EP3CLS100U484C7N

The EP3CLS100U484C7N is an Intel Cyclone® III family FPGA offering a mid-to-high density, low-power programmable logic solution. Based on TSMC low-power (LP) process technology and the Cyclone III device architecture, this device combines a large number of logic elements and embedded memory with on-chip clocking and flexible I/O for cost-sensitive, power-aware designs.

Typical market segments include portable and handheld systems, embedded controllers, and high-volume applications that require substantial logic capacity, significant embedded RAM, and a compact 484‑FBGA package. The device targets designs needing integration of logic, memory, and programmable I/O while operating within commercial temperature and low-voltage supply ranges.

Key Features

• Logic Capacity  Provides 100,448 logic elements to implement complex programmable logic and control functions.
• Embedded Memory  Approximately 4.45 Mbits of on-chip RAM to support frame buffers, FIFOs, and data buffering without external memory.
• I/O Density  278 user I/Os to support multiple interfaces and peripheral connections in a single device.
• Clock Management  Device family features include up to four phase-locked loops (PLLs) for flexible clock generation and distribution.
• Low-Power Process  Built on TSMC low-power process technology to help minimize static power consumption for battery-powered and thermally constrained systems.
• I/O Standards and Signal Integrity  Family-level support for multiple I/O standards and adjustable I/O slew rates to help integrate diverse interfaces and improve signal quality.
• Power Supply  Core voltage supply range: 1.15 V to 1.25 V, enabling standard low-voltage FPGA operation.
• Package and Mounting  484‑FBGA (484‑UBGA 19×19) surface-mount package for compact board-level integration.
• Operating Range  Commercial-grade operating temperature from 0 °C to 85 °C.
• Compliance  RoHS compliant.

Typical Applications

• Portable and Handheld Devices  Leverages low-power process technology and on-chip resources to extend battery life while integrating control and interface logic.
• Embedded Control and Processing  Large logic capacity and embedded RAM enable custom control engines, protocol handling, and data buffering without extensive external components.
• High-Volume, Cost-Sensitive Products  A Cyclone III family member targeted at designs that require balanced functionality and low per-unit cost for large production runs.
• System Integration  High I/O count and flexible clocking make the device suitable for consolidating multiple discrete components into a single FPGA-based solution.

Unique Advantages

• Substantial Logic and Memory in a Single Device:  100,448 logic elements paired with approximately 4.45 Mbits of embedded RAM reduces the need for external logic and memory, simplifying bill of materials.
• Compact Board Footprint:  484‑FBGA package allows dense integration on space-constrained PCBs while providing a high I/O count.
• Low-Voltage, Low-Power Operation:  TSMC LP process and a 1.15–1.25 V supply window help control power consumption for portable and thermally limited systems.
• Flexible Clocking:  Multiple PLLs enable robust clock management for on-chip and system-level timing without external clocking ICs.
• Broad I/O Flexibility:  Family-level support for numerous I/O standards and adjustable slew rates helps interface directly with a wide range of peripherals and signaling types.
• Regulatory and Assembly Readiness:  Surface-mount FBGA package and RoHS compliance support modern manufacturing and environmental requirements.

Why Choose EP3CLS100U484C7N?

The EP3CLS100U484C7N combines large programmable logic capacity, substantial on-chip RAM, and a high I/O count in a compact 484‑FBGA package. Its foundation on a low-power process and Cyclone III family architecture delivers a balance of integration, power efficiency, and flexible system-level features that suit embedded, portable, and high-volume applications.

This device is well suited for design teams looking to consolidate logic and memory into a single FPGA, reduce external components, and deploy solutions across commercial-temperature environments with vendor-backed architecture and ecosystem support from the Cyclone III family.

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