximately 4.45 Mbits of embedded memory supports buffering, lookup tables, and on-chip data storage to reduce external memory needs.
  • I/O Resources — 278 user I/Os in a 484‑BGA footprint enable broad interface options for peripherals and high-pin-count system connections.
  • Power and Process — Cyclone III family emphasizes low-power operation; device supply operates from 1.15 V to 1.25 V to support power-optimized designs.
  • Clock Management — Family-level features include multiple PLLs for robust clock synthesis and management suitable for a range of system clocking needs.
  • Package and Mounting — 484‑ball FBGA (23×23) surface-mount package offers a compact, solderable footprint for automated assembly.
  • Operating Range — Commercial-grade operation from 0 °C to 85 °C, suitable for standard commercial applications and environments.
  • Standards and Compliance — RoHS compliant, supporting environmental and regulatory requirements for lead-free manufacturing.

Typical Applications

  • Portable and Handheld Systems — Low-power family characteristics help extend battery life while providing significant on-chip logic and memory for local processing.
  • Consumer and High-Volume Electronics — High logic density and integrated memory enable consolidation of functions to reduce BOM and lower system cost.
  • Interface and I/O‑Intensive Designs — High I/O count supports extensive peripheral connectivity and protocol interfacing in compact boards.
  • Clocked Data Paths and Signal Processing — On-chip PLLs and abundant logic resources support clock management and data-path implementation for multimedia or communications functions.

Unique Advantages

  • High Logic Density: 100,448 logic elements let you implement large state machines, parallel datapaths, and complex control logic on a single device, reducing external components.
  • Significant On‑Chip Memory: Approximately 4.45 Mbits of embedded RAM lowers dependency on external memory, simplifying board layout and improving throughput.
  • Large I/O Count in a Compact Package: 278 I/Os in a 484‑BGA package deliver extensive connectivity while retaining a small PCB footprint for space-constrained products.
  • Low-Voltage Operation: 1.15 V to 1.25 V supply enables power-efficient designs and helps meet tight power budgets.
  • Commercial Temperature Compatibility: Rated for 0 °C to 85 °C, providing predictable performance across standard commercial operating conditions.
  • RoHS Compliant: Supports lead-free assembly processes and compliance requirements for modern manufacturing.

Why Choose EP3CLS100F484C7N?

The EP3CLS100F484C7N positions itself as a high-density, low-power Cyclone III FPGA option for designers who need substantial on-chip logic and memory with a large I/O complement in a compact surface-mount package. Its combination of approximately 100k logic elements, roughly 4.45 Mbits of embedded memory, and 278 I/Os makes it suitable for consolidating system functions and lowering BOM in commercial applications.

Engineers building battery-conscious, high-volume, or I/O-constrained products will find this device provides the integration and clocking flexibility characteristic of the Cyclone III family while meeting standard commercial temperature and RoHS requirements.

Request a quote or submit your pricing and availability inquiry to initiate procurement and evaluate how EP3CLS100F484C7N can fit into your next design.

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