EP3CLS100F780C8N

The EP3CLS100F780C8N is a Cyclone® III family Field Programmable Gate Array (FPGA) in a 780-ball FBGA package. It delivers high logic density and on-chip memory for cost- and power-sensitive designs where integration and flexible I/O are important.

Built for low-power, high-functionality applications, this commercial-grade device is suited for portable and handheld systems, communications and networking functions, and embedded processing tasks that require substantial logic resources and flexible clocking.

Key Features

• Core Architecture Cyclone III device family design focused on low power and high functionality; silicon and software features reduce power consumption.
• Logic Capacity 100,448 logic elements to implement large-scale combinational and sequential logic networks.
• Embedded Memory Approximately 4.45 Mbits of embedded memory for buffering, FIFOs, and on-chip data storage.
• I/O Density 413 user I/Os to support complex external interfaces and board-level connectivity.
• Clock Management Device family includes multiple phase-locked loops (PLLs) for robust clock synthesis and distribution (family feature).
• Power and Supply Operates from a core voltage supply range of 1.15 V to 1.25 V and leverages low-power process technology.
• Package & Mounting 780-FBGA (29 × 29) surface-mount package for compact, high-density PCB integration.
• Operating Range & Grade Commercial temperature grade with an operating range of 0 °C to 85 °C; RoHS compliant.

Typical Applications

• Portable and Handheld Devices Low-power operation and significant on-chip memory make the device suitable for battery-operated systems requiring extended run time.
• Communications & Networking High logic density and abundant I/Os allow implementation of protocol processing, packet buffering, and interface bridging.
• Embedded Processing Substantial logic and memory resources support custom accelerators and soft-core processors for application-specific tasks.
• Instrumentation & Test Equipment Flexible I/O and clocking capabilities enable precise timing, data capture, and signal conditioning functions.

Unique Advantages

• High integration: 100,448 logic elements and approximately 4.45 Mbits of embedded memory reduce reliance on external components and simplify board design.
• Low-power architecture: Family-level optimizations and low-power process technology support energy-sensitive applications and thermal constraints.
• Rich I/O resource: 413 user I/Os provide the flexibility to connect multiple peripherals and high-pin-count interfaces without external multiplexing.
• Flexible clocking: Family features include multiple PLLs for clock synthesis and distribution to meet diverse timing requirements.
• Compact package: 780-FBGA (29×29) surface-mount package enables high-density PCB layouts for space-constrained designs.
• Commercial-grade compliance: Rated for 0 °C to 85 °C operation and RoHS compliant for standard commercial deployments.

Why Choose EP3CLS100F780C8N?

The EP3CLS100F780C8N positions itself as a strong option for designers who need a balance of high logic capacity, substantial on-chip memory, and low-power operation in a compact FBGA package. Its combination of 100,448 logic elements, roughly 4.45 Mbits of embedded RAM, and 413 I/Os supports complex, integrated designs where minimizing external components and conserving power matter.

This Cyclone III device is aimed at teams building volume-focused, cost-sensitive products that require robust logic resources, flexible clocking, and wide I/O capability while operating within standard commercial temperature limits.

Request a quote or submit a product inquiry to begin evaluation and procurement of EP3CLS100F780C8N for your next design project.