EP3CLS100U484C8N

The EP3CLS100U484C8N is an Intel Cyclone® III family FPGA supplied in a 484-ball FBGA package for surface-mount applications. It delivers a high logic capacity and substantial on-chip memory with a wide I/O count, targeting high-volume, low-power, cost-sensitive designs.

Built around the Cyclone III device family architecture, this device is positioned for designs that require large programmable logic resources, multiple I/Os, and efficient power operation within a commercial temperature range.

Key Features

• Programmable Logic Capacity — 100,448 logic elements provide a large fabric for complex glue logic, custom processing, and system integration.
• Embedded Memory — Approximately 4.45 Mbits of on-chip RAM to support buffering, LUT-based storage, and local data processing without external memory.
• I/O Count and Flexibility — 278 user I/Os delivered in a 484-FBGA (484-UBGA, 19×19) footprint for dense board-level integration and extensive peripheral interfacing.
• Power and Voltage — Core voltage supply range of 1.15 V to 1.25 V, aligning with low-power FPGA operation for energy-sensitive applications.
• Clock Management — Cyclone III family devices provide multi-PLL clock management features for robust clock synthesis and distribution (family-level feature).
• Security and Reliability (Family-Level) — The Cyclone III family documentation notes security and reliability features available in LS variants, including configuration encryption and design separation flows (family-level capability).
• Package & Mounting — Surface-mount 484-FBGA package suited for compact PCB designs and automated assembly.
• Commercial Grade Temperature — Rated for operation from 0 °C to 85 °C for typical commercial applications.
• RoHS Compliant — Conforms to RoHS requirements for hazardous substance restrictions.

Typical Applications

• Portable and Handheld Electronics — Low-power device family characteristics help extend battery life and reduce cooling requirements in portable designs.
• User Interface and I/O-Intensive Systems — High I/O count supports complex user interfaces, multi-protocol bridges, and board-level aggregation of peripherals.
• Embedded Processing and Custom Logic — Large logic element count and on-chip memory enable custom hardware acceleration, protocol handling, and embedded-processing tasks.
• High-Volume, Cost-Sensitive Products — Cyclone III family positioning and package options make this device suitable for designs targeting volume production with tight cost and power budgets.

Unique Advantages

• High Logic Density: 100,448 logic elements provide ample capacity to consolidate functions and reduce external components.
• Substantial Embedded Memory: Approximately 4.45 Mbits of RAM reduces reliance on external memory for buffering and intermediate storage.
• Extensive I/O Resources: 278 I/Os in a compact 484-FBGA package simplify board routing and support multiple interfaces without external multiplexing.
• Low-Power Operation: Family-level low-power process technology and a narrow core voltage range support energy-efficient system designs.
• Commercial Temperature Suitability: 0 °C to 85 °C rating matches many consumer and industrial-adjacent applications that do not require industrial-grade qualification.
• RoHS Compliance: Meets environmental restrictions for modern product manufacturing and supply chains.

Why Choose EP3CLS100U484C8N?

The EP3CLS100U484C8N combines a large programmable fabric with significant embedded memory and a high I/O count in a compact 484-FBGA package, making it a practical choice for designers who need to integrate substantial logic and interfaces while managing power and cost. Its commercial temperature rating and RoHS compliance suit mainstream consumer and volume-market systems that benefit from the Cyclone III family’s low-power and integration-oriented features.

Designers building user-facing products, embedded processing platforms, or I/O-rich subsystems will find the balance of logic capacity, on-chip memory, and package density conducive to simplifying bill-of-materials and board-level complexity.

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