EP3CLS100F484C7N
| Part Description |
Cyclone® III Field Programmable Gate Array (FPGA) IC 278 4451328 100448 484-BGA |
|---|---|
| Quantity | 392 Available (as of October 7, 2026) |
| Product Category | Field Programmable Gate Array (FPGA) |
|---|---|
| Manufacturer | Intel |
| Manufacturing Status | Active |
| Manufacturer Standard Lead Time | 26 Weeks |
| Datasheet |
Specifications & Environmental
| Device Package | 484-FBGA (23x23) | Grade | Commercial | Operating Temperature | 0°C – 85°C | ||
|---|---|---|---|---|---|---|---|
| Package / Case | 484-BGA | Number of I/O | 278 | Voltage | 1.15 V - 1.25 V | ||
| Mounting Method | Surface Mount | RoHS Compliance | RoHS Compliant | REACH Compliance | REACH Unaffected | ||
| Moisture Sensitivity Level | 3 (168 Hours) | Number of LABs/CLBs | 6278 | Number of Logic Elements/Cells | 100448 | ||
| Number of Gates | N/A | ECCN | 3A991D | HTS Code | 8542.39.0001 | ||
| Qualification | N/A | Total RAM Bits | 4451328 |
Overview of EP3CLS100F484C7N – Cyclone® III FPGA, 100,448 logic elements, 484‑BGA
The EP3CLS100F484C7N is a Cyclone® III field-programmable gate array (FPGA) device offering a high logic density FPGA fabric with approximately 4.45 Mbits of embedded memory and 278 user I/Os in a compact 484‑BGA package. Designed for low-power, cost-sensitive designs, this device suits applications that require significant on-chip logic and memory integration in a commercial-temperature, surface-mount form factor.
Based on the Cyclone III device family architecture, this FPGA targets high-volume and low-power systems where integration, I/O capacity, and flexible clocking are important design drivers.
Key Features
- Logic Capacity — 100,448 logic elements provide substantial on-chip programmable logic for complex glue logic, data-paths, and control functions.
- Embedded Memory — Approximately 4.45 Mbits of embedded memory supports buffering, lookup tables, and on-chip data storage to reduce external memory needs.
- I/O Resources — 278 user I/Os in a 484‑BGA footprint enable broad interface options for peripherals and high-pin-count system connections.
- Power and Process — Cyclone III family emphasizes low-power operation; device supply operates from 1.15 V to 1.25 V to support power-optimized designs.
- Clock Management — Family-level features include multiple PLLs for robust clock synthesis and management suitable for a range of system clocking needs.
- Package and Mounting — 484‑ball FBGA (23×23) surface-mount package offers a compact, solderable footprint for automated assembly.
- Operating Range — Commercial-grade operation from 0 °C to 85 °C, suitable for standard commercial applications and environments.
- Standards and Compliance — RoHS compliant, supporting environmental and regulatory requirements for lead-free manufacturing.
Typical Applications
- Portable and Handheld Systems — Low-power family characteristics help extend battery life while providing significant on-chip logic and memory for local processing.
- Consumer and High-Volume Electronics — High logic density and integrated memory enable consolidation of functions to reduce BOM and lower system cost.
- Interface and I/O‑Intensive Designs — High I/O count supports extensive peripheral connectivity and protocol interfacing in compact boards.
- Clocked Data Paths and Signal Processing — On-chip PLLs and abundant logic resources support clock management and data-path implementation for multimedia or communications functions.
Unique Advantages
- High Logic Density: 100,448 logic elements let you implement large state machines, parallel datapaths, and complex control logic on a single device, reducing external components.
- Significant On‑Chip Memory: Approximately 4.45 Mbits of embedded RAM lowers dependency on external memory, simplifying board layout and improving throughput.
- Large I/O Count in a Compact Package: 278 I/Os in a 484‑BGA package deliver extensive connectivity while retaining a small PCB footprint for space-constrained products.
- Low-Voltage Operation: 1.15 V to 1.25 V supply enables power-efficient designs and helps meet tight power budgets.
- Commercial Temperature Compatibility: Rated for 0 °C to 85 °C, providing predictable performance across standard commercial operating conditions.
- RoHS Compliant: Supports lead-free assembly processes and compliance requirements for modern manufacturing.
Why Choose EP3CLS100F484C7N?
The EP3CLS100F484C7N positions itself as a high-density, low-power Cyclone III FPGA option for designers who need substantial on-chip logic and memory with a large I/O complement in a compact surface-mount package. Its combination of approximately 100k logic elements, roughly 4.45 Mbits of embedded memory, and 278 I/Os makes it suitable for consolidating system functions and lowering BOM in commercial applications.
Engineers building battery-conscious, high-volume, or I/O-constrained products will find this device provides the integration and clocking flexibility characteristic of the Cyclone III family while meeting standard commercial temperature and RoHS requirements.
Request a quote or submit your pricing and availability inquiry to initiate procurement and evaluate how EP3CLS100F484C7N can fit into your next design.

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