EP3CLS100F484I7

IC FPGA 278 I/O 484FBGA
Part Description

Cyclone® III Field Programmable Gate Array (FPGA) IC 278 4451328 100448 484-BGA

Quantity 547 Available (as of October 8, 2026)
Product CategoryField Programmable Gate Array (FPGA)
ManufacturerIntel
Manufacturing StatusActive
Manufacturer Standard Lead Time26 Weeks
Datasheet

Specifications & Environmental

Device Package484-FBGA (23x23)GradeIndustrialOperating Temperature-40°C – 100°C
Package / Case484-BGANumber of I/O278Voltage1.15 V - 1.25 V
Mounting MethodSurface MountRoHS ComplianceRoHS non-compliantREACH ComplianceREACH Unaffected
Moisture Sensitivity Level3 (168 Hours)Number of LABs/CLBs6278Number of Logic Elements/Cells100448
Number of GatesN/AECCN3A991DHTS Code8542.39.0001
QualificationN/ATotal RAM Bits4451328

Overview of EP3CLS100F484I7 – Cyclone® III Field Programmable Gate Array (FPGA) IC 278 4451328 100448 484-BGA

The EP3CLS100F484I7 is an Intel Cyclone III family FPGA offering high functionality with low-power operation and cost-effective integration. Built on the Cyclone III device architecture, this industrial-grade, surface-mount FPGA delivers large logic capacity, substantial embedded memory, and a high I/O count for mid- to high-density programmable logic designs.

Engineered for applications that require programmable logic, flexible I/O and low-power operation, this device suits industrial systems and other designs that benefit from significant on-chip resources and a compact 484-BGA package.

Key Features

  • Logic Capacity  100,448 logic elements provide large-scale combinational and sequential logic resources for complex designs.
  • Embedded Memory  Approximately 4.45 Mbits of on-chip RAM (4,451,328 total RAM bits) to support buffering, FIFOs, and data storage without external memory.
  • I/O Resources  278 user I/Os to accommodate multiple interfaces and parallel connections in compact system designs.
  • Power and Voltage  Operates from a core supply range of 1.15 V to 1.25 V, aligning with low-power device family characteristics.
  • Packaging and Mounting  484-ball FBGA (23 × 23) package in a surface-mount form factor for dense PCB integration and reliable assembly.
  • Industrial Temperature Range  Qualified for operation from −40 °C to 100 °C to meet typical industrial environment requirements.
  • Family-Level Capabilities  Cyclone III family features include the low-power TSMC LP process, on-chip PLLs for clock management, and a broad set of supported I/O standards to simplify interface design.
  • Compliance  RoHS-compliant construction for regulatory and manufacturing compatibility.

Typical Applications

  • Industrial Control  Use the EP3CLS100F484I7 for motor control, PLC extensions, and real-time logic functions where wide temperature range and high I/O count are required.
  • Communication Interfaces  Implement protocol bridging, packet preprocessing, or interface adaptation leveraging the device’s abundant logic, embedded memory, and flexible I/Os.
  • Data Acquisition and Processing  On-chip RAM and large logic capacity enable buffering, signal conditioning, and preprocessing for sensors and measurement systems.
  • Embedded System Integration  Integrate custom logic or soft-core processors and use on-chip resources to reduce external components and simplify BOMs.

Unique Advantages

  • High Logic and Memory Density: 100,448 logic elements paired with approximately 4.45 Mbits of embedded memory support complex, state-rich designs on a single device.
  • Robust I/O Count: 278 I/Os enable multiple parallel interfaces and flexible connectivity without immediate need for external multiplexing.
  • Industrial Reliability: Rated for −40 °C to 100 °C operation to meet the thermal demands of industrial deployments.
  • Compact, Surface-Mount Packaging: 484-FBGA (23×23) package provides high-density integration for space-constrained PCBs.
  • Low-Power Family Characteristics: Built on a low-power process with family-level power-aware design features to help manage system power budgets.
  • Standards and Ecosystem Support: Leverages Cyclone III family capabilities such as PLL-based clock management and broad I/O standard support to accelerate system design.

Why Choose EP3CLS100F484I7?

The EP3CLS100F484I7 positions itself as a practical choice when designers need substantial on-chip logic and memory combined with a high I/O count in an industrial-temperature, surface-mount package. Its Cyclone III family heritage brings low-power operation and built-in system-level features that simplify clocking and interface tasks while reducing external component needs.

This device is well suited for engineering teams building industrial control systems, communications front-ends, data acquisition modules, and embedded systems that require a balance of integration, thermal robustness, and predictable supply-chain compliance.

Request a quote or submit an inquiry to start a conversation about pricing, availability, and integration support for the EP3CLS100F484I7.

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