EP3CLS100F780C7N

The EP3CLS100F780C7N is a Cyclone III family FPGA manufactured by Intel, delivering high integration for low-power, cost-sensitive designs. This device combines a large logic fabric with substantial embedded memory and a high I/O count to support complex system functions within a compact BGA package.

Built on the Cyclone III device family architecture, the device targets applications that require low power consumption, flexible I/O, and on-chip memory and clock-management resources. It is supplied in a 780‑ball FBGA (29×29) surface-mount package and is rated for commercial operating temperatures.

Key Features

• Logic Capacity  100,448 logic elements provide a large on-chip fabric for implementing complex logic, glue, and control functions.
• Embedded Memory  Approximately 4.45 Mbits of on-chip RAM to support buffering, packet processing, and state storage without external memory.
• I/O Density  413 user I/Os in a single device to support wide parallel interfaces and multiple peripherals.
• Clock Management  Cyclone III family devices include integrated PLL resources for robust clock synthesis and distribution (family-level feature).
• Low-Voltage Operation  Core supply range from 1.15 V to 1.25 V to support low-power system designs.
• Package & Mounting  780‑FBGA (29×29) surface-mount package for a compact board footprint and reliable solder attach.
• Commercial Grade Temperature  Rated for 0 °C to 85 °C operation suitable for general-purpose commercial applications.
• RoHS Compliant  Meets RoHS environmental requirements.

Typical Applications

• Portable and Handheld Devices  Low-power family characteristics and compact packaging help extend battery life and reduce cooling needs in portable electronics.
• Consumer and Embedded Systems  High logic and memory density enable integration of user interfaces, protocol handling, and data processing in consumer products.
• Communications and Networking  Large I/O count and on-chip RAM are suitable for packet buffering, protocol bridging, and interface aggregation tasks.
• System Control and Glue Logic  Use the device's programmable fabric to consolidate discrete controllers, timing logic, and peripheral interfaces.

Unique Advantages

• High Logic Integration: 100,448 logic elements reduce the need for multiple devices, simplifying board design and lowering BOM count.
• Substantial On-Chip Memory: Approximately 4.45 Mbits of embedded RAM enables local buffering and fast data-path implementations without relying on external memory.
• Extensive I/O Resources: 413 I/Os provide flexibility for parallel buses, high-pin-count interfaces, and mixed-signal front-end connections.
• Compact, Manufacturable Package: 780‑FBGA (29×29) surface-mount package offers a dense footprint with standard assembly compatibility.
• Low-Voltage, Low-Power Operation: 1.15–1.25 V core supply and Cyclone III family power optimizations support energy-efficient system design.
• Environmentally Compliant: RoHS compliance aligns component selection with environmental and regulatory goals.

Why Choose EP3CLS100F780C7N?

The EP3CLS100F780C7N places high-density logic, meaningful embedded memory, and a large I/O complement into a compact 780‑ball FBGA package, making it a practical choice for designers balancing integration, power, and board space. Its commercial temperature rating and low-voltage core leverage Cyclone III family characteristics aimed at low-power, cost-sensitive applications.

This device is suited for engineering teams building consumer, portable, and communication systems that require scalable logic resources, on-chip RAM, and flexible I/O options while remaining RoHS compliant and manufacturable in standard surface-mount processes.

Request a quote or submit a product inquiry to obtain pricing and availability for the EP3CLS100F780C7N.