EP3CLS100U484I7N

The EP3CLS100U484I7N is a Cyclone® III family field-programmable gate array (FPGA) from Intel, offering a high-capacity, low-power programmable logic option in a 484-FBGA package. It combines large logic capacity, substantial on-chip memory, and a high I/O count for designs that require integration and flexibility in industrial temperature environments.

Designed for cost- and power-sensitive systems, this device targets applications that benefit from significant embedded memory, multi-domain clocking, and configurable I/O while operating from a 1.15 V to 1.25 V core supply and across an extended temperature range.

Key Features

• Large logic capacity — 100,448 logic elements enable complex designs and substantial logic integration on a single device.
• Embedded memory — approximately 4.45 Mbits of on-chip RAM for data buffering, state machines, and local storage.
• High I/O count — 278 user I/Os to support wide parallel interfaces, multiple peripherals, and flexible board-level connectivity.
• Multi-clock support — Cyclone III family devices provide up to four PLLs per device for robust clock management and synthesis across domains.
• Low-power device family characteristics — built on TSMC low-power process technology and power-aware design techniques to support energy-conscious designs.
• Supply and mounting — operates from a 1.15 V to 1.25 V core supply and is available in a 484-FBGA (484-UBGA, 19×19) surface-mount package.
• Industrial temperature grade — specified for operation from −40 °C to 100 °C for deployment in thermally demanding environments.
• Standards and configuration support (family-level) — Cyclone III family documentation describes support for a wide range of I/O standards and configurable I/O characteristics to help meet signal-integrity and system interfacing requirements.
• RoHS compliant — conforms to RoHS requirements for lead-free manufacturing.

Typical Applications

• Portable and handheld devices — low-power family characteristics help extend battery life and reduce cooling needs in compact systems.
• High-volume, cost-sensitive products — Cyclone III family positioning supports applications where minimizing BOM cost and power consumption is important.
• Industrial control and instrumentation — extended operating temperature range and robust I/O count allow deployment in thermally-challenged and I/O-dense systems.
• Embedded processing and glue logic — ample logic elements and on-chip RAM enable integration of control functions, state machines, and soft-processor subsystems.

Unique Advantages

• High integration density: 100,448 logic elements and substantial embedded memory reduce the need for external components and simplify PCB designs.
• Scalable on-chip memory: Approximately 4.45 Mbits of RAM supports buffering, packet processing, and local data storage without external SRAM/DRAM.
• Flexible I/O routing: 278 I/Os provide headroom for wide parallel buses, multiple interfaces, and complex board-level connectivity.
• Clock management: Multiple PLLs per Cyclone III device enable clean clock domain partitioning and synthesis for mixed-frequency systems.
• Industrial thermal range: Specified operation from −40 °C to 100 °C for reliable operation in demanding field environments.
• Compliance and manufacturability: Surface-mount 484-FBGA package and RoHS compliance support current production assembly and environmental requirements.

Why Choose EP3CLS100U484I7N?

The EP3CLS100U484I7N brings a combination of high logic capacity, significant embedded memory, and a large I/O complement in a compact 484-FBGA surface-mount package. Its alignment with the Cyclone III family makes it suitable for designers focused on reducing BOM complexity while meeting tight power and thermal envelopes.

This device is well suited to engineers building industrial, portable, and high-volume products that require programmable logic density, robust clocking options, and reliable operation across an extended temperature range. The family-level feature set and available on-chip resources provide a pathway to scalable designs and long-term maintainability.

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