EP3CLS100F484I7
| Part Description |
Cyclone® III Field Programmable Gate Array (FPGA) IC 278 4451328 100448 484-BGA |
|---|---|
| Quantity | 547 Available (as of October 8, 2026) |
| Product Category | Field Programmable Gate Array (FPGA) |
|---|---|
| Manufacturer | Intel |
| Manufacturing Status | Active |
| Manufacturer Standard Lead Time | 26 Weeks |
| Datasheet |
Specifications & Environmental
| Device Package | 484-FBGA (23x23) | Grade | Industrial | Operating Temperature | -40°C – 100°C | ||
|---|---|---|---|---|---|---|---|
| Package / Case | 484-BGA | Number of I/O | 278 | Voltage | 1.15 V - 1.25 V | ||
| Mounting Method | Surface Mount | RoHS Compliance | RoHS non-compliant | REACH Compliance | REACH Unaffected | ||
| Moisture Sensitivity Level | 3 (168 Hours) | Number of LABs/CLBs | 6278 | Number of Logic Elements/Cells | 100448 | ||
| Number of Gates | N/A | ECCN | 3A991D | HTS Code | 8542.39.0001 | ||
| Qualification | N/A | Total RAM Bits | 4451328 |
Overview of EP3CLS100F484I7 – Cyclone® III Field Programmable Gate Array (FPGA) IC 278 4451328 100448 484-BGA
The EP3CLS100F484I7 is an Intel Cyclone III family FPGA offering high functionality with low-power operation and cost-effective integration. Built on the Cyclone III device architecture, this industrial-grade, surface-mount FPGA delivers large logic capacity, substantial embedded memory, and a high I/O count for mid- to high-density programmable logic designs.
Engineered for applications that require programmable logic, flexible I/O and low-power operation, this device suits industrial systems and other designs that benefit from significant on-chip resources and a compact 484-BGA package.
Key Features
- Logic Capacity 100,448 logic elements provide large-scale combinational and sequential logic resources for complex designs.
- Embedded Memory Approximately 4.45 Mbits of on-chip RAM (4,451,328 total RAM bits) to support buffering, FIFOs, and data storage without external memory.
- I/O Resources 278 user I/Os to accommodate multiple interfaces and parallel connections in compact system designs.
- Power and Voltage Operates from a core supply range of 1.15 V to 1.25 V, aligning with low-power device family characteristics.
- Packaging and Mounting 484-ball FBGA (23 × 23) package in a surface-mount form factor for dense PCB integration and reliable assembly.
- Industrial Temperature Range Qualified for operation from −40 °C to 100 °C to meet typical industrial environment requirements.
- Family-Level Capabilities Cyclone III family features include the low-power TSMC LP process, on-chip PLLs for clock management, and a broad set of supported I/O standards to simplify interface design.
- Compliance RoHS-compliant construction for regulatory and manufacturing compatibility.
Typical Applications
- Industrial Control Use the EP3CLS100F484I7 for motor control, PLC extensions, and real-time logic functions where wide temperature range and high I/O count are required.
- Communication Interfaces Implement protocol bridging, packet preprocessing, or interface adaptation leveraging the device’s abundant logic, embedded memory, and flexible I/Os.
- Data Acquisition and Processing On-chip RAM and large logic capacity enable buffering, signal conditioning, and preprocessing for sensors and measurement systems.
- Embedded System Integration Integrate custom logic or soft-core processors and use on-chip resources to reduce external components and simplify BOMs.
Unique Advantages
- High Logic and Memory Density: 100,448 logic elements paired with approximately 4.45 Mbits of embedded memory support complex, state-rich designs on a single device.
- Robust I/O Count: 278 I/Os enable multiple parallel interfaces and flexible connectivity without immediate need for external multiplexing.
- Industrial Reliability: Rated for −40 °C to 100 °C operation to meet the thermal demands of industrial deployments.
- Compact, Surface-Mount Packaging: 484-FBGA (23×23) package provides high-density integration for space-constrained PCBs.
- Low-Power Family Characteristics: Built on a low-power process with family-level power-aware design features to help manage system power budgets.
- Standards and Ecosystem Support: Leverages Cyclone III family capabilities such as PLL-based clock management and broad I/O standard support to accelerate system design.
Why Choose EP3CLS100F484I7?
The EP3CLS100F484I7 positions itself as a practical choice when designers need substantial on-chip logic and memory combined with a high I/O count in an industrial-temperature, surface-mount package. Its Cyclone III family heritage brings low-power operation and built-in system-level features that simplify clocking and interface tasks while reducing external component needs.
This device is well suited for engineering teams building industrial control systems, communications front-ends, data acquisition modules, and embedded systems that require a balance of integration, thermal robustness, and predictable supply-chain compliance.
Request a quote or submit an inquiry to start a conversation about pricing, availability, and integration support for the EP3CLS100F484I7.

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